Patents by Inventor Byung Hak Kim

Byung Hak Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240109595
    Abstract: A frame structure for a vehicle includes: an inner panel connected to a side member and defining an inner side of a rear part of the side member; an outer panel connected to a rear side of the side member and coupled to an outer side of the inner panel defining a closed cross-section together with the inner panel and defining an outer side of the rear part of the side member; an opening portion formed below the inner and outer panels partially opening the closed cross-section so that a front end of a rear suspension arm can be inserted into the opening portion; and a reinforcing member disposed in the opening portion defining the closed cross-section together with the outer panel and the inner panel and configured to close an internal space in the outer and inner panels.
    Type: Application
    Filed: January 25, 2023
    Publication date: April 4, 2024
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION
    Inventors: Won Hae Lee, Nam Ho Kim, Mi Ran Park, Ha Yeon Kwon, Byung Joo Chung, Seung Hak Lee, Min Seok Kim
  • Patent number: 11939000
    Abstract: A frame structure for a purpose built vehicle (PBV) includes: two main side members extending while gradually rising toward a front of the PBV and extending in a front/rear direction to be disposed on either side of the PBV; two auxiliary side members respectively extending in a front/rear direction to be disposed on a lower side of the two main side members; a front cross member connecting the two auxiliary side members in a lateral direction of the PBV; and a plurality of vertical members respectively connecting the main side members and the auxiliary side members in a vertical direction.
    Type: Grant
    Filed: September 19, 2022
    Date of Patent: March 26, 2024
    Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATION
    Inventors: Won Hae Lee, Nam Ho Kim, Byung Joo Chung, Seung Hak Lee, Min Seok Kim
  • Patent number: 11935703
    Abstract: A multilayer electronic component has a body and a non-conductive resin layer. The non-conductive resin layer includes a body cover portion disposed in a region of an external surface of the body in which an electrode layer of an external electrode is not disposed, and an extending portion extending from the body cover portion between the electrode layer and a conductive resin layer of the external electrode, to thereby suppress arc discharge, improve bending strength, and improve moisture resistance.
    Type: Grant
    Filed: January 9, 2023
    Date of Patent: March 19, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Seok Yi, Jung Min Kim, Bon Seok Koo, Chang Hak Choi, Il Ro Lee, Byung Woo Kang, San Kyeong, Hae Sol Kang
  • Patent number: 11926364
    Abstract: A frame for a purpose-built vehicle (PBV) includes: a front part frame positioned at a front side of a vehicle; a rear part frame positioned at a rear side of the vehicle; and a center part frame. The center part frame has a rectangular planar shape and is coupled between the front part frame and the rear part frame.
    Type: Grant
    Filed: October 28, 2022
    Date of Patent: March 12, 2024
    Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATION
    Inventors: Nam Ho Kim, Won Hae Lee, Byung Joo Chung, Seung Hak Lee, Min Seok Kim
  • Publication number: 20240013564
    Abstract: Example methods, apparatuses, and/or articles of manufacture are disclosed that may be implemented, in whole or in part, using one or more computing devices to implement one or more encoding and/or decoding techniques.
    Type: Application
    Filed: September 26, 2023
    Publication date: January 11, 2024
    Inventors: Byung-Hak Kim, Hariraam Varun Ganapathi, Weiyao Wang
  • Patent number: 11861503
    Abstract: Embodiments relate to system for automatically predicting payer response to claims. In an embodiment, the system receives claim data associated with a claim. The system identifies a set of claim features of the claim data, and generates an input vector with at least a portion of the set of claim features. The system applies the input vector to a trained model. A first portion of the neural network is configured to generate an embedding representing the input vector with a lower dimensionality than the input vector. A second portion of the neural network is configured to generate a prediction of whether the claim will be denied based on the embedding. The system provides the prediction for display on a user interface of a user device. The prediction may further include denial reason codes and a response date estimation to indicate if, when, and why a claim will be denied.
    Type: Grant
    Filed: June 29, 2021
    Date of Patent: January 2, 2024
    Assignee: AKASA, Inc.
    Inventors: Byung-Hak Kim, Hariraam Varun Ganapathi, Andrew Atwal
  • Patent number: 11624571
    Abstract: A frame assembly for a pistol with a lock lever. The frame assembly includes a lower frame having a grip and an upper frame assembled on the lower frame and to a slide. The lower frame has: a mounting projection projecting upward to face the upper frame; and a lever mounting unit separated from the mounting projection and projecting upward. The upper frame has: a mounting groove into which the mounting projection is inserted to face the lower frame, and a lever hooking hole at one side of the mounting groove. The lever mounting unit has a lock lever having one end locked to be rotatable by a lock pin and the other end elastically supported to project upward. When the upper frame is assembled to the lower frame, the other end of the lock lever is inserted into the lever hooking hole and the upper frame is locked.
    Type: Grant
    Filed: March 17, 2022
    Date of Patent: April 11, 2023
    Assignee: DASAN MACHINERIES CO., LTD
    Inventors: Byung Hak Kim, Jong Bum Kim
  • Publication number: 20220383130
    Abstract: Example methods, apparatuses, and/or articles of manufacture are disclosed that may be implemented, in whole or in part, using one or more computing devices to implement one or more self-supervised machine-learning techniques. In a particular implementation, first and second mappings may map features of an electronic document to associated first and second encoded domains.
    Type: Application
    Filed: January 14, 2022
    Publication date: December 1, 2022
    Inventors: Byung-Hak Kim, Hariraam Varun Ganapathi
  • Publication number: 20220374993
    Abstract: Disclosed are a system, method and apparatus to generate service codes based, at least in part, on electronic documents.
    Type: Application
    Filed: May 23, 2022
    Publication date: November 24, 2022
    Inventors: Byung-Hak Kim, Hariraam Varun Ganapathi, Zhongfen Deng
  • Publication number: 20220374709
    Abstract: Disclosed are a system, method and apparatus to generate service codes based, at least in part, on electronic documents.
    Type: Application
    Filed: May 23, 2022
    Publication date: November 24, 2022
    Inventors: Byung-Hak Kim, Hariraam Varun Ganapathi
  • Publication number: 20220374710
    Abstract: Disclosed are a system, method and apparatus to generate service codes based, at least in part, on electronic documents.
    Type: Application
    Filed: May 23, 2022
    Publication date: November 24, 2022
    Inventors: Byung-Hak Kim, Hariraam Varun Ganapathi
  • Publication number: 20220165373
    Abstract: Disclosed are a system, method and apparatus to generate service codes based, at least in part, on electronic documents. In an embodiment, tokens may be embedded in an electronic document based, at least in part, on a linguistic analysis of the electronic document. Likelihoods of applicability of service codes to the electronic document may be determined based, at least in part, on the embedding of tokens.
    Type: Application
    Filed: March 18, 2021
    Publication date: May 26, 2022
    Inventors: Byung-Hak Kim, Hariraam Varun Ganapathi
  • Publication number: 20220006440
    Abstract: Disclosed is a surface acoustic wave (SAW) wafer level package including a substrate, an interdigital transducer (IDT) formed on the substrate, a sidewall formed on the substrate along a periphery of the IDT, a cover formed above the sidewall and the IDT to form a hollow above the IDT with the sidewall, a connection electrode formed on the substrate, electrically connected to the IDT, and extending outward from a periphery of the sidewall, a connection terminal electrically connected to a part of the connection electrode which extends outward from the periphery of the sidewall, formed throughout one outer surface of the sidewall and one surface and a part of a top surface of the cover, and having a top surface formed to be higher than the top surface of the cover, and an organic solderability preservative (OSP) coating layer formed on at least the top surface of the connection terminal.
    Type: Application
    Filed: June 15, 2021
    Publication date: January 6, 2022
    Inventors: Suk Hwan JANG, Byung Hak KIM, Chang Yup LEE
  • Patent number: 11170448
    Abstract: Embodiments relate to system for automatically predicting payer response to claims. In an embodiment, the system receives claim data associated with a claim. The system identifies a set of claim features of the claim data, and generates an input vector with at least a portion of the set of claim features. The system applies the input vector to a trained model. A first portion of the neural network is configured to generate an embedding representing the input vector with a lower dimensionality than the input vector. A second portion of the neural network is configured to generate a prediction of whether the claim will be denied based on the embedding. The system provides the prediction for display on a user interface of a user device. The prediction may further include denial reason codes and a response date estimation to indicate if, when, and why a claim will be denied.
    Type: Grant
    Filed: March 13, 2020
    Date of Patent: November 9, 2021
    Assignee: AKASA, Inc.
    Inventors: Byung-Hak Kim, Hariraam Varun Ganapathi, Andrew Atwal
  • Publication number: 20210342949
    Abstract: Embodiments relate to system for automatically predicting payer response to claims. In an embodiment, the system receives claim data associated with a claim. The system identifies a set of claim features of the claim data, and generates an input vector with at least a portion of the set of claim features. The system applies the input vector to a trained model. A first portion of the neural network is configured to generate an embedding representing the input vector with a lower dimensionality than the input vector. A second portion of the neural network is configured to generate a prediction of whether the claim will be denied based on the embedding. The system provides the prediction for display on a user interface of a user device. The prediction may further include denial reason codes and a response date estimation to indicate if, when, and why a claim will be denied.
    Type: Application
    Filed: June 29, 2021
    Publication date: November 4, 2021
    Inventors: Byung-Hak Kim, Hariraam Varun Ganapathi, Andrew Atwal
  • Patent number: 11143473
    Abstract: Provided is a frame assembly for a pistol. The frame assembly includes a lower frame having a grip formed at a lower side and an upper frame that is assembled on the lower frame and is assembled to a slide. The lower frame has a mounting projection which has a predetermined length and projects upward to a predetermined height in a direction to face the upper frame. The upper frame has a mounting groove which has a predetermined depth and into which the mounting projection is inserted in a direction to face the lower frame. The lower frame and the upper frame are assembled together by a screw which is fastened to penetrate the mounting groove and the mounting projection in this order from an inner side of the upper frame.
    Type: Grant
    Filed: November 12, 2020
    Date of Patent: October 12, 2021
    Assignee: DASAN MACHINERIES CO., LTD.
    Inventors: Byung Hak Kim, Jong Bum Kim, In Tae Kang
  • Publication number: 20210192635
    Abstract: Embodiments relate to system for automatically predicting payer response to claims. In an embodiment, the system receives claim data associated with a claim. The system identifies a set of claim features of the claim data, and generates an input vector with at least a portion of the set of claim features. The system applies the input vector to a trained model. A first portion of the neural network is configured to generate an embedding representing the input vector with a lower dimensionality than the input vector. A second portion of the neural network is configured to generate a prediction of whether the claim will be denied based on the embedding. The system provides the prediction for display on a user interface of a user device. The prediction may further include denial reason codes and a response date estimation to indicate if, when, and why a claim will be denied.
    Type: Application
    Filed: March 13, 2020
    Publication date: June 24, 2021
    Inventors: Byung-Hak Kim, Hariraam Varun Ganapathi, Andrew Atwal
  • Publication number: 20210159882
    Abstract: A surface acoustic wave wafer-level package includes a substrate, an interdigital transducer (IDT) electrode formed on the substrate, a connection electrode electrically connected to the IDT electrode, a side wall formed on the substrate and outside the IDT electrode, a cover formed above the side wall and the IDT electrode to form a cavity, together with the side wall, on the IDT electrode, a connection terminal electrically connected to the connection electrode and protruding above the cover, a first reinforcement layer formed on the cover to at least partially overlap the cavity in a vertical direction, a second reinforcement layer formed to cover the cover and the first reinforcement layer and having holes formed in a portion corresponding to the connection terminal and a portion corresponding to the first reinforcement layer, and bumps formed in the respective holes of the second reinforcement layer to protrude above the second reinforcement layer.
    Type: Application
    Filed: November 18, 2020
    Publication date: May 27, 2021
    Inventors: Chang Yup LEE, Suk Hwan JANG, Jin Ho HA, Byung Hak KIM
  • Publication number: 20200354327
    Abstract: The present invention relates to a compound exhibiting STAT3 inhibitory activity, or a pharmaceutically acceptable salt, solvate or hydrate of the same, and pharmaceutical uses of these. The compounds of the present invention efficiently inhibit the abnormal activity of STAT3 associated with various diseases and thus can be usefully utilized for the prevention and treatment of various STAT3-related diseases associated with cancer, autoimmune diseases, inflammatory diseases and the like.
    Type: Application
    Filed: October 31, 2017
    Publication date: November 12, 2020
    Inventors: Chung Gi LEE, Sang Kyu YE, Byung Hak KIM
  • Publication number: 20190154369
    Abstract: The present invention is to provide a frame for a polymeric pistol with a metal rail, capable of securing the structural soundness of firearms to secure an accuracy rate of bullet even in high-temperature environments, preventing the high-temperature heat generated in a barrel or the like from being transferred, as it is, to a handle of the frame, and disassembling and replacing components as occasion demands.
    Type: Application
    Filed: April 1, 2018
    Publication date: May 23, 2019
    Inventors: Byung Hak KIM, Kwang Young HAN, Jong Bum KIM