Patents by Inventor Byung-Joo Park
Byung-Joo Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240158015Abstract: A chassis cab vehicle includes a lower frame, which constitutes a lower structure of the vehicle and is equipped with a pair of side members extending in a lengthwise direction of the vehicle. A battery is coupled between the side members. An upper body is coupled to a front portion of the lower frame and forms a cabin interior. A side sill is formed at a lower end at each side of the upper body and extends to a rear side of the cabin interior. The side sills overlap the respective side members in a lateral direction of the vehicle when coupled to the lower frame.Type: ApplicationFiled: March 7, 2023Publication date: May 16, 2024Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATIONInventors: Seung Hak Lee, Mi Ran Park, Won Hae Lee, Ha Yeon Kwon, Byung Joo Chung, Seung Min Kang, Seung Min Jeong
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Publication number: 20240110170Abstract: The present disclosure relates to a modified polypeptide having xylanase activity and the use thereof.Type: ApplicationFiled: December 15, 2021Publication date: April 4, 2024Applicant: CJ CHEILJEDANG CORPORATIONInventors: Tae Joo YANG, Jihyun SHIM, Eun Jung CHOI, Byung-sam SON, Jae Yong PARK
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Publication number: 20240109595Abstract: A frame structure for a vehicle includes: an inner panel connected to a side member and defining an inner side of a rear part of the side member; an outer panel connected to a rear side of the side member and coupled to an outer side of the inner panel defining a closed cross-section together with the inner panel and defining an outer side of the rear part of the side member; an opening portion formed below the inner and outer panels partially opening the closed cross-section so that a front end of a rear suspension arm can be inserted into the opening portion; and a reinforcing member disposed in the opening portion defining the closed cross-section together with the outer panel and the inner panel and configured to close an internal space in the outer and inner panels.Type: ApplicationFiled: January 25, 2023Publication date: April 4, 2024Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATIONInventors: Won Hae Lee, Nam Ho Kim, Mi Ran Park, Ha Yeon Kwon, Byung Joo Chung, Seung Hak Lee, Min Seok Kim
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Publication number: 20240014589Abstract: Disclosed is an elastic electric contact terminal that does not give an effect on a metal layer even when a core is pressed by external force. The elastic electric contact terminal includes an elastic core, a heat-resistant polymer film that surrounds the core and is attached to top and bottom surfaces of the core with an adhesive layer therebetween, and a metal layer disposed on an outer surface of the polymer film. At least one sidewall of the core is pressed inward to form a folded portion, and a space is defined between an inner surface of the polymer film and the sidewall of the core by the folded portion.Type: ApplicationFiled: July 11, 2023Publication date: January 11, 2024Inventors: Sun-Ki Kim, Byung-Joo Park, Jin-San Kim, Hyoung-Kyu Kim
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Publication number: 20230420157Abstract: Disclosed is an elastic electric contact terminal capable of implementing various electrical pathways. The electric contact terminal includes: an elastic core; a polymer film surrounding the core in a width direction thereof; and a conductive laminate in which a metal foil is laminated on an outer surface of the polymer film. The polymer film is bonded to top and bottom surfaces of the core with an adhesive layer therebetween, and one end of the conductive laminate extends lengthily to the outside of the core to form a terminal part.Type: ApplicationFiled: June 23, 2023Publication date: December 28, 2023Inventors: Sun-Ki Kim, Gang-Yeol Lee, Byung-Joo Park, Hyoung-Kyu Kim
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Publication number: 20230299526Abstract: Disclosed is an electrical contact terminal having elasticity, which is fitted into a through-hole defined on a substrate so as to electrically connect a conductive pattern defined on the substrate to an object. A core of the electrical contact terminal includes a body part having a first width with a uniform dimension in a longitudinal direction, an insertion part having a second width with a dimension less than that of the first width and extending vertically downward from the body part, and a contact part protruding in the form of a wing from each of both sides of an end of the insertion part in a width direction, wherein the body part, the insertion part, and the contact part are provided as a single body.Type: ApplicationFiled: March 14, 2023Publication date: September 21, 2023Inventors: Sun-Ki Kim, Byung-Joo Park, Hyoung-Kyu Kim, Jin-San Kim
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Publication number: 20230166863Abstract: A method and apparatus for inspecting an aeronautical light using an aerial vehicle are disclosed. The method includes defining a first reference point based on a plurality of aeronautical lights installed on a runway surface, and defining a second reference point based on the first reference point, defining a flight path of the aerial vehicle taking off from the second reference point and heading to the first reference point, transmitting, to the ground, an image of the aeronautical lights photographed by the aerial vehicle, and inspecting and adjusting elevation angles of the aeronautical lights by analyzing the image of the aeronautical lights in real time.Type: ApplicationFiled: June 9, 2021Publication date: June 1, 2023Inventors: Jin Seob JUNG, Chae Taek LIM, Byung Joo PARK, Dae Sin YU, Dae Young LIM, Kwang Ock RYU, Young Il GO
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Patent number: 10201328Abstract: Disclosed herein are an ultrasonic diagnostic apparatus, and a manufacturing method thereof. The ultrasonic diagnostic apparatus includes: a matching layer; a flexible printed circuit board having steps at both edge portions; a piezoelectric layer disposed below the matching layer and on the flexible printed circuit board such that a first electrode and a second electrode of the piezoelectric layer, between which steps are formed and which are separated from each other by polarization areas, are respectively connected to a first electrode and a second electrode of the flexible printed circuit board; and a backing layer disposed below the piezoelectric layer.Type: GrantFiled: December 19, 2014Date of Patent: February 12, 2019Assignee: SAMSUNG MEDISON CO., LTD.Inventor: Byung Joo Park
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Publication number: 20150173714Abstract: Disclosed herein are an ultrasonic diagnostic apparatus, and a manufacturing method thereof. The ultrasonic diagnostic apparatus includes: a matching layer; a flexible printed circuit board having steps at both edge portions; a piezoelectric layer disposed below the matching layer and on the flexible printed circuit board such that a first electrode and a second electrode of the piezoelectric layer, between which steps are formed and which are separated from each other by polarization areas, are respectively connected to a first electrode and a second electrode of the flexible printed circuit board; and a backing layer disposed below the piezoelectric layer.Type: ApplicationFiled: December 19, 2014Publication date: June 25, 2015Inventor: Byung Joo PARK
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Patent number: 8034200Abstract: A nanometer-sized porous metallic glass and a method for manufacturing the same are provided. The porous metallic glass includes Ti (titanium) at 50.0 at % to 70.0 at %, Y (yttrium) at 0.5 at % to 10.0 at %, Al (aluminum) at 10.0 at % to 30.0 at %, Co (cobalt) at 10.0 at % to 30.0 at %, and impurities. Ti +Y+Al+Co+the impurities=100.0 at %.Type: GrantFiled: June 17, 2009Date of Patent: October 11, 2011Assignee: Korea Institute of Science and TechnologyInventors: Eric Fleury, Yu-Chan Kim, Ki-Bae Kim, Jayamani Jayaraj, Do-Hyang Kim, Byung-Joo Park
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Publication number: 20090250143Abstract: A nanometer-sized porous metallic glass and a method for manufacturing the same are provided. The porous metallic glass includes Ti (titanium) at 50.0 at % to 70.0 at %, Y (yttrium) at 0.5 at % to 10.0 at %, Al (aluminum) at 10.0 at % to 30.0 at %, Co (cobalt) at 10.0 at % to 30.0 at %, and impurities. Ti+Y+Al+Co+the impurities=100.0 at %.Type: ApplicationFiled: June 17, 2009Publication date: October 8, 2009Applicant: Korea Institute of Science and TechnologyInventors: Eric Fleury, Yu-Chan Kim, Ki-Bae Kim, Jayamani Jayaraj, Do-Hyang Kim, Byung-Joo Park
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Patent number: 7582173Abstract: Disclosed is a single-phase amorphous alloy having an enhanced ductility. The single-phase amorphous alloy has a composition range of A100-a-bBaCb where a and b are respectively 0<a<15, 0?b?30 in atomic percent. Here, A includes at least one element selected from the group consisting of Be, Mg, Ca, Ti, Zr, Hf, Pt, Pd, Fe, Ni, and Cu. B includes at least one element selected from the group consisting of Y, La, Gd, Nb, Ta, Ag, Au, Co, and Zn. C includes at least one element selected from the group consisting of Al, In, Sn, B, C, Si, and P.Type: GrantFiled: June 2, 2005Date of Patent: September 1, 2009Assignee: Yonsei UniversityInventors: Eun Soo Park, Jong Hyun Na, Hye Jung Chang, Ju Yeon Lee, Byung Joo Park, Won Tae Kim, Do Hyang Kim
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Patent number: 7563332Abstract: A nanometer-sized porous metallic glass and a method for manufacturing the same are provided. The porous metallic glass includes Ti (titanium) at 50.0 at % to 70.0 at %, Y (yttrium) at 0.5 at % to 10.0 at %, Al (aluminum) at 10.0 at % to 30.0 at %, Co (cobalt) at 10.0 at % to 30.0 at %, and impurities. Ti+Y+Al+Co+the impurities=100.0 at %.Type: GrantFiled: November 22, 2006Date of Patent: July 21, 2009Assignee: Korea Institute of Science and TechnologyInventors: Eric Fleury, Yu-Chan Kim, Ki-Bae Kim, Jayamani Jayaraj, Do-Hyang Kim, Byung-Joo Park
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Publication number: 20070267111Abstract: A nanometer-sized porous metallic glass and a method for manufacturing the same are provided. The porous metallic glass includes Ti (titanium) at 50.0 at % to 70.0 at %, Y (yttrium) at 0.5 at % to 10.0 at %, Al (aluminum) at 10.0 at % to 30.0 at %, Co (cobalt) at 10. at % to 30.0 at %, and impurities. Ti+Y+Al+Co+the impurities=100.0 at %.Type: ApplicationFiled: November 22, 2006Publication date: November 22, 2007Applicant: Korea Institute of Science and TechnologyInventors: Eric Fleury, Yu-Chan Kim, Ki-Bae Kim, Jayamani Jayaraj, Do-Hyang Kim, Byung-Joo Park
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Publication number: 20070181148Abstract: Embodiments of the invention provide a semiconductor wafer cleaning apparatus and a related method. In one embodiment, the invention provides a semiconductor wafer cleaning apparatus comprising a wafer stage adapted to support a wafer; a first cleaning unit adapted to spray a first cleaning solution onto the wafer to remove particles from the wafer, wherein the first cleaning solution prevents static electricity from being generated on the surface of the wafer; and a second cleaning unit adapted to provide a second cleaning solution onto the wafer and oscillate a quartz rod to remove particles from the wafer, wherein the second cleaning solution makes a surface of the wafer hydrophilic.Type: ApplicationFiled: December 21, 2006Publication date: August 9, 2007Inventors: Min-Sang Yun, Kwon Son, Jae-Hyung Jung, Hee-Chan Jung, Ki-Ryong Choi, Byung-Joo Park, Kang-Young Kim
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Patent number: 6337242Abstract: A method for fabricating a mixed signal semiconductor device is disclosed.Type: GrantFiled: April 18, 2000Date of Patent: January 8, 2002Assignee: Hyundai Electronics Industries Co., Ltd.Inventor: Byung-Joo Park