Abstract: A method of manufacture of an integrated circuit packaging system includes: providing an integrated circuit die having an active side and a passive side; providing a contact pad having a top side oriented in a same direction as the passive side; connecting an inner bond wire to the contact pad and the integrated circuit die; and molding a stacking structure around the contact pad, the inner bond wire, and the integrated circuit die with the passive side and the top side exposed, and the stacking structure having a top structure surface on top and adjacent to or below the integrated circuit die, and a horizontal member under the integrated circuit die and forming a cavity.

Abstract: An integrated circuit package system includes a trace frame includes: an encapsulant; a first series of bonding pads along a length of the encapsulant; a second series of the bonding pads along a width of the encapsulant; conductive traces for connecting the bonding pads of the first series to the bonding pads of the second series in a one to one correspondence; and a first integrated circuit die on the encapsulant and on the conductive traces that extend beyond the first integrated circuit die.

Abstract: An integrated circuit package system comprising forming a trace frame including: fabricating a sacrificial substrate; forming a first series of bonding pads along a length of the sacrificial substrate; forming a second series of the bonding pads along a width of the sacrificial substrate; forming conductive traces for connecting the bonding pads of the first series to the bonding pads of the second series in a one to one correspondence; and removing the sacrificial substrate.

Abstract: A method for manufacture of an integrated circuit package system includes: providing a leadframe with an integrated circuit mounted thereover; encapsulating the integrated circuit with an encapsulation; mounting an etch barrier below the leadframe; and etching the leadframe.

Abstract: A method of manufacture of an integrated circuit packaging system includes: providing an internal structure substrate having an internal structure substrate cavity; mounting an internal structure die above the internal structure substrate; encapsulating the internal structure die with an internal structure encapsulation to form an internal structure package; forming an internal structure protrusion in the internal structure encapsulation below the internal structure substrate cavity; mounting the internal structure package above a substrate; and encapsulating the internal structure package above the substrate with an encapsulation.

Abstract: An integrated circuit package system including: providing a leadframe with an integrated circuit mounted thereover; encapsulating the integrated circuit with an encapsulation; mounting an etch barrier below the leadframe; and etching the leadframe.

Abstract: A method of manufacture of an integrated circuit packaging system includes: providing a base package substrate; mounting a flip chip integrated circuit die on the base package substrate; applying a flip chip protective layer on the flip chip integrated circuit die including covering only a back side of the flip chip integrated circuit die; and mounting an upper package on the base package substrate including positioning an upper package substrate adjacent to the flip chip protective layer.

Abstract: A stacked integrated circuit package system includes: mounting a first integrated circuit over a first carrier; mounting a second integrated circuit package system having a second carrier with an intra-stack interconnect attached thereto and with the intra-stack interconnect over the first carrier and the first integrated circuit; and forming an intra-stack encapsulation between the first carrier and the second carrier surrounding the intra-stack interconnect.

Abstract: An integrated circuit package system including providing a plurality of substantially identical package leads formed in a single row, and attaching bond wires having an offset on adjacent locations of the package leads.

Abstract: A method of manufacture of an integrated circuit packaging system includes: providing a first stack layer including a first device over a first substrate, the first device including a through silicon via; configuring a second stack layer over the first stack layer, the second stack layer including an analog device; configuring a third stack layer over the second stack layer; and encapsulating the integrated circuit packaging system.

Abstract: A method of manufacture of an integrated circuit packaging system includes: providing an internal structure substrate having an internal structure substrate cavity; mounting an internal structure die above the internal structure substrate; encapsulating the internal structure die with an internal structure encapsulation to form an internal structure package; forming an internal structure protrusion in the internal structure encapsulation below the internal structure substrate cavity; mounting the internal structure package above a substrate; and encapsulating the internal structure package above the substrate with an encapsulation.

Abstract: An integrated circuit package system that includes: providing an electrical interconnect system including a support structure and a lead-finger system; stacking a first device over the support structure; stacking a second device over the first device; connecting the first device and the second device to the lead-finger system; stacking a dummy device over the second device; and exposing a support structure bottom side and a dummy device top side for thermal dissipation.

Abstract: A stacked integrated circuit package system includes: mounting a first integrated circuit over a first carrier; mounting a second integrated circuit package system having a second carrier with an intra-stack interconnect attached thereto and with the intra-stack interconnect over the first carrier and the first integrated circuit; and forming an intra-stack encapsulation between the first carrier and the second carrier surrounding the intra-stack interconnect.

Abstract: An integrated circuit package system includes: providing a heat spreader; attaching an upper substrate to the heat spreader, the upper substrate having an upper through-opening provided therein; attaching a top semiconductor die to the heat spreader through the upper through-opening, the top semiconductor die having a top die interconnect to the upper substrate; attaching a base substrate to the upper substrate, the base substrate having a base through-opening provided therein larger than the upper through-opening; and attaching an external interconnect connected to the base substrate.

Abstract: An integrated circuit package system including: providing a leadframe with an integrated circuit mounted thereover; encapsulating the integrated circuit with an encapsulation; mounting an etch barrier below the leadframe; and etching the leadframe.

Abstract: An integrated circuit package system includes forming an integrated circuit stack having a bottom non-active side and a top non-active side; connecting an internal interconnect between a lead, having a top side and a bottom side, and the integrated circuit stack; and forming an encapsulation, having both a non-elevated portion and an elevated portion, around the integrated circuit stack and the internal interconnect with the top side exposed at the non-elevated portion, and with the bottom side, the bottom non-active side, and the top non-active side exposed.

Abstract: An integrated circuit package system that includes: providing an electrical interconnect system including a support structure and a lead-finger system; stacking a first device over the support structure; stacking a second device over the first device; connecting the first device and the second device to the lead-finger system; stacking a dummy device over the second device; and exposing a support structure bottom side and a dummy device top side for thermal dissipation.

Abstract: An integrated circuit package system comprising forming a trace frame including: fabricating a sacrificial substrate; forming a first series of bonding pads along a length of the sacrificial substrate; forming a second series of the bonding pads along a width of the sacrificial substrate; forming conductive traces for connecting the bonding pads of the first series to the bonding pads of the second series in a one to one correspondence; and removing the sacrificial substrate.

Abstract: An integrated circuit package system including providing a plurality of substantially identical package leads formed in a single row, and attaching bond wires having an offset on adjacent locations of the package leads.