Patents by Inventor Byoung-Young Lee

Byoung-Young Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250058506
    Abstract: The present disclosure provides an injection molding apparatus including a first mold, a second mold configured to be relatively movable toward or away from the first mold and define a cavity for forming a molded body collectively with the first mold, a stripper provided between the first mold and the second mold and configured to separate the molded body from the first mold, a first cotter block provided on the stripper, and a second cotter block provided on the second mold, configured to be rollable relative to the first cotter block, and configured to align the second mold with the first mold collectively with the first cotter block, thereby obtaining an advantageous effect of reducing a defect rate related to the molded body and improving quality and productivity.
    Type: Application
    Filed: November 7, 2023
    Publication date: February 20, 2025
    Inventors: Kyu Young LEE, Suk Joo HONG, Jung Hwan PARK, Eui Hwan SON, Min Woo CHU, Byoung Jin KWON, Ji Hun KIM
  • Patent number: 7258233
    Abstract: This invention relates to a package for packing a wiper blade for a vehicle. The package is constituted of upper and lower cases, in which the upper case is partly opened from and closed again to the lower case. Thus, the package can be conveniently used again.
    Type: Grant
    Filed: December 3, 2003
    Date of Patent: August 21, 2007
    Assignee: Hyundai Mobis Co., Ltd.
    Inventor: Byoung-Young Lee
  • Publication number: 20050082185
    Abstract: This invention relates to a package for packing a wiper blade for a vehicle. The package is constituted of upper and lower cases, in which the upper case is partly opened from and closed again to the lower case. Thus, the package can be conveniently used again.
    Type: Application
    Filed: December 3, 2003
    Publication date: April 21, 2005
    Applicant: HYUNDAI MOBIS CO., LTD.
    Inventor: Byoung-Young Lee
  • Patent number: RE50289
    Abstract: Provided is a light unit including a plurality of LED light sources formed on a PCB, a resin layer stacked on the PCB to diffuse and guide emitted light forwards, and a diffusion plate having an optical pattern printed thereon to shield light emitted from the LED light sources. The optical pattern is composed of a diffusion pattern implemented as at least one layer, or a combination of the diffusion pattern layer and a light shielding pattern. The light unit forms an optical pattern for shielding or diffusing light on a surface of a light diffusion plate of the back-light unit, and combines a diffusion pattern and a metal pattern to attain uniformity of light and realize a yellow-light shielding effect, thus leading to a reliable light quality.
    Type: Grant
    Filed: August 16, 2021
    Date of Patent: February 4, 2025
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Kwang Ho Park, Woo Young Chang, Chul Hong Kim, Byoung Eon Lee