Abstract: A capacitor component includes a body, including a dielectric layer and an internal electrode layer, and an external electrode disposed on the body and connected to the internal electrode layer. At least one hole is formed in the internal electrode layer, and a region, containing at least one selected from the group consisting of indium (In) and tin (Sn), is disposed in the hole. A method of manufacturing a capacitor component includes forming a dielectric green sheet, forming a conductive thin film, including a first conductive material and a second conductive material, on the dielectric green sheet, and sintering the conductive thin film to form an internal electrode layer. The internal electrode layer includes the first conductive material, and a region, including the second conductive material, is formed in the internal electrode layer.

Abstract: The present disclosure relates to a method for determining a relative position between arrays of a flexible array device. The flexible array device according to an embodiment includes a plurality of arrays arranged at a predetermined interval in a deformable substrate, and the method includes measuring the first capacitance between adjacent arrays, measuring the second capacitance between the adjacent arrays after deformation of the substrate, and determining a relative position between the adjacent arrays based on the first capacitance measurement value and the second capacitance measurement value. According to an embodiment, the relative position between the arrays may be determined by measuring the capacitance between the adjacent arrays of the plurality of arrays arranged in the deformable substrate and measuring a change in capacitance caused by the deformation (contraction, relaxation, bending) of the substrate.

Abstract: A method of fabricating a capacitive micromachined ultrasonic transducer (CMUT) according to one aspect of the present invention may include forming, on a semiconductor substrate, a first region implanted with impurity ions at a first average concentration and a second region implanted with no impurity ions or implanted with the impurity ions at a second average concentration lower than the first average concentration, forming an insulating layer by oxidizing the semiconductor substrate wherein the insulating layer includes a first oxide layer having a first thickness on at least a part of the first region and a second oxide layer having a second thickness smaller than the first thickness on at least a part of the second region, and forming a membrane layer on the insulating layer such that a gap is defined between the second oxide layer and the membrane layer.

Abstract: An air conditioning device for a vehicle includes: a housing having an inside divided into an inflow space, a heat exchange space, and an outflow space, which are straightly arranged, and having a plurality of discharge ports, which communicates with an interior, at the inflow space; a blowing unit disposed at the inflow space of the housing and configured to blow air; a heat exchange unit disposed at the heat exchange space of the housing and configured to adjust a temperature of conditioned air by exchanging heat with air; and an opening-closing door disposed at the outflow space of the housing and configured to open and close the plurality of discharge ports such that conditioned air at an adjusted temperature selectively flows to the plurality of discharge ports. The air conditioning device adjusts the temperature of conditioned air for respective modes and reduces a flow resistance of air.

Abstract: Disclosed is a method for cleaning a photo mask. The method includes a pre-treatment operation of wetting a chemical on an entire surface of the photo mask in a state in which the photo mask is stopped, and a cleaning operation of supplying the chemical to a pattern area of the photo mask in a state in which the photo mask is rotated.

Abstract: Disclosed is a method for cleaning a photo mask. The method includes a pre-treatment operation of wetting a chemical on an entire surface of the photo mask in a state in which the photo mask is stopped, and a cleaning operation of supplying the chemical to a pattern area of the photo mask in a state in which the photo mask is rotated.

Abstract: Provided is a substrate treating apparatus. The substrate treating apparatus according to embodiments of the present invention may include a cleaning chamber cleaning foreign objects on a substrate, and a recycling unit recycling by recovering a mixed solution including a first chemical and a second chemical used in cleaning of the substrate, wherein the recycling unit includes a separation unit separating the mixed solution recovered from the cleaning chamber, a recovery line connecting the separation unit and the cleaning chamber and allowing the mixed solution to flow into the separation unit, a decompression line having one end connected to the separation unit and exhausting the mixed solution evaporated from the separation unit, and a decompression unit installed in the decompression line and reducing pressure in the separation unit.

Abstract: An apparatus for bonding a semiconductor chip to a package substrate, the apparatus comprising: a die-bonding unit configured to attach the semiconductor chip to the package substrate; a load-measuring unit installed at the die-bonding unit, the load-measuring unit including a panel having a plurality of regions and a plurality of load-measuring members with at least one load-measuring member arranged in each of the regions of the panel to measure load values applied to each of the regions; and a controller configured to determine a load and a flatness of the semiconductor chip based on the load values measured by the load-measuring members.

Abstract: Provided is a buffer unit, which includes a frame including a base plate, a first vertical plate, and a second vertical plate, wherein the first and second vertical plates are spaced apart from each other on the base plate, a first buffer on which a photomask is placed, the first buffer being allowed to be reversed between the first and second vertical plates; and a plurality of driving parts disposed at outsides of the first and second vertical plates, and driving the first buffer to grip and reverse the photomask placed on the first buffer.

Abstract: Provided is a substrate processing apparatus. The substrate processing apparatus includes an index part including a port on which a container containing a substrate is placed and an index robot, a processing part for processing the substrate, and a buffer unit disposed between the processing part and the index part to allow the substrate transferred between the processing part and the index part to be temporarily stayed therein. The processing part includes a glue removal processing module, a substrate cooling processing module, a heat processing module, and a functional water processing module which are disposed along a transfer passage for transferring the substrate.

Abstract: A solution supplying unit includes a body, a first supplying tube and a second supplying tube. The body includes a chamber having a substantially circular cross-section to receive a solution and an out-flowing part connected to the chamber to flow out the solution. The first supplying tube is disposed at a side of the body, tangentially connected to the chamber, and supplying a first solution into the chamber to rotate the first solution in the chamber. The second supplying tube has an end portion, and supplying a second solution into the chamber to mix the first solution with the second solution. The end portion is formed through the body and is adjacent to a central axis of the body.

Abstract: Provided is a substrate processing apparatus. The apparatus includes a processing chamber containing a substrate and processing the substrate by using a processing solution and a supplying unit supplying the processing solution to the processing chamber. The supplying unit includes a supply line through which the processing solution is supplied, a preliminary heater installed on the supply line and preliminary heating the processing solution, a main heater installed on the supply line at a lower stream of the preliminary heater and secondarily heating the processing solution, a first detour line connected to the supply line to detour to the preliminary heater and comprising a first valve, a second detour line connected to the supply line to detour the preliminary heater and the main heater or the main heater and comprising a second valve, and a controller controlling the first valve and the second valve.

Abstract: Provided is a substrate processing apparatus. The substrate processing apparatus includes an index part including a port on which a container containing a substrate is placed and an index robot, a processing part for processing the substrate, and a buffer unit disposed between the processing part and the index part to allow the substrate transferred between the processing part and the index part to be temporarily stayed therein. The processing part includes a glue removal processing module, a substrate cooling processing module, a heat processing module, and a functional water processing module which are disposed along a transfer passage for transferring the substrate.

Abstract: Provided is a buffer unit, which includes a frame including a base plate, a first vertical plate, and a second vertical plate, wherein the first and second vertical plates are spaced apart from each other on the base plate, a first buffer on which a photomask is placed, the first buffer being allowed to be reversed between the first and second vertical plates; and a plurality of driving parts disposed at outsides of the first and second vertical plates, and driving the first buffer to grip and reverse the photomask placed on the first buffer.

Abstract: A solution supplying unit includes a body, a first supplying tube and a second supplying tube. The body includes a chamber having a substantially circular cross-section to receive a solution and an out-flowing part connected to the chamber to flow out the solution. The first supplying tube is disposed at a side of the body, tangentially connected to the chamber, and supplying a first solution into the chamber to rotate the first solution in the chamber. The second supplying tube has an end portion, and supplying a second solution into the chamber to mix the first solution with the second solution. The end portion is formed through the body and is adjacent to a central axis of the body.

Abstract: A die bonding apparatus is presented which is capable of realizing different semiconductor packages, for example, a face up package and a face down package in a single die bonding apparatus. The die bonding apparatus includes a substrate transportation unit for transporting a substrate. A first bonding head unit is included which has a first bonding head for bonding a semiconductor chip disposed in a mount table adjacent to the substrate transportation unit over the substrate. A die transportation unit is included for transporting the semiconductor chip disposed in a mount table to a mount stage disposed at a lower portion of the substrate. A second bonding head unit is included in which the mount stage and a second bonding head disposed at an upper portion of the substrate corresponding to the mount stage and bonding the semiconductor chip disposed in the mount stage to the lower portion of the substrate.

Abstract: A die bonding apparatus is presented which is capable of realizing different semiconductor packages, for example, a face up package and a face down package in a single die bonding apparatus. The die bonding apparatus includes a substrate transportation unit for transporting a substrate. A first bonding head unit is included which has a first bonding head for bonding a semiconductor chip disposed in a mount table adjacent to the substrate transportation unit over the substrate. A die transportation unit is included for transporting the semiconductor chip disposed in a mount table to a mount stage disposed at a lower portion of the substrate. A second bonding head unit is included in which the mount stage and a second bonding head disposed at an upper portion of the substrate corresponding to the mount stage and bonding the semiconductor chip disposed in the mount stage to the lower portion of the substrate.

Abstract: Disclosed is a method for manufacturing an optical fiber preform in MCVD, which simultaneously performs an etching process for injecting a reaction gas for etching into a tube and a collapsing process for heating and collapsing the tube in order to minimize or eliminate an index dip existing at the center of the preform core. By using this method, the index dip phenomenon of the optical fiber preform can be minimized or eliminated, so it is possible to make an optical fiber having improved optical characteristics, particularly having improvement in a bandwidth and a polarization mode dispersion (PMD).