Patents by Inventor Byung Hwa Shim

Byung Hwa Shim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240145167
    Abstract: A multilayer capacitor includes a body including dielectric layers and internal electrodes and external electrodes disposed on an external surface of the body and connected to the internal electrodes. The body includes a first surface and a second surface to which the internal electrodes are exposed, the first surface and the second surface opposing each other in a first direction, a third surface and a fourth surface opposing each other in a second direction which is a direction in which the dielectric layers are stacked, and a fifth surface and a sixth surface opposing each other in a third direction. At least one of the internal electrodes include a first bottleneck structure having a first directional length of a third-directional outer region smaller than an inner region thereof and a second bottleneck structure having a third directional length of a first directional outer region smaller than an inner region thereof.
    Type: Application
    Filed: January 10, 2024
    Publication date: May 2, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jong Ho Lee, Myung Chan Son, Sim Chung Kang, Eun Jin Shim, Sun Hwa Kim, Byung Soo Kim
  • Publication number: 20040024704
    Abstract: The present invention relates to the method and device through which, for the purpose of a purchasing companies making payments for goods, services or construction services of a transaction partner: (1) an account receivable transfer contract between a financial institution and the purchasing company is certified and authenticated by a certified electronic authentication institution based upon the details of the account receivable that the purchasing company transmits via the telecommunication network, which account receivable is to be used as collateral and (2) the amount equivalent to the amount of the account receivable is provided to the transaction partner by the virtue of the loan provided until the due date of the account receivable (which is the conventional bill maturity date) based upon the said certified and authenticated account receivable transfer contract.
    Type: Application
    Filed: June 25, 2003
    Publication date: February 5, 2004
    Inventors: Dong Lyun Yim, Bok Sun Hwang, Sang In Lee, Byung Hwa Shim