Patents by Inventor Byung-Duk NA

Byung-Duk NA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PRINTED CIRCUIT BOARD, ELECTRONIC COMPONENT-EMBEDDED SUBSTRATE, AND MANUFACTURING METHOD THEREOF
    Publication number: 20220039261
    Abstract: A printed circuit board and an electronic component-embedded substrate including the same are provided. The printed circuit board includes a first insulating layer, a second insulating layer disposed on the first insulating layer, a barrier layer disposed between the first and second insulating layers, a cavity penetrating through one of the first and second insulating layers, and a first wiring layer at least partially in contact with the barrier layer. The barrier layer has a modulus lower than a modulus of each of the first and second insulating layers.
    Type: Application
    Filed: March 22, 2021
    Publication date: February 3, 2022
    Inventors: Mi Sun HWANG, Jun Hyeong JANG, Byung Duk NA
  • Printed circuit board and method of manufacturing the same
    Patent number: 10849226
    Abstract: A printed circuit board includes: an insulating layer having a via hole formed therein; a single layer metal pad disposed in the insulating layer and having a center portion that is exposed by the via hole, the center portion of the pad having a higher roughness than peripheral portions of the pad; and a via formed in the via hole and connected to the center portion of the pad.
    Type: Grant
    Filed: October 25, 2019
    Date of Patent: November 24, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Mi-Sun Hwang, Hye-Won Jung, Jae-Sung Sim, Byung-Duk Na, Hee-Joon Chun, Sun-A Kim, Deok-Man Kang
  • Printed circuit board
    Patent number: 10779409
    Abstract: A printed circuit board including: an insulating material; a metal layer stacked on a surface of the insulating material; and a via hole passing through the metal layer and the insulating material. The metal layer decreases in thickness in a region adjacent to the via hole, and an interface between the insulating material and the metal layer includes a region that is directed toward the via hole.
    Type: Grant
    Filed: November 5, 2019
    Date of Patent: September 15, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Byung-Duk Na, Hye-Won Jung, Jae-Sung Sim, Mi-Sun Hwang, Hee-Joon Chun, Deok-Man Kang, Sun-A Kim
  • PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20200178392
    Abstract: A printed circuit board includes: an insulating layer having a via hole formed therein; a single layer metal pad disposed in the insulating layer and having a center portion that is exposed by the via hole, the center portion of the pad having a higher roughness than peripheral portions of the pad; and a via formed in the via hole and connected to the center portion of the pad.
    Type: Application
    Filed: October 25, 2019
    Publication date: June 4, 2020
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Mi-Sun HWANG, Hye-Won JUNG, Jae-Sung SIM, Byung-Duk NA, Hee-Joon CHUN, Sun-A KIM, Deok-Man KANG
  • PRINTED CIRCUIT BOARD
    Publication number: 20200154568
    Abstract: A printed circuit board including: an insulating material; a metal layer stacked on a surface of the insulating material; and a via hole passing through the metal layer and the insulating material. The metal layer decreases in thickness in a region adjacent to the via hole, and an interface between the insulating material and the metal layer includes a region that is directed toward the via hole.
    Type: Application
    Filed: November 5, 2019
    Publication date: May 14, 2020
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Byung-Duk NA, Hye-Won JUNG, Jae-Sung SIM, Mi-Sun HWANG, Hee-Joon CHUN, Deok-Man KANG, Sun-A KIM