Abstract: Provided is a Complementary Metal Oxide Semiconductor (CMOS) logic element. The CMOS logic element includes a substrate including a PMOS area, a circuit wiring structure including an insulating layer and a wiring layer alternately stacked on the substrate, wherein the circuit wiring structure includes an NMOS area vertically spaced apart from the PMOS area, a first transistor disposed on the PMOS area, and a second transistor disposed on the NMOS area and complementarily connected to the first transistor, wherein the first transistor includes a first gate electrode, source/drain areas formed on the PMOS area on both sides of the first gate electrode, and a first channel connecting the source and drain areas to each other, wherein the second transistor includes a second gate electrode and a second channel vertically overlapping the second gate electrode, wherein the first channel includes silicon, wherein the second channel includes an oxide semiconductor.

Abstract: The present invention relates to an automatic medical device cleaning agent supply device, comprising a case, peristaltic pump unit, timer unit, foot switch, and controller, that automatically supplies the cleaning solution into the cleaning tank to clean medical devices in an amount relative to the amount of water in the cleaning tank when the foot switch is pressed and wherein an attachment housing is secured on a fixed housing in the peristaltic pump unit in a detachable manner for the attachment housing to be selectively detached to facilitate tube replacement and use, through which the tube, which is a consumable, can be replaced conveniently to ensure the ease of maintenance of the device.

Abstract: Methods of manufacturing a semiconductor chip are provided. The methods may include providing a semiconductor substrate including integrated circuit regions and a cut region. The cut region may be between the integrated circuit regions. The methods may also include forming a modified layer by emitting a laser beam into the semiconductor substrate along the cut region, polishing an inactive surface of the semiconductor substrate to propagate a crack from the modified layer, and separating the integrated circuit regions along the crack. The cut region may include a plurality of multilayer metal patterns on an active surface of the semiconductor substrate, which is opposite to the inactive surface of the semiconductor substrate. The plurality of multilayer metal patterns may form a pyramid structure when viewed in cross section.

Abstract: A vehicle cargo loading system may include a cargo loading portion for loading cargo therein, wherein the cargo loading portion is divided into predetermined zones, a loading state sensor for sensing a loading state of the cargo for each zone, a loading state display for outputting different colors for the zones based on the loading state of the loaded cargo, a user interface for displaying a loading location or the loading state of the cargo, wherein the user interface is installed on an external door glass of the vehicle, and a cargo loading controller that determines whether the cargo loaded in the zone satisfies a preset reference loading state condition, and outputs a wanting signal when the cargo does not satisfy the reference loading state condition.

Abstract: A seat track device of a vehicle is proposed. The seat track device is configured to enable an electric rail module to be attached to and detached from a manual seat track to easily perform the conversion from the manual seat track to an electric seat track. The seat track device includes a seat track including a lower rail and an upper rail that slides along the lower rail, and a power rail module including a module bracket that is removably coupled to both of the upper rail and a seat, the power rail module being configured to transmit power of a drive part to the module bracket so as to allow the upper rail to slide along the lower rail in an electric manner together with the seat.

Abstract: A semiconductor device includes a semiconductor substrate having a scribe lane defined therein. A plurality of semiconductor chips is formed on an upper surface of the semiconductor substrate. At least one conductive structure is arranged on an upper surface of the semiconductor substrate, within the scribe lane thereof. A fillet is arranged on at least one side surface of the conductive structure. The fillet is configured to induce a cut line which spreads along the scribe lane, through a central portion of the conductive structure.

Abstract: A camera mount assembly includes a base configured to be fixed to a support surface, wherein the base includes a first circuit board therein; a mount configured to have a camera mounted thereon, wherein the mount is further configured to rotate about a common axis with respect to the base, and the mount includes a second circuit board therein; a guide frame on one from among the mount and the base, the guide frame including a cam profile; and a cam bolt fixed to the other from among the mount and the base, wherein, based on the mount rotating with respect to the base, one side of the cam bolt is configured to move along the cam profile formed in the guide frame such that a size of a gap between the base and the mount varies.

Abstract: Provided are an optical sensor device using surface acoustic waves and an optical sensor device package. The optical sensor device includes: a substrate including a first light sensing area and a temperature sensing area and including a piezo electric material; a first input electrode and a first output electrode which are disposed in the first light sensing area and are apart from each other with a first delay gap therebetween; a first sensing film overlapping the first delay gap and configured to cover at least some portions of the first input electrode and the first output electrode; and a second input electrode and a second output electrode which are disposed in the temperature sensing area and are apart from each other with a second delay gap therebetween. The second delay gap is exposed to air.

Abstract: A system for controlling an internal temperature of a vehicle when an engine is turned off includes a temperature sensor configured to measure an internal temperature (Ti) of a vehicle; a first blower configured to discharge cooled air when an electric power is supplied to the first blower; a battery; and a control unit electrically connected to the temperature sensor and the first blower and configured to receive the internal temperature (Ti) of the vehicle from the temperature sensor, and to operate the first blower, in which the control unit electrically connected to the battery is configured to control an electric power of the battery to be applied to the first blower when the internal temperature (Ti) of the vehicle is equal to or greater than a predetermined reference temperature (Tr) in a state where an engine of the vehicle is turned off.

Abstract: A camera driving device is provided. The camera driving device includes: a motor configured to generate a driving force; an input pulley attached to the motor; a gear assembly including a first gear coupled to the input pulley by a first timing belt, and a second gear formed coaxially with the first gear, the second gear configured to rotate together with the first gear; and an output pulley configured to rotate together with the second gear by a second timing belt, wherein a reduction is made according to a gear transmission ratio between the input pulley and the first gear, a reduction is made according to a gear transmission ratio between the second gear and the output pulley, and a rotation shaft of the output pulley is positioned between a rotation shaft of the input pulley and a rotation shaft of the first gear.

Abstract: An air suspension apparatus for vehicle seats includes an air shutter connected to a supply port of a control valve configured to supply air so as to adjust the opening degree of an inner air channel through which air supplied to the control valve passes.

Abstract: An air suspension apparatus for vehicle seats includes an air shutter connected to a supply port of a control valve configured to supply air so as to adjust the opening degree of an inner air channel through which air supplied to the control valve passes.

Abstract: A semiconductor chip includes a substrate including: a main chip region; and a scribe lane surrounding the main chip region; a lower interlayer insulating layer disposed on the substrate in the scribe lane; a circuit structure disposed on the lower interlayer insulating layer in the scribe lane; and a pad structure disposed on the lower interlayer insulating layer. The circuit structure and the pad structure are disposed to be spaced apart from each other in a longitudinal direction of the scribe lane.

Abstract: The present invention relates to an automatic medical device cleaning agent supply device, comprising a case, peristaltic pump unit, timer unit, foot switch, and controller, that automatically supplies the cleaning solution into the cleaning tank to clean medical devices in an amount relative to the amount of water in the cleaning tank when the foot switch is pressed and wherein an attachment housing is secured on a fixed housing in the peristaltic pump unit in a detachable manner for the attachment housing to be selectively detached to facilitate tube replacement and use, through which the tube, which is a consumable, can be replaced conveniently to ensure the ease of maintenance of the device.

Abstract: Provided are an optical sensor device using surface acoustic waves and an optical sensor device package. The optical sensor device includes: a substrate including a first light sensing area and a temperature sensing area and including a piezo electric material; a first input electrode and a first output electrode which are disposed in the first light sensing area and are apart from each other with a first delay gap therebetween; a first sensing film overlapping the first delay gap and configured to cover at least some portions of the first input electrode and the first output electrode; and a second input electrode and a second output electrode which are disposed in the temperature sensing area and are apart from each other with a second delay gap therebetween. The second delay gap is exposed to air.

Abstract: A vehicle cargo loading system may include a cargo loading portion for loading cargo therein, wherein the cargo loading portion is divided into predetermined zones, a loading state sensor for sensing a loading state of the cargo for each zone, a loading state display for outputting different colors for the zones based on the loading state of the loaded cargo, a user interface for displaying a loading location or the loading state of the cargo, wherein the user interface is installed on an external door glass of the vehicle, and a cargo loading controller that determines whether the cargo loaded in the zone satisfies a preset reference loading state condition, and outputs a wanting signal when the cargo does not satisfy the reference loading state condition.

Abstract: A semiconductor device includes a semiconductor substrate having a scribe lane defined therein. A plurality of semiconductor chips is formed on an upper surface of the semiconductor substrate. At least one conductive structure is arranged on an upper surface of the semiconductor substrate, within the scribe lane thereof. A fillet is arranged on at least one side surface of the conductive structure. The fillet is configured to induce a cut line which spreads along the scribe lane, through a central portion of the conductive structure.

Abstract: A pan motion camera including a motor providing a rotational driving force; a rotating member rotating around a rotation axis according to the rotation driving force; at least one camera module mounted on the rotating member and rotating together with the rotating member; at least one lighting module mounted on a position corresponding to the at least one camera module on the rotating member and rotating together without movement relative to the at least one camera module; and a light blocking member fixed to a side of a camera housing and blocking light emitted from the lighting module from flowing into a lens of the camera module without contacting the rotating member.

Abstract: A semiconductor chip including an alignment pattern is provided. The semiconductor chip includes a substrate associated with a main chip region of a semiconductor wafer and including a scribe lane. A lower interlayer insulating layer is disposed on the substrate, a low-K layer including dummy metal patterns is disposed on the lower interlayer insulating layer, an alignment pattern is disposed on the low-K layer, and a passivation layer covers the alignment pattern.

Abstract: A cold crucible structure according to an embodiment of the present invention includes a cold crucible structure according to an embodiment of the present invention includes: a cold crucible unit including hollow top and bottom caps, a plurality of segments connecting the top cap and the bottom cap, slits disposed between the segments, and a reaction area surrounded by the segments; and an induction coil unit disposed to cover the outer side of the cold crucible unit and disposed across the longitudinal directions of the segments and the slits, in which the diameter of the reaction area is defined as a crucible diameter, the crucible diameter is 100 to 300 mm, and a width of each of the slits is defined by d slit ? 0.3 × ? 50 (mm)(where dslit is the width of each of the slits and Ø is the crucible diameter).