Abstract: Provided are a nozzle having a double pipe structure in which multi-suck-back is possible without driving a nozzle arm, and also, a reduced resist consumption (RRC) operation and a nozzle tip rinsing operation are possible without moving the nozzle arm, and a photoresist (PR) dispenser and a spin coater, each including the nozzle. The nozzle includes an inner pipe having a conical shape gradually narrowing downward, through which PR is transferred, and having a tip through which the PR is ejected, and an outer pipe surrounding the inner pipe, having a conical shape gradually narrowing downward, through which thinner is transferred, and having a tip through which the thinner is ejected, wherein the nozzle is coupled to a nozzle arm and moved, and multi-suck-back is performed without driving the nozzle arm.

Abstract: The inventive concept relates to a liquid dispensing nozzle and an apparatus for treating a substrate. The liquid dispensing nozzle includes a first fluid channel that is formed in the nozzle and through which a processing liquid flows and a second fluid channel in communication with the first fluid channel, the second fluid channel being connected to a dispensing end of the nozzle. The second fluid channel has a larger width than the first fluid channel, and a central axis of the first fluid channel and a central axis of the second fluid channel are connected with each other in a straight line.

Abstract: A method for lifting a substrate includes raising the substrate off a support plate having the substrate placed thereon, by using a lift pin, in which the lift pin raises the substrate off the support plate while vertically moving between a lowered position spaced apart downward from the support plate by a first distance and a raised position spaced apart upward from the support plate by a second distance, and the lift pin is brought into contact with the substrate in an interval in which the lift pin is decelerated or moved at a constant velocity.

Abstract: The inventive concept relates to a liquid dispensing nozzle and an apparatus for treating a substrate. The liquid dispensing nozzle includes a first fluid channel that is formed in the nozzle and through which a processing liquid flows and a second fluid channel in communication with the first fluid channel, the second fluid channel being connected to a dispensing end of the nozzle. The second fluid channel has a larger width than the first fluid channel, and a central axis of the first fluid channel and a central axis of the second fluid channel are connected with each other in a straight line.

Abstract: The inventive concept relates to a substrate processing method and apparatus for providing a plurality of gas layers and contamination prevention liquid layers in a nozzle after the nozzle dispenses photoresist onto a substrate, thereby preventing photoresist in the nozzle from making contact with air and thus preventing the photoresist in the nozzle from being solidified by a reaction of the photoresist with air.

Abstract: An ion trap device includes a substrate over which at least one central DC electrode, an RF electrode and at least one side electrode are disposed. The central DC electrode includes a DC connector pad and a DC rail connected to the DC connector pad. The RF electrode includes at least one RF rail located adjacent to the DC rail and an RF pad connected to the at least one RF rail. The RF electrode is disposed between the central DC electrode and the side electrode. At least one pair of electrodes among the central DC electrode, the RF electrode and the side electrode have round corners facing each other.

Abstract: An ion trap device includes a substrate over which at least one central DC electrode, an RF electrode and at least one side electrode are disposed. The central DC electrode includes a DC connector pad and a DC rail connected to the DC connector pad. The RF electrode includes at least one RF rail located adjacent to the DC rail and an RF pad connected to the at least one RF rail. The RF electrode is disposed between the central DC electrode and the side electrode. At least one pair of electrodes among the central DC electrode, the RF electrode and the side electrode have round corners facing each other.