Patents by Inventor Byron Elliott Short, Jr.

Byron Elliott Short, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9750160
    Abstract: One or both of a module cover and a heat sink for a circuit card module includes a multi-level cooling structure formed by a body, sidewalls extending from edges of the body and, together with the body, partially enclosing a volume, flanges projecting from ends of the sidewalls opposite the body and away from the volume, and an oscillating heat pipe within the body, the sidewalls, and the flanges. The oscillating heat pipe fluid path repeatedly traverses the body, a length of each of the sidewalls, and a portion of each of the flanges. The oscillating heat pipe provides cooling through both phase change of fluid slugs and vapor bubbles within the oscillating heat pipe and movement of the fluid slugs and the vapor bubbles along the fluid path between an evaporator adjacent a first of the flanges and a condenser adjacent a second of the flanges.
    Type: Grant
    Filed: January 20, 2016
    Date of Patent: August 29, 2017
    Assignee: Raytheon Company
    Inventors: Byron Elliott Short, Jr., Nathan R. Francis, David B. Brandt
  • Publication number: 20170208706
    Abstract: One or both of a module cover and a heat sink for a circuit card module includes a multi-level cooling structure formed by a body, sidewalls extending from edges of the body and, together with the body, partially enclosing a volume, flanges projecting from ends of the sidewalls opposite the body and away from the volume, and an oscillating heat pipe within the body, the sidewalls, and the flanges. The oscillating heat pipe fluid path repeatedly traverses the body, a length of each of the sidewalls, and a portion of each of the flanges. The oscillating heat pipe provides cooling through both phase change of fluid slugs and vapor bubbles within the oscillating heat pipe and movement of the fluid slugs and the vapor bubbles along the fluid path between an evaporator adjacent a first of the flanges and a condenser adjacent a second of the flanges.
    Type: Application
    Filed: January 20, 2016
    Publication date: July 20, 2017
    Inventors: Byron Elliott Short, JR., Nathan R. Francis, David B. Brandt
  • Patent number: 9160022
    Abstract: A wearable, hybrid power generation system includes a rechargeable battery, a solid fuel cell power generator coupled to the rechargeable battery, and a cartridge with fuel for the solid fuel cell power generator. The cartridge is removeably coupled to the solid fuel cell power generator. The rechargeable battery, the solid fuel cell power generator, and the cartridge may be housed in a form factor conforming to a shape and size of a standard battery.
    Type: Grant
    Filed: March 21, 2012
    Date of Patent: October 13, 2015
    Assignee: Raytheon Company
    Inventors: James A. Pruett, Howard C. Choe, Byron Elliott Short, Jr., Larry C. Bowling
  • Publication number: 20120242274
    Abstract: A wearable, hybrid power generation system includes a rechargeable battery, a solid fuel cell power generator coupled to the rechargeable battery, and a cartridge with fuel for the solid fuel cell power generator. The cartridge is removeably coupled to the solid fuel cell power generator. The rechargeable battery, the solid fuel cell power generator, and the cartridge may be housed in a form factor conforming to a shape and size of a standard battery.
    Type: Application
    Filed: March 21, 2012
    Publication date: September 27, 2012
    Applicant: Raytheon Company
    Inventors: James A. Pruett, Howard C. Choe, Byron Elliott Short, JR., Larry C. Bowling
  • Patent number: 7841392
    Abstract: A phased array antenna apparatus has a plurality of circuit portions which are each coupled to a respective antenna element. Capillary pressure of a cooling fluid within a wick in a loop is utilized to urge the fluid to travel around the loop, the wick being disposed in the region of the circuitry. In a variation, there are plural wicks in respective evaporators, and cooling fluid is distributed among the evaporators through a series of T-junctions. In another variation, cooling fluid is distributed to a plurality of evaporators in a sequence corresponding to a progressive increase in the respective amounts of heat accepted by the evaporators from structure being cooled.
    Type: Grant
    Filed: June 12, 2006
    Date of Patent: November 30, 2010
    Assignee: Raytheon Company
    Inventors: Byron Elliott Short, Jr., Jay M. Ochterbeck
  • Publication number: 20090008063
    Abstract: According to an embodiment of the invention, a cooling system for a heat-generating device comprises a base plate, a fluid transfer chamber, a non-metallic wicking material, and a coolant. The base plate is in thermal communication with a heat generating structure and is operable to communicate thermal energy from the heat-generating device. The non-metallic wicking material and the coolant are disposed within the fluid transfer chamber. The non-metallic wicking material wicks a portion of the coolant towards a portion of the base plate communicating the thermal energy. The portion of the coolant absorb at least a portion of the thermal energy communicated from the heat-generating device. The coolant comprising at least an alcohol and at least one additional fluid.
    Type: Application
    Filed: July 3, 2007
    Publication date: January 8, 2009
    Applicant: Raytheon Company
    Inventors: Mauricio A. Salinas, Richard M. Weber, Byron Elliott Short, JR.
  • Patent number: 7416017
    Abstract: A cooling apparatus (10) includes a housing defined by two aluminum parts (12, 13) which are brazed to each other. A plurality of sector-shaped recesses (21-28) are provided within the housing, and collectively define a chamber having a plurality of ribs (41-48) extending therethrough. Each recess contains a sector-shaped piece of porous material (17, 18), which is brazed to surfaces of the housing parts. The remaining space within the chamber is filled with a phase change material. Each of the ribs has therein a respective radially extending opening (101-108) which contains a heat pipe (141). Expansion accumulators (151) are mounted on the housing, and communicate with the chamber therein, in order to accommodate expansion of the phase change material within the chamber as the phase change material is heated.
    Type: Grant
    Filed: June 30, 2006
    Date of Patent: August 26, 2008
    Assignee: Raytheon Company
    Inventors: James L. Haws, Byron Elliott Short, Jr.
  • Patent number: 7268744
    Abstract: A phased array antenna apparatus has a plurality of circuit portions which are each coupled to a respective antenna element. Capillary pressure of a cooling fluid within a wick in a loop is utilized to urge the fluid to travel around the loop, the wick being disposed in the region of the circuitry. In a variation, there are plural wicks in respective evaporators, and cooling fluid is distributed among the evaporators through a series of T-junctions. In another variation, cooling fluid is distributed to a plurality of evaporators in a sequence corresponding to a progressive increase in the respective amounts of heat accepted by the evaporators from structure being cooled.
    Type: Grant
    Filed: June 12, 2006
    Date of Patent: September 11, 2007
    Assignee: Raytheon Company
    Inventors: Byron Elliott Short, Jr., Jay M. Ochterbeck
  • Patent number: 7069975
    Abstract: A cooling apparatus (10) includes a housing defined by two aluminum parts (12, 13) which are brazed to each other. A plurality of sector-shaped recesses (21–28) are provided within the housing, and collectively define a chamber having a plurality of ribs (41–48) extending therethrough. Each recess contains a sector-shaped piece of porous material (17, 18), which is brazed to surfaces of the housing parts. The remaining space within the chamber is filled with a phase change material. Each of the ribs has therein a respective radially extending opening (101–108) which contains a heat pipe (141). Expansion accumulators (151) are mounted on the housing, and communicate with the chamber therein, in order to accommodate expansion of the phase change material within the chamber as the phase change material is heated.
    Type: Grant
    Filed: September 16, 1999
    Date of Patent: July 4, 2006
    Assignee: Raytheon Company
    Inventors: James L. Haws, Byron Elliott Short, Jr.
  • Patent number: 7061446
    Abstract: A phased array antenna apparatus has a plurality of circuit portions which are each coupled to a respective antenna element. Capillary pressure of a cooling fluid within a wick in a loop is utilized to urge the fluid to travel around the loop, the wick being disposed in the region of the circuitry. In a variation, there are plural wicks in respective evaporators, and cooling fluid is distributed among the evaporators through a series of T-junctions. In another variation, cooling fluid is distributed to a plurality of evaporators in a sequence corresponding to a progressive increase in the respective amounts of heat accepted by the evaporators from structure being cooled.
    Type: Grant
    Filed: October 24, 2003
    Date of Patent: June 13, 2006
    Assignee: Raytheon Company
    Inventors: Byron Elliott Short, Jr., Jay M. Ochterbeck
  • Patent number: 6297775
    Abstract: An antenna system (10) includes circuitry (13) and an antenna unit (12). The antenna unit includes a multi-layer circuit board (21). The circuitry provides radio frequency signals, control signals and power to the circuit board. The circuit board has an array of antenna elements (23) on one side thereof, and has a plurality of modules (71, 72) soldered to and projecting outwardly from the opposite side thereof. The modules each have electronic circuitry thereon, which is electrically coupled to the circuit board. Each module includes a thermal transfer element (96), the heat generated by the electronic components on that module being thermally transferred by the thermal transfer element to a cooling section (51).
    Type: Grant
    Filed: September 16, 1999
    Date of Patent: October 2, 2001
    Assignee: Raytheon Company
    Inventors: James L. Haws, Byron Elliott Short, Jr.