Patents by Inventor Byung Hwa Lee

Byung Hwa Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8165645
    Abstract: There is provided a mobile communication terminal case including: a case body of a mobile communication terminal having a first surface and a second surface opposite to the first surface, and a via hole formed through the first surface and the second surface; a conductive pattern provided on the first surface of the case body; a carrier film provided on the first surface of the case body to cover the conductive pattern; and conductive epoxy filling the via hole and having one end thereof in contact with the conductive pattern.
    Type: Grant
    Filed: December 10, 2008
    Date of Patent: April 24, 2012
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Byung Hwa Lee, Yong Won Yu, Hyun Sam Mun, Young Suk Kim
  • Publication number: 20110291899
    Abstract: An antenna radiator includes a plurality of antenna pattern radiators including antenna pattern portions receiving or transmitting an external signal, respectively, a bridge configured to connect the antenna pattern portions, and a cutting assistance part formed in a connection portion between the bridge and the antenna pattern portions and facilitating detachment of the bridge from the antenna pattern portions.
    Type: Application
    Filed: March 23, 2011
    Publication date: December 1, 2011
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sung Eun CHO, Ha Ryong HONG, Tae Sung KIM, Byung Hwa LEE, Dae Kyu LEE, Chan Gwang AN, Jae Suk SUNG, Hyun Sam MUN, Dae Ki LIM, Sang Woo BAE
  • Publication number: 20110278186
    Abstract: There is provided an electronic device case having a low frequency antenna pattern embedded therein, the case including: a radiator frame injection molded using a polymer mixture containing a magnetic substance component so that a radiator including a low frequency antenna pattern part is formed on one surface thereof; a case frame injection molded upwardly of the radiator frame and provided with the radiator embedded between the radiator frame and the case frame; and a boundary part forming a boundary between the radiator frame and the case frame and having a groove formed inwardly of the case frame.
    Type: Application
    Filed: May 9, 2011
    Publication date: November 17, 2011
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD
    Inventors: Jae Suk SUNG, Ha Ryong HONG, Ki Won CHANG, Hyun Sam MUN, Dae Kyu LEE, Byung Hwa LEE, Tae Sung KIM, Dae Ki LIM, Yong Shik NA, Duk Woo LEE
  • Publication number: 20110199269
    Abstract: There is provided an antenna pattern frame according to one embodiment of the present invention, including: a radiator frame that has an insertion groove formed on one surface of the radiator frame and is provided with a through part connected from one point of the insertion groove to an opposite surface to the one surface of the radiator frame; and a wire antenna that includes an antenna pattern part formed to be inserted into the insertion groove and an interconnection part formed to be exposed to the opposite surface by extending from the antenna pattern part and penetrating through the through part.
    Type: Application
    Filed: February 8, 2011
    Publication date: August 18, 2011
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Suk SUNG, Ha Ryong HONG, Sung Eun CHO, Tae Sung KIM, Byung Hwa LEE, Hyun Sam MUN, Dae Seong JEON, Duk Woo LEE, Dae Kyu LEE, Chan Gwang AN
  • Publication number: 20110036048
    Abstract: The present invention relates to a building that uses composite light-weight panels for structure and a construction method therefor, more particularly, to a building constructed without pillars using composite light weight panels for structure and a construction method therefor, wherein the building comprises: a steel floor made out of sectional steel for example; walls which are formed by joining composite light-weight panels for structure having steel structure frames installed at corners to the steel floor by welding or joining means, neighboring steel structure frames being joined together by welding or joining means to form walls; roof frames which are constituted by a steel structure and have a truss structure to be positioned on the top of the walls and joined to the wall panels by welding or joining means; wall inner/outer coverings applied to the inner/outer peripherals of the walls; and roof coverings applied to the outer peripheral face of the roof frame.
    Type: Application
    Filed: April 23, 2009
    Publication date: February 17, 2011
    Inventors: Byung Hwa Lee, Kyung Hoon Kim
  • Publication number: 20100271283
    Abstract: An antenna pattern frame according to an aspect of the invention may include: a radiator having an antenna pattern portion transmitting and receiving a signal and a connection terminal portion allowing the signal to be transmitted to and received from a circuit board of an electronic device; a connection portion partially forming the radiator and connecting the antenna pattern portion and the connection terminal portion to be arranged in different planes; a radiator frame manufactured by injection molding on the radiator so that the antenna pattern portion may be provided on one side of the radiator frame and the connection terminal portion may be provided on the other side thereof, while the antenna pattern portion is embedded in the electronic device case; and a contact surface extension provided on the radiator to prevent the radiator from being loosened from the radiator frame during injection molding of the radiator frame, and increasing a contact area with respect to the radiator frame.
    Type: Application
    Filed: December 23, 2009
    Publication date: October 28, 2010
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Suk SUNG, Dae Seong JEON, Hyun Kil NAM, Sung Eun CHO, Tae Sung KIM, Chan Gwang AN, Hyun Do PARK, Chang Mok HAN, Byung Hwa LEE, Jung Eun NOH
  • Publication number: 20100271272
    Abstract: An antenna pattern frame according to an aspect of the invention may include: a radiator having an antenna pattern portion transmitting and receiving a signal; a ground portion extending from the antenna pattern portion; a connection portion connecting the antenna pattern portion and the ground portion to be arranged in different planes; and a radiator frame manufactured by injection molding on the radiator so that the antenna pattern portion may be provided on one side of the radiator frame and the connection terminal portion may be provided on the other side thereof, the radiator frame allowing the antenna pattern portion to be embedded in the electronic device case.
    Type: Application
    Filed: December 30, 2009
    Publication date: October 28, 2010
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jae Suk Sung, Ki Won Chang, Ha Ryong Hong, Chang Mok Han, Chan Gwang An, Duk Woo Lee, Hyun Kil Nam, Dae Kyu Lee, Sang Woo Bae, Byung Hwa Lee
  • Publication number: 20100220028
    Abstract: A method of manufacturing an antenna-embedded case for a mobile communications terminal includes providing an antenna pattern, forming a first injection-molded member covering one surface of the antenna pattern, and disposing the first injection-molded member, provided with the antenna pattern on one surface thereof, in a second mold with the antenna pattern disposed in a space inside the second mold, and injection-molding a second injection-molded member covering the other surface of the antenna pattern to embed the antenna pattern between the first injection-molded member and the second injection-molded member.
    Type: Application
    Filed: October 29, 2009
    Publication date: September 2, 2010
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Sung Eun CHO, Jae Gyu GO, Yong Shik NA, Dae kyu LEE, Chan Gwang AN, Hyun Kil NAM, Byung Hwa LEE, Dae Seong JEON, Ha Ryong HONG, Jae Suk SUNG
  • Publication number: 20100035671
    Abstract: There is provided a mobile communication terminal case including: a case body of a mobile communication terminal having a first surface and a second surface opposite to the first surface, and a via hole formed through the first surface and the second surface; a conductive pattern provided on the first surface of the case body; a carrier film provided on the first surface of the case body to cover the conductive pattern; and conductive epoxy filling the via hole and having one end thereof in contact with the conductive pattern.
    Type: Application
    Filed: December 10, 2008
    Publication date: February 11, 2010
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Byung Hwa LEE, Yong Won Yu, Hyun Sam Mun, Young Suk Kim