Abstract: A semiconductor device includes a first element separation structure, a second element separation structure, and a third element separation structure sequentially disposed along a first direction and extending in a second direction intersecting the first direction; a first active pattern extending in the first direction between the first element separation structure and the second element separation structure; a second active pattern extending in the first direction between the second element separation structure and the third element separation structure and separated from the first active pattern by the second element separation structure; a first gate electrode extending in the second direction on the first active pattern; and a plurality of second gate electrodes extending in the second direction on the second active pattern, wherein a width of the first active pattern in the second direction is greater than a width of the second active pattern in the second direction.

Abstract: Disclosed is a biliary stent having a winding and fixing member around which a pulling string is wound, and the biliary stent includes a stent having a cylindrical body having space parts and bent ends formed on both ends thereof and configured such that the pulling string is woven with the space parts in zigzags into a circular band, a knot part is formed firmly so as not to be easily loosened, and a medical procedure is performed to expose the pulling string to an outside of a human body so as to prevent the cylindrical body from slipping inside a biliary tract; the winding and fixing member having a main body including an adhesive part so as to be adhered and fixed to a skin surface; and a cover gauze member configured to cover an entirety of the winding and fixing member and the skin surface.

Abstract: A coil component includes a body having a first surface, and a first end surface and a second end surface connected to the first surface and opposing each other in a length direction; a support substrate disposed inside the body; a coil portion comprising a first coil pattern and first and second lead-out patterns, each disposed on a first surface of the support substrate; first and second slit portions, respectively defined on edge portions of the first surface of the body to expose the first and second lead-out patterns; and first and second external electrodes disposed on the first and second slit portions to be connected to the first and second lead-out patterns. At least one of the first and second lead-out patterns has a thickness greater than a thickness of each of the first coil pattern and the first dummy lead-out pattern.

Abstract: A method of manufacturing a semiconductor chip and a semiconductor device. The method of manufacturing the semiconductor chip includes a process of dicing a substrate. The substrate includes an active layer and an organic layer on the semiconductor base. Dicing grooves that are extended to face each other along first dicing lines from points, at which the first dicing lines and second dicing lines along which the substrate is to be diced intersect, are formed by recessing some parts of the active layer. Modified patterns are formed within the semiconductor base. The substrate is diced into semiconductor chips by propagating cracks into the substrate from the modified patterns.

Abstract: The present invention relates to a method for preparing an alkali metal ion conductive chalcogenide-based solid electrolyte, a solid electrolyte prepared thereby, and an all-solid-state battery comprising the same.

Abstract: A coil component includes a body having one surface, and one end surface and the other end surface, respectively connected to the one surface and opposing each other, a support substrate embedded in the body, and a coil portion disposed on the support substrate and including first and second lead-out patterns respectively exposed from surfaces of the body. The first lead-out pattern is exposed from the one surface of the body and the one end surface of the body. The second lead-out pattern is exposed from the one surface of the body and the other end surface of the body. The body includes an anchor portion disposed in each of the first and second lead-out patterns.

Abstract: Disclosed is a semiconductor package including a semiconductor chip having a first surface adjacent to an active layer and a second surface opposite to the first surface; a conductive stud disposed on the first surface of the semiconductor chip and connected to the active layer; an adhesive layer disposed on the second surface of the semiconductor chip; a conductive post disposed outside the semiconductor chip; a first redistribution structure, which is on the first surface of the semiconductor chip and includes a first redistribution insulation layer supporting the conductive stud and the conductive post; a second redistribution structure, which is on the second surface of the semiconductor chip and includes a second redistribution insulation layer disposed on the adhesive layer; and a first molding layer disposed on the first redistribution structure and surrounding the semiconductor chip, the adhesive layer, the conductive stud, and the conductive post.

Abstract: Provided is a semiconductor package including a first semiconductor chip having a bottom surface adjacent to a first active layer and an top surface opposite to the bottom surface; a first adhesive layer disposed on the top surface of the first semiconductor chip; a first conductive stud disposed on the bottom surface of the first semiconductor chip and electrically connected to the first active layer; a first conductive post disposed outside the first semiconductor chip; a redistribution structure disposed under the first semiconductor chip and including a redistribution pattern connected to the first conductive stud and the first conductive post and a redistribution insulation layer surrounding the redistribution pattern; and a molding layer surrounding the first semiconductor chip, the first adhesive layer, the first conductive stud, and the first conductive post on the redistribution structure.

Abstract: A method of displaying contents, a method of synchronizing contents, and a method and device for displaying contents are provided. The method includes: receiving initial scene configuration information of a content written in a markup language from an external device, structuralizing the initial scene configuration information, rendering the content according to the structuralized initial scene configuration information, receiving additional scene configuration information of the content from the external device, updating the structuralized initial scene configuration information based on the received additional scene configuration information, and rendering the content according to the updated initial scene configuration information.