Patents by Inventor Byung Kuk Jeon

Byung Kuk Jeon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermally-conductive polycarbonate resin composition and molded product formed therefrom
    Patent number: 9862870
    Abstract: The present invention relates to a thermally conductive polycarbonate resin composition comprising (A) a polycarbonate resin, (B) a thermally conductive filler, (C) a modified polyolefin-based copolymer and (D) a low-molecular-weight polyolefin-based resin, thereby simultaneously exhibiting high impact strength, improving thermal conductivity and mechanical properties such as tensile strength and elongation, and having an excellent extrusion molding property.
    Type: Grant
    Filed: December 2, 2013
    Date of Patent: January 9, 2018
    Assignee: Lotte Advanced Materials Co., Ltd.
    Inventors: Nam Hyun Kim, Chan Gyun Shin, Byung Kuk Jeon, Jong Cheol Lim
  • Thermally-Conductive Polycarbonate Resin Composition and Molded Product Formed Therefrom
    Publication number: 20160200957
    Abstract: The present invention relates to a thermally conductive polycarbonate resin composition comprising (A) a polycarbonate resin, (B) a thermally conductive filler, (C) a modified polyolefin-based copolymer and (D) a low-molecular-weight polyolefin-based resin, thereby simultaneously exhibiting high impact strength, improving thermal conductivity and mechanical properties such as tensile strength and elongation, and having an excellent extrusion molding property.
    Type: Application
    Filed: December 2, 2013
    Publication date: July 14, 2016
    Inventors: Nam Hyun KIM, Chan Gyun SHIN, Byung Kuk JEON, Jong Cheol LIM
  • Thermoplastic Resin Composition Having Excellent EMI Shielding Property
    Publication number: 20140264181
    Abstract: A thermoplastic resin composition includes (A) about 50 to about 90% by weight of a crystalline thermoplastic resin having a melting point of about 200 to about 380° C.; and (B) about 10 to about 50% by weight of a filler in which a carbon nanostructure having an average length of about 1 to about 1000 ?m and an average diameter of about 1 to about 100 nm is grown on a glass fiber surface. The thermoplastic resin composition can have excellent EMI shielding property and/or fluidity.
    Type: Application
    Filed: February 19, 2014
    Publication date: September 18, 2014
    Applicant: Cheil Industries Inc.
    Inventors: Chan Gyun Shin, Kyung Rae Kim, Jung Wook Kim, Jong Cheol Lim, Byung Kuk Jeon