Patents by Inventor Byung Hoon Jo

Byung Hoon Jo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240122070
    Abstract: The present invention relates to a novel polycyclic compound employed in an organic layer of an organoelectro luminescent device, wherein the organoelectro luminescent device employing the compound according to the present invention has remarkably improved luminous efficiency and a long lifespan. According to the present invention, it is possible to implement a highly efficient and long-life organoelectro luminescent device that can be effectively applied to various display devices.
    Type: Application
    Filed: October 12, 2020
    Publication date: April 11, 2024
    Applicant: SFC CO., LTD
    Inventors: Bong-ki SHIN, Sung-hoon JOO, Byung-sun YANG, Ji-hwan KIM, Hyeon-jun JO, Sung-eun CHOI
  • Patent number: 11844173
    Abstract: The present disclosure provides a flexible circuit board for multiple signal transmission including a first dielectric layer; a plurality of first side grounds formed on one surface of the first dielectric layer to be parallel; first signal lines formed between the plurality of first side grounds; and a plurality of through holes which is formed in each of the plurality of first side grounds with an interval, along a length direction of the first side grounds.
    Type: Grant
    Filed: September 20, 2021
    Date of Patent: December 12, 2023
    Assignee: GIGALANE CO., LTD.
    Inventors: Byung-hoon Jo, Ik-soo Kim, Byung-yeol Kim, Hee-seok Jung
  • Publication number: 20230397326
    Abstract: The present invention provides a flexible printed circuit board comprising: a first power line formed on one surface of a first dielectric layer; and a second power line formed on one surface of a second dielectric layer spaced apart from the first dielectric layer on a bottom surface of the first dielectric layer. There is an overlapping area in which the first power line and the second power line overlap, the first power line and the second power line are connected at a first end of the overlapping area through a via hole, and the first power line and the second power line are connected at a second end of the overlapping area through another via hole.
    Type: Application
    Filed: November 25, 2021
    Publication date: December 7, 2023
    Inventors: Byung Hoon JO, Ik Soo KIM, Byung Yeol KIM, Hee Seok JUNG
  • Patent number: 11542491
    Abstract: A fusion tag according to an embodiment of the present invention may increase the water solubility and expression level of a target protein. As the water solubility and expression level of a target protein in host cell can be increased by a recombinant vector including the fusion tag, the fusion tag can be advantageously used in industry.
    Type: Grant
    Filed: December 28, 2018
    Date of Patent: January 3, 2023
    Assignee: INDUSTRY-ACADEMIC COOPERATION FOUNDATION GYEONGSANG NATIONAL UNIVERSITY
    Inventor: Byung-hoon Jo
  • Patent number: 11489241
    Abstract: The present invention relates to a transmission line having improved bending durability, which includes a strip structure or a micro-strip structure that is divided into a base part and a bending part that is bent and unfolded based on the base part, wherein the base part and the bending part include a signal line configured to extend in a length direction so as to transmit a high frequency signal, a first dielectric of which an upper surface or a lower surface is provided with the signal line formed thereon, and a second dielectric formed above the first dielectric; and the second dielectric is coupled to the first dielectric in the base part and separated from the first dielectric in the bending part.
    Type: Grant
    Filed: July 18, 2019
    Date of Patent: November 1, 2022
    Assignee: GIGALANE CO., LTD.
    Inventors: Sang Pil Kim, Byung Hoon Jo, Da Yeon Lee, Byung Yeol Kim, Hee seok Jung
  • Publication number: 20220183143
    Abstract: The present disclosure provides a flexible circuit board for multiple signal transmission including a first dielectric layer; a plurality of first side grounds formed on one surface of the first dielectric layer to be parallel; first signal lines formed between the plurality of first side grounds; and a plurality of through holes which is formed in each of the plurality of first side grounds with an interval, along a length direction of the first side grounds.
    Type: Application
    Filed: September 20, 2021
    Publication date: June 9, 2022
    Inventors: Byung-hoon JO, Ik-soo KIM, Byung-yeol KIM, Hee-seok JUNG
  • Publication number: 20210242554
    Abstract: The present invention relates to a transmission line having improved bending durability, which includes a strip structure or a micro-strip structure that is divided into a base part and a bending part that is bent and unfolded based on the base part, wherein the base part and the bending part include a signal line configured to extend in a length direction so as to transmit a high frequency signal, a first dielectric of which an upper surface or a lower surface is provided with the signal line formed thereon, and a second dielectric formed above the first dielectric; and the second dielectric is coupled to the first dielectric in the base part and separated from the first dielectric in the bending part.
    Type: Application
    Filed: July 18, 2019
    Publication date: August 5, 2021
    Inventors: Sang Pil KIM, Byung Hoon JO, Da Yeon LEE, Byung Yeol KIM, Hee seok JUNG
  • Publication number: 20210163914
    Abstract: A fusion tag according to an embodiment of the present invention may increase the water solubility and expression level of a target protein. As the water solubility and expression level of a target protein in host cell can be increased by a recombinant vector including the fusion tag, the fusion tag can be advantageously used in industry.
    Type: Application
    Filed: December 28, 2018
    Publication date: June 3, 2021
    Applicant: INDUSTRY-ACADEMIC COOPERATION FOUNDATION GYEONGSANG NATIONAL UNIVERSITY
    Inventor: Byung-hoon JO
  • Patent number: 10681803
    Abstract: In one example, a flexible circuit board includes a signal line disposed between a first ground and a second ground; a dielectric disposed between the first ground and the signal line and between the second ground and the signal line; and a flatness improvement portion disposed on an upper portion of the second ground.
    Type: Grant
    Filed: December 19, 2018
    Date of Patent: June 9, 2020
    Assignee: GIGALANE CO., LTD.
    Inventors: Byung Hoon Jo, Sang Pil Kim, Byung Yeol Kim, Hee seok Jung
  • Patent number: 10624209
    Abstract: A flexible printed circuit board is introduced. The flexible printed circuit board of the present invention has a first substrate part, comprising a first signal line, and a second substrate part, comprising a second signal line that is parallel to the first signal line, arranged on the same plane while having a shielding part interposed therebetween.
    Type: Grant
    Filed: February 6, 2017
    Date of Patent: April 14, 2020
    Assignee: GIGALANE CO., LTD.
    Inventors: Ik Soo Kim, Byung Yeol Kim, Sang Pil Kim, Byung Hoon Jo, Da Yeon Lee, Hwang Sub Koo, Hyun Je Kim, Hee Seok Jung
  • Patent number: 10512158
    Abstract: In one example, a flexible circuit board includes a signal line disposed between a first ground and a second ground; a dielectric disposed between the first ground and the signal line and between the second ground and the signal line; a cover layer disposed below the first ground and having openings formed therein such that the first ground is exposed at certain intervals; and a position alignment portion formed across the opening and configured to bisect an area of the opening.
    Type: Grant
    Filed: December 19, 2018
    Date of Patent: December 17, 2019
    Assignee: GigaLane Co., Ltd.
    Inventors: Sang Pil Kim, Byung Hoon Jo, Byung Yeol Kim, Hee seok Jung
  • Patent number: 10448499
    Abstract: In one example, a flexible circuit board includes a signal line disposed between a first ground and a second ground; a dielectric disposed between the first ground and the signal line and between the second ground and the signal line; and via holes formed by filling a plurality of holes, which are formed in a vertical direction such that the first ground and the second ground are electrically connected, with conductors, wherein the signal line is laterally bent so as to be spaced apart from positions where the via holes are formed.
    Type: Grant
    Filed: December 19, 2018
    Date of Patent: October 15, 2019
    Assignee: GigaLane Co., Ltd.
    Inventors: Sang Pil Kim, Byung Hoon Jo, Da Yeon Lee, Byung Yeol Kim, Hee seok Jung
  • Patent number: 10440816
    Abstract: In one example, a flexible circuit board includes a signal line disposed between a first ground and a second ground; a dielectric disposed between the first ground and the signal line and between the second ground and the signal line; a cover layer disposed below the first ground and having openings formed therein such that the first ground is exposed at certain intervals; and a position alignment portion formed across the opening and configured to bisect an area of the opening.
    Type: Grant
    Filed: May 29, 2019
    Date of Patent: October 8, 2019
    Assignee: GigaLane Co., Ltd.
    Inventors: Sang Pil Kim, Byung Hoon Jo, Byung Yeol Kim, Hee seok Jung
  • Patent number: 10440815
    Abstract: In one example, a flexible circuit board includes a signal line disposed between a first ground and a second ground; a dielectric disposed between the first ground and the signal line and between the second ground and the signal line; a cover layer disposed below the first ground and having openings formed therein such that the first ground is exposed at certain intervals; and a position alignment portion formed across the opening and configured to bisect an area of the opening.
    Type: Grant
    Filed: May 29, 2019
    Date of Patent: October 8, 2019
    Assignee: GigaLane Co., Ltd.
    Inventors: Sang Pil Kim, Byung Hoon Jo, Byung Yeol Kim, Hee seok Jung
  • Publication number: 20190281696
    Abstract: In one example, a flexible circuit board includes a signal line disposed between a first ground and a second ground; a dielectric disposed between the first ground and the signal line and between the second ground and the signal line; a cover layer disposed below the first ground and having openings formed therein such that the first ground is exposed at certain intervals; and a position alignment portion formed across the opening and configured to bisect an area of the opening.
    Type: Application
    Filed: May 29, 2019
    Publication date: September 12, 2019
    Inventors: Sang Pil Kim, Byung Hoon Jo, Byung Yeol Kim, Hee seok Jung
  • Publication number: 20190281695
    Abstract: In one example, a flexible circuit board includes a signal line disposed between a first ground and a second ground; a dielectric disposed between the first ground and the signal line and between the second ground and the signal line; a cover layer disposed below the first ground and having openings formed therein such that the first ground is exposed at certain intervals; and a position alignment portion formed across the opening and configured to bisect an area of the opening.
    Type: Application
    Filed: May 29, 2019
    Publication date: September 12, 2019
    Inventors: Sang Pil Kim, Byung Hoon Jo, Byung Yeol Kim, Hee seok Jung
  • Patent number: 10365687
    Abstract: A laptop computer, according to the present invention, comprises: a main body part comprising a mainboard and a coaxial cable, one end of which is connected to the mainboard; and a display part hinge-coupled with the main body part and comprising a flexible printed circuit board which is installed on the back of the display part and has one end thereof coupled with the other end of the coaxial cable.
    Type: Grant
    Filed: July 5, 2016
    Date of Patent: July 30, 2019
    Assignee: GIGALANE CO., LTD.
    Inventors: Ik Soo Kim, Byung Yeol Kim, Sang Pil Kim, Byung Hoon Jo, Da Yeon Lee, Hwang Sub Koo, Hyun Je Kim, Hee Seok Jung
  • Publication number: 20190230787
    Abstract: In one example, a flexible circuit board includes a signal line disposed between a first ground and a second ground; a dielectric disposed between the first ground and the signal line and between the second ground and the signal line; and a flatness improvement portion disposed on an upper portion of the second ground.
    Type: Application
    Filed: December 19, 2018
    Publication date: July 25, 2019
    Inventors: Byung Hoon Jo, Sang Pil Kim, Byung Yeol Kim, Hee seok Jung
  • Publication number: 20190230786
    Abstract: In one example, a flexible circuit board includes a signal line disposed between a first ground and a second ground; a dielectric disposed between the first ground and the signal line and between the second ground and the signal line; a cover layer disposed below the first ground and having openings formed therein such that the first ground is exposed at certain intervals; and a position alignment portion formed across the opening and configured to bisect an area of the opening.
    Type: Application
    Filed: December 19, 2018
    Publication date: July 25, 2019
    Inventors: Sang Pil Kim, Byung Hoon Jo, Byung Yeol Kim, Hee seok Jung
  • Patent number: D886073
    Type: Grant
    Filed: July 6, 2018
    Date of Patent: June 2, 2020
    Assignee: GIGALANE CO., LTD.
    Inventors: Sang Pil Kim, Ik Soo Kim, Byung Yeol Kim, Byung Hoon Jo, Hee seok Jung