Patents by Inventor Byung Hwi KIM

Byung Hwi KIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240136356
    Abstract: A semiconductor device includes a first element separation structure, a second element separation structure, and a third element separation structure sequentially disposed along a first direction and extending in a second direction intersecting the first direction; a first active pattern extending in the first direction between the first element separation structure and the second element separation structure; a second active pattern extending in the first direction between the second element separation structure and the third element separation structure and separated from the first active pattern by the second element separation structure; a first gate electrode extending in the second direction on the first active pattern; and a plurality of second gate electrodes extending in the second direction on the second active pattern, wherein a width of the first active pattern in the second direction is greater than a width of the second active pattern in the second direction.
    Type: Application
    Filed: October 12, 2023
    Publication date: April 25, 2024
    Inventors: Byeol Hae EOM, Byung Ha CHOI, Keun Hwi CHO, Sung Won KIM, Yuri MASUOKA, Won Cheol JEONG
  • Publication number: 20240130849
    Abstract: Disclosed are an artificial implant and a method for manufacturing same, the artificial implant comprising: a silicone shell consisting of an upper portion, a lower portion, and a side portion; and a filler injected into the silicone shell, wherein the silicone shell includes at least one silicone layer and at least one reinforcing layer, the reinforcing layer being provided on at least a portion of the lower portion and the side portion of the silicone shell, or the silicone shell includes a layered structure having a step.
    Type: Application
    Filed: February 11, 2022
    Publication date: April 25, 2024
    Applicant: OSSTEMIMPLANT CO., LTD.
    Inventors: Eun Jung SIM, Byung Hwi KIM, Min Kyoung KIM, Ju Dong SONG, ll Seok JANG
  • Publication number: 20240130848
    Abstract: Disclosed is an artificial implant comprising: a silicone shell; and a filler filling the interior of the shell, wherein at least a portion of the shell is a rupture-prevention part comprising two or more silicone layers and one or more reinforcing material layers interposed therebetween.
    Type: Application
    Filed: February 11, 2022
    Publication date: April 25, 2024
    Applicant: OSSTEMIMPLANT CO., LTD.
    Inventors: Eun Jung SIM, Byung Hwi KIM, Min Kyoung KIM, Ju Dong SONG, II Seok JANG
  • Publication number: 20240134292
    Abstract: A substrate treatment apparatus according to an aspect of the present invention includes: a support plate that supports a substrate and is provided with a heater member for heating the substrate; and a cooling unit for forcedly cooling the support plate, wherein the cooling unit includes: a cooling housing to provide a cooling space; a plurality of gas feed nozzles that is arranged in the cooling housing and supplies cooling gas toward the heater member; and a plurality of gas feed lines that is directly connected to the gas feed nozzles and supplies the cooling gas transferred from the outside to the gas feed nozzles.
    Type: Application
    Filed: October 4, 2023
    Publication date: April 25, 2024
    Applicant: SEMES CO., LTD.
    Inventors: Minhee CHO, Hee Man AHN, Gyeong Won SONG, Jumi LEE, Chun Woo PARK, Byung Hwi KIM
  • Patent number: 11939698
    Abstract: A wafer manufacturing method, an epitaxial wafer manufacturing method, and a wafer and epitaxial wafer manufactured thereby, are provided. The wafer manufacturing method enables the manufacture of a wafer with a low density of micropipe defects and minimum numbers of particles and scratches. The epitaxial wafer manufacturing method enables the manufacture of an epitaxial wafer that has low densities of defects such as downfall, triangular, and carrot defects, exhibits excellent device characteristics, and improves the yield of devices.
    Type: Grant
    Filed: November 3, 2020
    Date of Patent: March 26, 2024
    Assignee: SENIC INC.
    Inventors: Jong Hwi Park, Jung-Gyu Kim, Eun Su Yang, Byung Kyu Jang, Jung Woo Choi, Yeon Sik Lee, Sang Ki Ko, Kap-Ryeol Ku
  • Publication number: 20240092141
    Abstract: An air conditioning device for a vehicle includes: a housing having an inside divided into an inflow space, a heat exchange space, and an outflow space, which are straightly arranged, and having a plurality of discharge ports, which communicates with an interior, at the inflow space; a blowing unit disposed at the inflow space of the housing and configured to blow air; a heat exchange unit disposed at the heat exchange space of the housing and configured to adjust a temperature of conditioned air by exchanging heat with air; and an opening-closing door disposed at the outflow space of the housing and configured to open and close the plurality of discharge ports such that conditioned air at an adjusted temperature selectively flows to the plurality of discharge ports. The air conditioning device adjusts the temperature of conditioned air for respective modes and reduces a flow resistance of air.
    Type: Application
    Filed: March 8, 2023
    Publication date: March 21, 2024
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, DOOWON CLIMATE CONTROL CO., LTD.
    Inventors: Kwang Ok Han, Young Tae Song, Yong Chul Kim, Gee Young Shin, Su Yeon Kang, Jae Sik Choi, Dae Hee Lee, Byeong Moo Jang, Ung Hwi Kim, Jae Won Cha, Won Jun Joung, Byung Guk An
  • Publication number: 20240076799
    Abstract: A wafer manufacturing method, an epitaxial wafer manufacturing method, and a wafer and epitaxial wafer manufactured thereby, are provided. The wafer manufacturing method enables the manufacture of a wafer with a low density of micropipe defects and minimum numbers of particles and scratches. The epitaxial wafer manufacturing method enables the manufacture of an epitaxial wafer that has low densities of defects such as downfall, triangular, and carrot defects, exhibits excellent device characteristics, and improves the yield of devices.
    Type: Application
    Filed: November 1, 2023
    Publication date: March 7, 2024
    Applicant: SENIC INC.
    Inventors: Jong Hwi PARK, Jung-Gyu KIM, Eun Su YANG, Byung Kyu JANG, Jung Woo CHOI, Yeon Sik LEE, Sang Ki KO, Kap-Ryeol KU
  • Publication number: 20230408200
    Abstract: The substrate processing apparatus of the present invention comprises a hot plate for heating a substrate; and a cooling unit for cooling the hot plate; wherein the cooling unit includes a support plate having a space formed between the support plate and the hot plate, and a plurality of nozzles installed on the support plate and for supplying cooling gas to a bottom surface of the hot plate, wherein an outdoor air inlet passage provided in a through structure is provide in the support plate, wherein a portion of the outdoor air inlet passage forms a first region, through which a cable passes, and the remaining portion forms a second region, through which the cable does not pass and outdoor air introduces.
    Type: Application
    Filed: May 4, 2023
    Publication date: December 21, 2023
    Inventors: Ju Mi LEE, Gyeong Won SONG, Min Hee CHO, Byung Hwi KIM, Chun Woo PARK, Hee Man AHN
  • Publication number: 20200268937
    Abstract: Disclosed are a composition for surface modification of a medical implant and a medical implant surface-modified thereby, and according to a medical implant according to one embodiment, itaconic acid may be bound to the surface of the medical implant with high binding stability, and fibrosis inhibition and inflammatory response inhibition effects at an implantation site are exhibited.
    Type: Application
    Filed: July 18, 2018
    Publication date: August 27, 2020
    Applicant: SEOUL NATIONAL UNIVERSITY HOSPITAL
    Inventors: Chan Yeong Heo, Han Soo Park, Byung Hwi Kim, Byung Ho Shin, Jung Hee Shim, Mallinath S Birajdar, Hyun Joo Cho, Chanutchamon Sutthiwanjampa
  • Patent number: 9642697
    Abstract: The present invention relates to a breast prosthesis allowing controlled release of a drug and to a production method for same, and more specifically, relates to a breast prosthesis allowing controlled release of a drug by the coupling of a drug layer comprising particles carrying the drug on the breast prosthesis, and to a production method for same.
    Type: Grant
    Filed: April 24, 2013
    Date of Patent: May 9, 2017
    Assignee: SNU R&DB FOUNDATION
    Inventors: Chan Yeong Heo, Young Bin Choy, Min Park, Su Bin Park, Won Seok Lee, Byung Hwi Kim
  • Publication number: 20150313707
    Abstract: The present invention relates to a breast prosthesis allowing controlled release of a drug and to a production method for same, and more specifically, relates to a breast prosthesis allowing controlled release of a drug by the coupling of a drug layer comprising particles carrying the drug on the breast prosthesis, and to a production method for same.
    Type: Application
    Filed: April 24, 2013
    Publication date: November 5, 2015
    Inventors: Chan Yeong Heo, Young Bin Choy, Min Park, Su Bin Park, Won Seok Lee, Byung Hwi Kim
  • Publication number: 20150273119
    Abstract: Disclosed is a formulation for coating a medical device which comprises an anti-scarring agent and a biocompatible polymer for regulating the release of the anti-scarring agent, wherein the mass ratio of the biocompatible polymer to the anti-scaring agent is from 100:15 to 100:0 in which 0 is not included. The present formulation can be advantageously used for coating medical devices for a sustained release of the agents from the device, thus effectively minimizing or preventing the formation of scar tissues resulted from the use of implantable and non-implantable medical devices.
    Type: Application
    Filed: March 26, 2015
    Publication date: October 1, 2015
    Applicant: SNU R&DB FOUNDATION
    Inventors: Chan Yeong HEO, Young Bin CHOY, Sung Yoon CHOI, Byung Hwi KIM, Beom Kang HUH, Min PARK