Patents by Inventor Byung Kil YUN

Byung Kil YUN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11581144
    Abstract: A multilayer capacitor includes a body having a plurality of dielectric layers and first and second internal electrodes alternately disposed with the dielectric layers interposed therebetween, and further including an active region in which the first and second internal electrodes overlap each other, and upper and lower covers disposed above and below the active region, respectively; and first and second external electrodes disposed on the body to be connected to the first and second internal electrodes, respectively, wherein the upper and lower covers include barium titanate (BT, BaTiO3) and Yttria-stabilized zirconia (YSZ).
    Type: Grant
    Filed: November 16, 2021
    Date of Patent: February 14, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yo Han Seo, Min Hoe Kim, Jong Hyun Cho, Min Sung Song, Byung Kil Yun, Jung Wun Hwang
  • Publication number: 20220189693
    Abstract: A multilayer capacitor includes a body having a plurality of dielectric layers and first and second internal electrodes alternately disposed with the dielectric layers interposed therebetween, and further including an active region in which the first and second internal electrodes overlap each other, and upper and lower covers disposed above and below the active region, respectively; and first and second external electrodes disposed on the body to be connected to the first and second internal electrodes, respectively, wherein the upper and lower covers include barium titanate (BT, BaTiO3) and Yttria-stabilized zirconia (YSZ).
    Type: Application
    Filed: November 16, 2021
    Publication date: June 16, 2022
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yo Han SEO, Min Hoe KIM, Jong Hyun CHO, Min Sung SONG, Byung Kil YUN, Jung Wun HWANG
  • Patent number: 11164700
    Abstract: A multilayer capacitor includes a body, including a stacked structure formed of a plurality of dielectric layers and a plurality of internal electrodes, and a plurality of external electrodes. Each external electrode includes a conductive layer, disposed at the end of the body and connected to the plurality of internal electrodes, and a plating layer covering the conductive layer. Each conductive layer includes nickel (Ni) and barium titanate (BT), and an area occupied by nickel with respect to the total area of the respective conductive layer is 30% to 65%.
    Type: Grant
    Filed: September 2, 2020
    Date of Patent: November 2, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sung Hyung Kang, Yong Koo Kim, Hyung Kyu Kim, Won Hee Yoo, Jong Hyun Cho, Byung Kil Yun, Seok Kyoon Woo, Hyun Sung Dong
  • Publication number: 20200402716
    Abstract: A multilayer capacitor includes a body, including a stacked structure formed of a plurality of dielectric layers and a plurality of internal electrodes, and a plurality of external electrodes. Each external electrode includes a conductive layer, disposed at the end of the body and connected to the plurality of internal electrodes, and a plating layer covering the conductive layer. Each conductive layer includes nickel (Ni) and barium titanate (BT), and an area occupied by nickel with respect to the total area of the respective conductive layer is 30% to 65%.
    Type: Application
    Filed: September 2, 2020
    Publication date: December 24, 2020
    Inventors: Sung Hyung KANG, Yong Koo KIM, Hyung Kyu KIM, Won Hee YOO, Jong Hyun CHO, Byung Kil YUN, Seok Kyoon WOO, Hyun Sung DONG
  • Patent number: 10796855
    Abstract: A multilayer capacitor includes a body, including a stacked structure formed of a plurality of dielectric layers and a plurality of internal electrodes, and a plurality of external electrodes. Each external electrode includes a conductive layer, disposed at the end of the body and connected to the plurality of internal electrodes, and a plating layer covering the conductive layer. Each conductive layer includes nickel (Ni) and barium titanate (BT), and an area occupied by nickel with respect to the total area of the respective conductive layer is 30% to 65%.
    Type: Grant
    Filed: November 8, 2018
    Date of Patent: October 6, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sung Hyung Kang, Yong Koo Kim, Hyung Kyu Kim, Won Hee Yoo, Jong Hyun Cho, Byung Kil Yun, Seok Kyoon Woo, Hyun Sung Dong
  • Publication number: 20200058443
    Abstract: A multilayer capacitor includes a body, including a stacked structure formed of a plurality of dielectric layers and a plurality of internal electrodes, and a plurality of external electrodes. Each external electrode includes a conductive layer, disposed at the end of the body and connected to the plurality of internal electrodes, and a plating layer covering the conductive layer. Each conductive layer includes nickel (Ni) and barium titanate (BT), and an area occupied by nickel with respect to the total area of the respective conductive layer is 30% to 65%.
    Type: Application
    Filed: November 8, 2018
    Publication date: February 20, 2020
    Inventors: Sung Hyung KANG, Yong Koo KIM, Hyung Kyu KIM, Won Hee YOO, Jong Hyun CHO, Byung Kil YUN, Seok Kyoon WOO, Hyun Sung DONG