Abstract: A light emitting display device includes a light emitting diode including a first electrode and a second electrode to which a driving voltage is applied, a driving transistor, a second transistor receiving a data voltage and connected to a D node, a storage capacitor connected to the driving transistor and an N node, a hold capacitor connected to the D node and the N node, a third transistor connected to the D node and the driving transistor, a fourth transistor receiving a reference voltage and connected to the driving transistor, a fifth transistor connected to the driving transistor and the N node, a sixth transistor receiving a driving low voltage and connected to the driving transistor, a seventh transistor receiving an initialization voltage and connected the driving transistor, and an eighth transistor connected to the driving transistor and the first electrode of the light emitting diode.

Abstract: A dental drilling device for manufacturing a dental prosthesis by processing a material made of ceramic or the like includes a spindle including a spindle shaft rotatably mounted inside a drilling device housing and a spindle shaft fan formed in a wing shape on an outer surface of the spindle shaft; a fixing socket fixedly mounted to one end of the drilling device housing and surrounding one end of the spindle at a predetermined interval; a processing drill mounted on a front end of the spindle to process a workpiece; and a driving motor coupled to the other end of the spindle to rotate the spindle.

Abstract: Provided is an electronic device that includes a housing at least partially including a metal portion, a glass plate mounted on one surface of the housing, and a buffer disposed at least on the metal portion on one face of the housing and disposed adjacent to an edge of the glass plate.

Abstract: Provided is an electronic device that includes a housing at least partially including a metal portion, a glass plate mounted on one surface of the housing, and a buffer disposed at least on the metal portion on one face of the housing and disposed adjacent to an edge of the glass plate.

Abstract: Provided is an electronic device that includes a housing at least partially including a metal portion, a glass plate mounted on one surface of the housing, and a buffer disposed at least on the metal portion on one face of the housing and disposed adjacent to an edge of the glass plate.

Abstract: Provided is an electronic device that includes a housing at least partially including a metal portion, a glass plate mounted on one surface of the housing, and a buffer disposed at least on the metal portion on one face of the housing and disposed adjacent to an edge of the glass plate.

Abstract: Provided is an electronic device that includes a housing at least partially including a metal portion, a glass plate mounted on one surface of the housing, and a buffer disposed at least on the metal portion on one face of the housing and disposed adjacent to an edge of the glass plate.

Abstract: A bonding stage is provided. The bonding stage includes a first heater disposed under a first region of a substrate having a plurality of semiconductor chips disposed thereon, a second heater disposed under a second region different from the first region of the substrate, a cooler disposed under the first heater and the second heater and blocking heat of the first heater and heat of the second heater from being transferred to lower portions of the first heater and the second heater, and a thin plate disposed on the first heater and the second heater to support the substrate and transferring the heat of the first heater and the heat of the second heater to the substrate, wherein the first heater and the second heater are independently operated.

Abstract: A software-defined network (SDN) system and method for implementing the same can construct a network having flexible network topology by abstracting switches and controllers, as well as a host connected to said switches, and controllers, thereby increasing scalability of a hierarchical SDN network. The SDN system includes a host part, an SDN switch part, and an SDN controller part.

Abstract: A system and method for virtualizing SDN-based network monitoring. The system for includes: an information collector, a monitoring component, an information converter, and a resource allocator, in which a user-defined virtual monitor is included so that integrated monitoring may be performed, and expandability may be guaranteed to dynamically respond to a user's, demands.

Abstract: A bonding stage is provided. The bonding stage includes a first heater disposed under a first region of a substrate having a plurality of semiconductor chips disposed thereon, a second heater disposed under a second region different from the first region of the substrate, a cooler disposed under the first heater and the second heater and blocking heat of the first heater and heat of the second heater from being transferred to lower portions of the first heater and the second heater, and a thin plate disposed on the first heater and the second heater to support the substrate and transferring the heat of the first heater and the heat of the second heater to the substrate, wherein the first heater and the second heater are independently operated.

Abstract: A semiconductor manufacturing apparatus may include: a pickup unit configured to pick up a chip in a first region of the semiconductor manufacturing apparatus; a bonding head configured to receive the picked-up chip and configured to move from the first region to a top of a circuit board in a second region of the semiconductor manufacturing apparatus; and/or an optical unit configured to detect a bonding position on the circuit board while moving from the first region to the second region. A semiconductor manufacturing apparatus may include: a bonding head including a heater for heating a chip and bonding the chip onto a circuit board; and/or a cooling block, adjacent to the heater, through which cooling liquid flows. The cooling liquid may be removed from the cooling block while the heater generates heat. The cooling liquid may be supplied to the cooling block while the heater is cooled.

Abstract: A software-defined network (SDN) system and method for implementing the same can construct a network having flexible network topology by abstracting switches and controllers, as well as a host connected to said switches, and controllers, thereby increasing scalability of a hierarchical SDN network. The SDN system includes a host part, an SDN switch part, and an SDN controller part.

Abstract: A system for controlling a carrier virtual network is disclosed. The system includes at least one virtual network controller for controlling resources of a carrier virtual network based on customer request information received from a customer network controller, and at least one physical network controller for controlling resources of a carrier physical network based on a service profile received from the at least one virtual network controller. The at least one virtual network controller interworks with the at least one physical network controller in a one to one, one to N (N is an integer equal to or larger than 2), or N to one correspondence.

Abstract: Provided is a packet processing device for an information-centric network. The packet processing device includes a packet transceiver configured to transmit and receive packets, and a packet processing unit configured to process a transmitted or received packet including a forwarding identifier that identifies information present in the ICN and corresponds to an IP address of a network node holding the information, and at least one sub-identifier that identifies child information of the information, in which the forwarding identifier is used to forward packets.

Abstract: A system and method for virtualizing SDN-based network monitoring. The system for includes: an information collector, a monitoring component, an information converter, and a resource allocator, in which a user-defined virtual monitor is included so that integrated monitoring may be performed, and expandability may be guaranteed to dynamically respond to a user's, demands.

Abstract: A cover member engagement device and a portable terminal having a battery cover engagement structure using the same are provided, in which a battery mounting portion is formed on a rear surface of a housing of the portable terminal, engagement recesses are formed in both edges of the battery mounting portion, and engagement ribs are formed on a surface of a battery cover, for being engaged in the engagement recesses, wherein at least one first hook protruding from an inner side surface of at least one of the engagement ribs and at least one second hook protruding from an outer side surface of at least one of the engagement ribs are engaged with the housing.

Abstract: A server connection apparatus and method for controlling a connection between a plurality of controller servers and a plurality of network devices. The server connection apparatus includes a network connector configured to connect a plurality of controller servers capable of functioning as OpenFlow protocol-based SDN controllers and a plurality of network devices on a data plane and relay transmission and reception of data between the controller servers and the network devices; and a controller configured to create a list of available controller servers by monitoring an operational state of each controller server, select a particular controller server to be in charge of controlling a network device in response to a received request, and then control connection relationships between the plurality of controller servers and the plurality of network devices based on the selection result.

Abstract: A method and apparatus for managing a flow table is provided. The method includes dividing a flow table into a plurality of states according to occupancy levels of the flow table in a network device; and managing the flow table by reflecting the changed state of the flow table.

Abstract: A semiconductor manufacturing apparatus may include: a pickup unit configured to pick up a chip in a first region of the semiconductor manufacturing apparatus; a bonding head configured to receive the picked-up chip and configured to move from the first region to a top of a circuit board in a second region of the semiconductor manufacturing apparatus; and/or an optical unit configured to detect a bonding position on the circuit board while moving from the first region to the second region. A semiconductor manufacturing apparatus may include: a bonding head including a heater for heating a chip and bonding the chip onto a circuit board; and/or a cooling block, adjacent to the heater, through which cooling liquid flows. The cooling liquid may be removed from the cooling block while the heater generates heat. The cooling liquid may be supplied to the cooling block while the heater is cooled.