Abstract: A semiconductor processing system includes: a semiconductor processing chamber including an electrostatic chuck disposed in a chamber housing, and a first power supplier for supplying first radio frequency (RF) power to an internal electrode disposed in the electrostatic chuck; a voltage measuring device for measuring a voltage corresponding to the first RF power to output a digital signal; and a control device for outputting an interlock control signal to the semiconductor processing chamber, when it is determined that the voltage increases to be within a predetermined reference range based on the digital signal. The electrostatic chuck is configured to enable a wafer to be seated on a surface of the electrostatic chuck.

Abstract: Disclosed is a thermoplastic polyolefin (TPO) nanocomposite composition, more particularly a TPO nanocomposite composition including a polypropylene resin, a polyethylene resin, a rubber resin, a nanoclay master batch and a glass bubble master batch. Since the disclosed TPO nanocomposite composition has low specific gravity and superior gloss reducing effect and scratch resistance, it may be usefully applied to light automobile parts, uncoated automobile exterior parts, or the like.

Abstract: Disclosed is a thermoplastic polyolefin (TPO) nanocomposite composition, more particularly a TPO nanocomposite composition including a polypropylene resin, a polyethylene resin, a rubber resin, a nanoclay master batch and a glass bubble master batch. Since the disclosed TPO nanocomposite composition has low specific gravity and superior gloss reducing effect and scratch resistance, it may be usefully applied to light automobile parts, uncoated automobile exterior parts, or the like.