Patents by Inventor Byung Kap Kim

Byung Kap Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device including overlay patterns
    Patent number: 10573633
    Abstract: A semiconductor device includes a first overlay group and a second overlay group disposed on a semiconductor substrate. The first overlay group includes first lower overlay patterns which extend in a first direction, first upper overlay patterns overlapping the first lower overlay patterns, and first via overlay patterns interposed between the first lower overlay patterns and the first upper overlay patterns. The second overlay group includes second lower overlay patterns which extend in a second direction, second upper overlay patterns overlapping the second lower overlay patterns, and second via overlay patterns interposed between the second lower overlay patterns and the second upper overlay patterns. The second lower overlay patterns include end portions adjacent to and spaced apart from the first overlay group.
    Type: Grant
    Filed: December 4, 2017
    Date of Patent: February 25, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Tae Sun Kim, Hyun Jae Kang, Tae Hoi Park, Jin Seong Lee, Eun Sol Choi, Min Keun Kwak, Byung Kap Kim, Sung Won Choi
  • SEMICONDUCTOR DEVICE INCLUDING OVERLAY PATTERNS
    Publication number: 20180175016
    Abstract: A semiconductor device includes a first overlay group and a second overlay group disposed on a semiconductor substrate. The first overlay group includes first lower overlay patterns which extend in a first direction, first upper overlay patterns overlapping the first lower overlay patterns, and first via overlay patterns interposed between the first lower overlay patterns and the first upper overlay patterns. The second overlay group includes second lower overlay patterns which extend in a second direction, second upper overlay patterns overlapping the second lower overlay patterns, and second via overlay patterns interposed between the second lower overlay patterns and the second upper overlay patterns. The second lower overlay patterns include end portions adjacent to and spaced apart from the first overlay group.
    Type: Application
    Filed: December 4, 2017
    Publication date: June 21, 2018
    Inventors: Tae Sun Kim, Hyun Jae Kang, Tae Hoi Park, Jin Seong Lee, Eun Sol Choi, Min Keun Kwak, Byung Kap Kim, Sung Won Choi