Patents by Inventor Byron K Davis

Byron K Davis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9352560
    Abstract: In one example, a printhead structure includes: a first layer; an array of openings in the first layer to form printing fluid ejection chambers; a second layer on the first layer; an array of orifices through the second layer, each orifice located adjacent to one of the openings in the first layer; a groove in the first layer spanning substantially a full length of the array of openings; and multiple holes through the second layer to the groove in the first layer.
    Type: Grant
    Filed: June 28, 2013
    Date of Patent: May 31, 2016
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Mark Sanders Taylor, Craig Olbrich, Byron K. Davis
  • Publication number: 20160107442
    Abstract: In one example, a printhead structure includes: a first layer; an array of openings in the first layer to form printing fluid ejection chambers; a second layer on the first layer; an array of orifices through the second layer, each orifice located adjacent to one of the openings in the first layer; a groove in the first layer spanning substantially a full length of the array of openings; and multiple holes through the second layer to the groove in the first layer.
    Type: Application
    Filed: June 28, 2013
    Publication date: April 21, 2016
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Mark Sanders Taylor, Craig Olbrich, Byron K. Davis
  • Patent number: 6679581
    Abstract: A printhead assembly includes a carrier including a substrate and a substructure joined to a first surface of the substrate, and a plurality of printhead dies each mounted on a second surface of the substrate. The first surface of the substrate includes a surface deformation and the substructure is joined to the first surface by an adhesive. As such, the adhesive conforms to the surface deformation.
    Type: Grant
    Filed: October 25, 2001
    Date of Patent: January 20, 2004
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Janis Horvath, Lawrence E Gibson, Byron K Davis, David K Mc Elfresh, Gerald V Rapp
  • Publication number: 20030081059
    Abstract: A printhead assembly includes a carrier including a substrate and a substructure joined to a first surface of the substrate, and a plurality of printhead dies each mounted on a second surface of the substrate. The first surface of the substrate includes a surface deformation and the substructure is joined to the first surface by an adhesive. As such, the adhesive conforms to the surface deformation.
    Type: Application
    Filed: October 25, 2001
    Publication date: May 1, 2003
    Inventors: Janis Horvath, Lawrence E. Gibson, Byron K. Davis, David K. Mc Elfresh, Gerald V. Rapp
  • Patent number: 5937494
    Abstract: A double-sided electrical interconnect flexible circuit particularly useful for ink-jet pens and a method for assembling an ink-jet pen with the flexible circuit is described. A wide web, dielectric, flexible tape, such as of a polyimide material, is used to allow the substantially simultaneous formation of redundant flexible circuits across the web. The web is laminated with a conductive material foil and a plurality of redundant circuit patterns formed on the web in a single masking and etching process, or the like. A cover layer, also of a wide web format, dielectric material is coated over the circuit patterned conductive layer. Vias are provided in both the tape under layer and the tape over layer for appropriate electrical connections whereby a first device, such as an ink-jet printer controller, can be connected through one layer and a second device, such as a replaceable ink-jet pen's electrically active components can be connected through the other layer.
    Type: Grant
    Filed: November 7, 1996
    Date of Patent: August 17, 1999
    Assignee: Hewlett-Packard Company
    Inventors: Neal Meyer, Byron K. Davis
  • Patent number: 5612511
    Abstract: A double-sided electrical interconnect flexible circuit particularly useful for ink-jet pens and a method for assembling an ink-jet pen with the flexible circuit is described. A wide web, dielectric, flexible tape, such as of a polyimide material, is used to allow the substantially simultaneous formation of redundant flexible circuits across the web. The web is laminated with a conductive material foil and a plurality of redundant circuit patterns formed on the web in a single masking and etching process, or the like. A cover layer, also of a wide web format, dielectric material is coated over the circuit patterned conductive layer. Vias are provided in both the tape under layer and the tape over layer for appropriate electrical connections whereby a first device, such as an ink-jet printer controller, can be connected through one layer and a second device, such as a replaceable ink-jet pen's electrically active components can be connected through the other layer.
    Type: Grant
    Filed: September 25, 1995
    Date of Patent: March 18, 1997
    Assignee: Hewlett-Packard Company
    Inventors: Neal Meyer, Byron K. Davis