Patents by Inventor Byron Hu

Byron Hu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flying Disc with Protected Electronics
    Publication number: 20180085680
    Abstract: A flying disc assembly that contains an electronics module. The electronics module is protected from impact forces by the structure of the flying disc assembly. The flying disc assembly includes an annular disc body that defines a central opening. The electronics module extends through the central opening and is joined to the annular disc body by shock absorbing elements. The shock absorbing elements enable the electronics module to move relative the annular disc body when the flying disc assembly experiences a rapid change in velocity. The range of movement is limited to prevent permanent deformation of the shock absorbing elements. However, the range of movement that is permitted significantly reduces the forces that are experienced by the electronics module.
    Type: Application
    Filed: November 30, 2017
    Publication date: March 29, 2018
    Inventors: Mark A. Adkins, Jack S. Lovewell, Byron Hu
  • Flying disc with protected electronics
    Patent number: 9873064
    Abstract: A flying disc assembly that contains an electronics module. The electronics module is protected from impact forces by the structure of the flying disc assembly. The flying disc assembly includes an annular disc body that defines a central opening. The electronics module extends through the central opening and is joined to the annular disc body by shock absorbing elements. The shock absorbing elements enable the electronics module to move relative the annular disc body when the flying disc assembly experiences a rapid change in velocity. The range of movement is limited to prevent permanent deformation of the shock absorbing elements. However, the range of movement that is permitted significantly reduces the forces that are experienced by the electronics module.
    Type: Grant
    Filed: September 27, 2016
    Date of Patent: January 23, 2018
    Assignee: Tucker International, LLC
    Inventors: Mark A. Adkins, Jack S. Lovewell, Byron Hu