Patents by Inventor Byung-joo Youn

Byung-joo Youn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of and apparatus for coating a wafer with a minimal layer of photoresist
    Patent number: 6652911
    Abstract: In a photoresist coating apparatus and method, a rotating wafer is scanned with a spray nozzle from which the photoresist issues. The rotational speed of the wafer is varied based on the relative position of the nozzle above the wafer. The varying of the rotational speed is designed to minimize the amount of photoresist necessary for coating the wafer. Specifically, the photoresist is sprayed from the nozzle while the nozzle scans the wafer in a direction from the peripheral edge of the wafer toward its center, and the rotational speed of the wafer is increased during such scanning.
    Type: Grant
    Filed: October 28, 1999
    Date of Patent: November 25, 2003
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Moon-woo Kim, Byung-joo Youn
  • METHOD OF AND APPARATUS FOR COATING A WAFER WITH A MINIMAL LAYER OF PHOTORESIST
    Publication number: 20020031604
    Abstract: In a photoresist coating apparatus and method, a rotating wafer is scanned with a spray nozzle from which the photoresist issues. The rotational speed of the wafer is varied based on the relative position of the nozzle above the wafer. The varying of the rotational speed is designed to minimize the amount of photoresist necessary for coating the wafer. Specifically, the photoresist is sprayed from the nozzle while the nozzle scans the wafer in a direction from the peripheral edge of the wafer toward its center, and the rotational speed of the wafer is increased during such scanning.
    Type: Application
    Filed: October 28, 1999
    Publication date: March 14, 2002
    Inventors: MOON-WOO KIM, BYUNG-JOO YOUN
  • Method of and apparatus for coating a wafer with a minimal layer of photoresist
    Patent number: 6113697
    Abstract: In a photoresist coating apparatus and method, a rotating wafer is scanned with a spray nozzle from which the photoresist issues. The rotational speed of the wafer is varied based on the relative position of the nozzle above the wafer. The varying of the rotational speed is designed to minimize the amount of photoresist necessary for coating the wafer. Specifically, the photoresist is sprayed from the nozzle while the nozzle scans the wafer in a direction from the peripheral edge of the wafer toward its center, and the rotational speed of the wafer is increased during such scanning.
    Type: Grant
    Filed: July 10, 1998
    Date of Patent: September 5, 2000
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Moon-woo Kim, Byung-joo Youn