Patents by Inventor Byung Kuk Kang

Byung Kuk Kang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PRINTED CIRCUIT BOARD
    Publication number: 20220159839
    Abstract: A printed circuit board includes: a core substrate including a plurality of core layers; a plurality of magnetic members embedded in each of the plurality of core layers; a first coil pattern disposed on the core substrate; and a second coil pattern disposed below the core substrate.
    Type: Application
    Filed: March 9, 2021
    Publication date: May 19, 2022
    Inventors: Jung Hyun CHO, Jin Won LEE, Byung Kuk KANG, Chang Soo WOO
  • Printed circuit board
    Patent number: 10925161
    Abstract: A printed circuit board includes: an insulation material including a cavity formed therein; a first electronic element disposed in the cavity and including a groove; and a second electronic element disposed in the groove of the first electronic element.
    Type: Grant
    Filed: October 25, 2019
    Date of Patent: February 16, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Kyung-Hwan Ko, Jin-Hyun Kim, Byung-Kuk Kang, Jung-Hyun Cho, Chi-Won Hwang
  • PRINTED CIRCUIT BOARD
    Publication number: 20200196446
    Abstract: A printed circuit board includes: an insulation material including a cavity formed therein; a first electronic element disposed in the cavity and including a groove; and a second electronic element disposed in the groove of the first electronic element.
    Type: Application
    Filed: October 25, 2019
    Publication date: June 18, 2020
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Kyung-Hwan KO, Jin-Hyun KIM, Byung-Kuk KANG, Jung-Hyun CHO, Chi-Won HWANG
  • Gas filling apparatus and method for gas shock absorber
    Patent number: 6581651
    Abstract: A gas filling apparatus for gas shock absorber comprises the assembly location correction unit, a gas filling unit, wherein the gas filling unit includes a rod chucking unit, a calking jig, an oil seal pushing unit, and a jig housing. A gas filling method for gas shock absorber comprises the steps of correcting the assembly location of the tube assembly and the rod guide, clamping the base shell assembly; lowering the gas filling unit primarily, lowering the rod chucking unit, lowering the collet housing device; letting the oil seal break away, filling the gas, lowering the gas filling unit secondarily and simultaneously calking primarily, and calking secondarily the base shell assembly. The apparatus and the method need not punch a hole for filling the gas at a circumference of the base shell assembly when filling the gas into a base shell assembly of the gas shock absorber.
    Type: Grant
    Filed: December 26, 2001
    Date of Patent: June 24, 2003
    Assignee: Mando Corporation
    Inventors: Woo Jin Kim, Yei Seak Park, Byung Kuk Kang
  • Gas filling apparatus and method for gas shock absorber
    Publication number: 20020185193
    Abstract: A gas filling apparatus for gas shock absorber comprises the assembly location correction unit, a gas filling unit, wherein the gas filling unit includes a rod chucking unit, a calking jig, an oil seal pushing unit, and a jig housing. A gas filling method for gas shock absorber comprises the steps of correcting the assembly location of the tube assembly and the rod guide, clamping the base shell assembly; lowering the gas filling unit primarily, lowering the rod chucking unit, lowering the collet housing device; letting the oil seal break away, filling the gas, lowering the gas filling unit secondarily and simultaneously calking primarily, and calking secondarily the base shell assembly.
    Type: Application
    Filed: December 26, 2001
    Publication date: December 12, 2002
    Inventors: Woo Jin Kim, Yei Seak Park, Byung Kuk Kang