Abstract: The system and method of the present invention facilitate clamping of a land grid array integrated circuit (LGA IC) device through adjustment and calibration of the clamping system in relation to the connector/socket features used for a given type of LGA IC device and connector/socket. In order to accommodate for different connector/socket heights, the clamping system of the present invention includes exchangeable calibrated springs and an exchangeable shim that enable the clamping system to adjust to a specific connector/socket height. Due to the level of calibration, the system and method provides controlled downward vertical force at the level of force required to clamp the pads of the LGA IC device to the contacts of the connector/socket thereby providing complete electric contact therebetween and complete electric contact between the connector/socket and a circuit board.