Abstract: There is provided a multichip ray tracing device. The multichip ray tracing device includes a plurality of memory units; an acceleration structure division processing unit that divides an acceleration structure (AS) into a plurality of divided acceleration structures and stores each of the plurality of divided acceleration structures in a corresponding memory unit among the plurality of memory units; and a plurality of ray tracing core units connected to the plurality of memory units. Each of the plurality of ray tracing core units performs an internal ray tracing (Internal RT) operation for a corresponding divided acceleration structure and transmits corresponding ray information to a corresponding ray tracing core unit to perform an external ray tracing (External RT) operation when attempting to access a data node that is not in the corresponding divided acceleration structure in the process of the internal ray tracing operation.

Abstract: This application relates to a ray tracing apparatus and the apparatus includes a main ray tracing unit configured to generate an acceleration structure (AS) and configured to transmit scene data to perform a ray tracing operation for a part of the scene data and a plurality of sub ray tracing units being coupled in series, each except for a last sub ray tracing unit configured to relay the scene data to a next sub ray tracing unit and configured to perform a ray tracing operation on a different part of the scene data. Therefore, the ray tracing apparatus may include a plurality of chips to process a rendering for a 3-dimensional image in real time.

Abstract: Semiconductor die packages are disclosed. An exemplary semiconductor die package includes a premolded substrate. The premolded substrate can have a semiconductor die attached to it, and an encapsulating material may be disposed over the semiconductor die.

Abstract: A card-type information recording medium having an embedded antenna for NFC communication is provided. The card-type information recording medium includes: a PCB that has a loop antenna pattern and a routing pattern formed on the top surface and the bottom surface thereof through the use of an etching process; an NFC communication unit and a USIM card unit that are horizontally mounted on the top of the PCB; and a molding material that is formed on the top of the PCB to cover the NFC communication unit and the USIM card unit. Accordingly, it is possible to perform functions of NFC and RFID read/tag by only mounting a USIM device thereon without adding any module or any constituent having an antenna function to a mobile terminal.

Abstract: A card-type information recording medium including a PCB that has a loop antenna pattern and a routing pattern formed on the top surface and the bottom surface thereof through the use of an etching process, an NFC communication unit and a USIM card unit that are horizontally mounted on the top of the PCB, and a molding material that is formed on the top of the PCB so as to cover the NFC communication unit and the USIM card unit.

Abstract: A metal tab die attach paddle (DAP) disposed between the lead frame and a power device die in a power device package reduces the stress exerted on the semiconductor power device die caused by the different coefficients of thermal expansion (CTE) of the semiconductor power device die and the lead frame. In addition the power device package substantially prevents impurities from penetrating into the power device package by increasing the surface creepage distance of a sealant resulting from the metal tab DAP and an optional swaging of the lead frame.

Abstract: A card-type information recording medium including a PCB that has a loop antenna pattern and a routing pattern formed on the top surface and the bottom surface thereof through the use of an etching process, an NFC communication unit and a USIM card unit that are horizontally mounted on the top of the PCB, and a molding material that is formed on the top of the PCB so as to cover the NFC communication unit and the USIM card unit.

Abstract: Semiconductor die packages are disclosed. An exemplary semiconductor die package includes a premolded substrate. The premolded substrate can have a semiconductor die attached to it, and an encapsulating material may be disposed over the semiconductor die.

Abstract: Semiconductor die packages are disclosed. An exemplary semiconductor die package includes a premolded substrate. The premolded substrate can have a semiconductor die attached to it, and an encapsulating material may be disposed over the semiconductor die.

Abstract: A semiconductor package including a package substrate; a semiconductor chip on the package substrate; a first via contact on the package substrate; a second via contact on the semiconductor chip; a metal wiring, which is arranged on the first via contact and the second via contact and interconnects the first via contact and the second via contact; a first encapsulating material which is arranged between the metal wiring and the package substrate and encapsulates the semiconductor chip, the first via contact, and the second via contact; and a second encapsulating material which encapsulates the first encapsulating material and the metal wiring.

Abstract: Provided are power device packages, which include thermal electric modules using the Peltier effect and thus can improve operational reliability by rapidly dissipating heat generated during operation to the outside, and methods of fabricating the same. An exemplary power device package includes: a thermal electric module having a first surface and a second surface opposite each other, and a plurality of n-type impurity elements and a plurality of p-type impurity elements alternately and electrically connected to each other in series; a lead frame attached to the first surface of the thermal electric module by an adhesive member; at least one power semiconductor chip and at least one control semiconductor chip, each chip being mounted on and electrically connected to the lead frame; and a sealing member sealing the thermal electric module, the chips, and at least a portion of the lead frame, but exposing the second surface of the module.

Abstract: A card-type information recording medium having an embedded antenna for NFC communication is provided. The card-type information recording medium includes: a PCB that has a loop antenna pattern and a routing pattern formed on the top surface and the bottom surface thereof through the use of an etching process; an NFC communication unit and a USIM card unit that are horizontally mounted on the top of the PCB; and a molding material that is formed on the top of the PCB to cover the NFC communication unit and the USIM card unit. Accordingly, it is possible to perform functions of NFC and RFID read/tag by only mounting a USIM device thereon without adding any module or any constituent having an antenna function to a mobile terminal.

Abstract: Semiconductor die packages are disclosed. An exemplary semiconductor die package includes a premolded substrate. The premolded substrate can have a semiconductor die attached to it, and an encapsulating material may be disposed over the semiconductor die.

Abstract: Semiconductor die packages are disclosed. An exemplary semiconductor die package includes a premolded substrate. The premolded substrate can have a semiconductor die attached to it, and an encapsulating material may be disposed over the semiconductor die.

Abstract: A metal tab die attach paddle (DAP) disposed between the lead frame and a power device die in a power device package reduces the stress exerted on the semiconductor power device die caused by the different coefficients of thermal expansion (CTE) of the semiconductor power device die and the lead frame. In addition the power device package substantially prevents impurities from penetrating into the power device package by increasing the surface creepage distance of a sealant resulting from the metal tab DAP and an optional swaging of the lead frame.

Abstract: A metal tab die attach paddle (DAP) disposed between the lead frame and a power device die in a power device package reduces the stress exerted on the semiconductor power device die caused by the different coefficients of thermal expansion (CTE) of the semiconductor power device die and the lead frame. In addition the power device package substantially prevents impurities from penetrating into the power device package by increasing the surface creepage distance of a sealant resulting from the metal tab DAP and an optional swaging of the lead frame.

Abstract: Provided are power device packages, which include thermal electric modules using the Peltier effect and thus can improve operational reliability by rapidly dissipating heat generated during operation to the outside, and methods of fabricating the same. An exemplary power device package includes: a thermal electric module having a first surface and a second surface opposite each other, and a plurality of n-type impurity elements and a plurality of p-type impurity elements alternately and electrically connected to each other in series; a lead frame attached to the first surface of the thermal electric module by an adhesive member; at least one power semiconductor chip and at least one control semiconductor chip, each chip being mounted on and electrically connected to the lead frame; and a sealing member sealing the thermal electric module, the chips, and at least a portion of the lead frame, but exposing the second surface of the module.

Abstract: Semiconductor die packages are disclosed. An exemplary semiconductor die package includes a premolded substrate. The premolded substrate can have a semiconductor die attached to it, and an encapsulating material may be disposed over the semiconductor die.

Abstract: Provided are power device packages, which include thermal electric modules using the Peltier effect and thus can improve operational reliability by rapidly dissipating heat generated during operation to the outside, and methods of fabricating the same. An exemplary power device package includes: a thermal electric module having a first surface and a second surface opposite each other, and a plurality of n-type impurity elements and a plurality of p-type impurity elements alternately and electrically connected to each other in series; a lead frame attached to the first surface of the thermal electric module by an adhesive member; at least one power semiconductor chip and at least one control semiconductor chip, each chip being mounted on and electrically connected to the lead frame; and a sealing member sealing the thermal electric module, the chips, and at least a portion of the lead frame, but exposing the second surface of the module.

Abstract: The present invention is directed to a portable terminal having inputting means using an image sensor and its input method. The portable terminal according to an embodiment of the present invention comprises a transparent solid plate mounted in a keypad area; an image sensor having unit cells of lattice type outputting an electrical signal corresponding to the light irradiated through the transparent solid plate; and a key selection recognizer generating and outputting a key button selection signal corresponding to the location of a unit cell that outputted the least electrical signal value by making reference to the size of the value of the electrical signal inputted from the unit cells. The present invention enables compacting of portable terminals owing to eliminating the need to design key buttons to match the size of human fingers.