Patents by Inventor Byung-Kyu Cho
Byung-Kyu Cho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9056984Abstract: Provided are a curable composition and its use. The curable composition may provide a cured product having excellent processability, workability and adhesive property, and having no whitening and surface stickiness. The curable composition has excellent thermal resistance and crack resistance at high temperature, and excellent gas barrier ability, and thus allows a semiconductor device to stably maintain performance at high temperature for a long time when applied to the device.Type: GrantFiled: August 11, 2014Date of Patent: June 16, 2015Assignee: LG Chem, Ltd.Inventors: Min Jin Ko, Jae Ho Jung, Bum Gyu Choi, Dae Ho Kang, Min A Yu, Min Kyoun Kim, Byung Kyu Cho
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Publication number: 20150141608Abstract: Provided are a curable composition and its use. The curable composition exhibits excellent processability and workability before curing, and excellent light extraction efficiency, hardness, thermal and shock resistance, moisture resistance, gas permeability, and adhesiveness after curing. In addition, the curable composition may provide a cured product that exhibits long-lasting durability and reliability even under harsh conditions, and does not causing whitening and surface stickiness.Type: ApplicationFiled: January 27, 2015Publication date: May 21, 2015Applicant: LG CHEM, LTD.Inventors: Min Jin KO, Bum Gyu CHOI, Jae Ho JUNG, Dae Ho KANG, Min Kyoun KIM, Byung Kyu CHO
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Publication number: 20150137171Abstract: Provided are a curable composition and its use. The curable composition has excellent processability, workability and adhesiveness, exhibits excellent light extraction efficiency, crack resistance, hardness, thermal and shock resistance and adhesiveness after curing, has long-lasting durability and reliability even under harsh conditions, and does not cause whitening or surface stickiness. The curable composition can be used as an encapsulant or adhesive material for an optical semiconductor such as an LED.Type: ApplicationFiled: January 27, 2015Publication date: May 21, 2015Applicant: LG CHEM, LTD.Inventors: Min Jin KO, Jae Ho JUNG, Bum Gyu CHOI, Dae Ho KANG, Min Kyoun KIM, Byung Kyu CHO
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Publication number: 20150141607Abstract: Provided are a curable composition and its use. The curable composition having excellent processability, workability, heat resistance, and light resistance, and having no problem of discoloring despite using for a long time may be provided. The curable composition which may scatter light and disperse linearity of light when used as an encapsulant of an optical semiconductor such as an LED may be provided.Type: ApplicationFiled: January 27, 2015Publication date: May 21, 2015Applicant: LG CHEM, LTD.Inventors: Min Jin KO, Jae Ho JUNG, Bum Gyu CHOI, Dae Ho KANG, Min Kyoun KIM, Byung Kyu CHO
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Patent number: 9029493Abstract: Provided is an organopolysiloxane and its use. The organopolysiloxane may exhibit excellent processibility and workability. In addition, when the organopolysiloxane is used as an encapsulant, it exhibits excellent light extraction efficiency, crack resistance, hardness, thermal and shock resistance and an adhesive property. Moreover, the organopolysiloxane may provide an encapsulant exhibiting stable durability and reliability under severe conditions for a long time and having no whitening and surface stickiness.Type: GrantFiled: May 12, 2014Date of Patent: May 12, 2015Assignee: LG Chem, Ltd.Inventors: Bum Gyu Choi, Min Jin Ko, Myung Sun Moon, Jae Ho Jung, Dae Ho Kang, Min Kyoun Kim, Byung Kyu Cho
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Patent number: 9023968Abstract: A method of preparing an organopolysiloxane is provided. An organopolysiloxane, which has both a linear or cross-linking structure derived from a trifunctional siloxane unit and a linear structure derived from a difunctional siloxane unit among the molecular structures and also has a sufficiently long linear structure, can be effectively prepared. Also, the organopolysiloxane can be synthesized so that it can have a sufficiently high molecular weight, and a target product showing excellent physical properties can be effectively prepared by minimizing a ratio of a functional group such as an alkoxy group or a hydroxyl group in the synthesized organopolysiloxane.Type: GrantFiled: May 13, 2014Date of Patent: May 5, 2015Assignee: LG Chem, Ltd.Inventors: Bum Gyu Choi, Min Jin Ko, Myung Sun Moon, Jae Ho Jung, Dae Ho Kang, Min Kyoun Kim, Byung Kyu Cho
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Patent number: 9006374Abstract: This application relates to a curable composition and its use. The curable composition may exhibit excellent processibility and workability. The curable composition has excellent light extraction efficiency, crack resistance, hardness, thermal and shock resistance and an adhesive property after curing. The curable composition may provide a cured product exhibiting stable durability and reliability under severe conditions for a long time and having no whitening and surface stickiness.Type: GrantFiled: December 2, 2013Date of Patent: April 14, 2015Assignee: LG Chem, Ltd.Inventors: Min Jin Ko, Bum Gyu Choi, Myung Sun Moon, Jae Ho Jung, Dae Ho Kang, Min Kyoun Kim, Byung Kyu Cho
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Patent number: 8969478Abstract: Provided is a curable composition and its use. The curable composition may exhibit excellent processibility and workability. The curable composition has excellent light extraction efficiency, crack resistance, hardness, thermal and shock resistance and an adhesive property after curing. The curable composition may provide a cured product exhibiting stable durability and reliability under severe conditions for a long time and having no whitening and surface stickiness.Type: GrantFiled: December 23, 2013Date of Patent: March 3, 2015Assignee: LG Chem, Ltd.Inventors: Min Jin Ko, Jae Ho Jung, Myung Sun Moon, Bum Gyu Choi, Dae Ho Kang, Min Kyoun Kim, Byung Kyu Cho
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Patent number: 8937136Abstract: A curable composition and use thereof are provided. The exemplary curable composition can show excellent processability and workability. Also, the curable composition can have a high refractive index before or after curing. The composition has low moisture permeability before or after curing and shows excellent crack resistance, thermal shock resistance, adhesive property and hardness. In addition, the composition does not cause color change such as whitening under a high-temperature or high-humidity condition, and does not exhibit stickiness on a surface thereof. The curable composition may be used as an adhesive material or as an encapsulation material for semiconductor devices such as an LED, a CCD, a photo coupler, or a photovoltaic cell.Type: GrantFiled: July 5, 2013Date of Patent: January 20, 2015Assignee: LG Chem, Ltd.Inventors: Bum Gyu Choi, Min Jin Ko, Myung Sun Moon, Jae Ho Jung, Dae Ho Kang, Min Kyoun Kim, Byung Kyu Cho
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Patent number: 8921496Abstract: A curable composition and use thereof are provided. The exemplary curable composition can show excellent processability and workability. Also, the curable composition can have a high refractive index before or after curing. The composition has low moisture permeability before or after curing and shows excellent crack resistance, thermal shock resistance, adhesive property and hardness. In addition, the composition does not cause color change such as whitening, under a high-temperature or high-humidity condition, and does not exhibit stickiness on a surface thereof. The curable composition may be used as an adhesive material or as an encapsulation material for semiconductor devices such as an LED, a CCD, a photo coupler, or a photovoltaic cell.Type: GrantFiled: July 5, 2013Date of Patent: December 30, 2014Assignee: LG Chem, Ltd.Inventors: Bum Gyu Choi, Min Jin Ko, Myung Sun Moon, Jae Ho Jung, Dae Ho Kang, Min Kyoun Kim, Byung Kyu Cho
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Patent number: 8916653Abstract: A curable composition and use thereof are provided. The exemplary curable composition can show excellent processability and workability. Also, the curable composition can have a high refractive index before or after curing. The composition has low moisture permeability before or after curing and shows excellent crack resistance, thermal shock resistance, adhesive property and hardness. In addition, the composition does not cause color change such as whitening under a high-temperature or high-humidity condition, and does not exhibit stickiness on a surface thereof. The curable composition may be used as an adhesive material or as an encapsulation material for semiconductor devices such as an LED, a CCD, a photo coupler, or a photovoltaic cell.Type: GrantFiled: July 5, 2013Date of Patent: December 23, 2014Assignee: LG Chem, Ltd.Inventors: Bum Gyu Choi, Min Jin Ko, Myung Sun Moon, Jae Ho Jung, Dae Ho Kang, Min Kyoun Kim, Byung Kyu Cho
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Patent number: 8916654Abstract: A curable composition and the use thereof are provided. The exemplary curable composition can show excellent processability and workability. Also, the curable composition can have a high refractive index before or after curing. The composition has low moisture permeability before or after curing and shows excellent crack resistance, thermal shock resistance, adhesive property and hardness. In addition, the composition does not cause color change such as whitening under a high-temperature or high-humidity condition, and does not exhibit stickiness on a surface thereof. The curable composition may be used as an adhesive material or as an encapsulation material for semiconductor devices such as an LED, a CCD, a photo coupler, or a photovoltaic cell.Type: GrantFiled: July 5, 2013Date of Patent: December 23, 2014Assignee: LG Chem, Ltd.Inventors: Bum Gyu Choi, Min Jin Ko, Myung Sun Moon, Jae Ho Jung, Dae Ho Kang, Min Kyoun Kim, Byung Kyu Cho
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Publication number: 20140350195Abstract: Provided are a curable composition and its use. The curable composition may provide a cured product having excellent processability and workability, no whitening and surface stickiness, and an excellent adhesive property. Since the curable composition has excellent thermal resistance, gas barrier-ability, and crack resistance, even when a semiconductor device to which the composition is applied is used at a high temperature for a long time, performance of the device may be stably maintained.Type: ApplicationFiled: August 13, 2014Publication date: November 27, 2014Inventors: Min Jin KO, Kyung Mi KIM, Young Ju PARK, Bum Gyu CHOI, Dae Ho KANG, Byung Kyu CHO, You Na YANG
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Publication number: 20140350194Abstract: Provided are a curable composition and its use. The curable composition may provide a cured product having excellent processability, workability and adhesive property, and having no whitening and surface stickiness. The curable composition has excellent thermal resistance and crack resistance at high temperature, and excellent gas barrier ability, and thus allows a semiconductor device to stably maintain performance at high temperature for a long time when applied to the device.Type: ApplicationFiled: August 11, 2014Publication date: November 27, 2014Inventors: Min Jin KO, Jae Ho JUNG, Bum Gyu CHOI, Dae Ho KANG, Min A. YU, Min Kyoun KIM, Byung Kyu CHO
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Patent number: 8895664Abstract: Provided is a curable composition and its use. The curable composition may exhibit excellent processability and workability. The curable composition has excellent light extraction efficiency, crack resistance, hardness, thermal and shock resistance and an adhesive property after curing. The curable composition may provide a cured product exhibiting stable durability and reliability under severe conditions in a long time, and not inducing whitening and surface stickiness.Type: GrantFiled: November 27, 2013Date of Patent: November 25, 2014Assignee: LG Chem, Ltd.Inventors: Min Jin Ko, Myung Sun Moon, Jae Ho Jung, Bum Gyu Choi, Dae Ho Kang, Min Kyoun Kim, Byung Kyu Cho
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Patent number: 8889811Abstract: Provided is a curable composition and its use. The curable composition may exhibit excellent processibility and workability. The curable composition has excellent light extraction efficiency, crack resistance, hardness, thermal and shock resistance and an adhesive property after curing. The curable composition may provide a cured product exhibiting stable durability and reliability under severe conditions for a long time, and having no whitening and surface stickiness.Type: GrantFiled: December 23, 2013Date of Patent: November 18, 2014Assignee: LG Chem, Ltd.Inventors: Min Jin Ko, Myung Sun Moon, Jae Ho Jung, Bum Gyu Choi, Dae Ho Kang, Min Kyoun Kim, Byung Kyu Cho
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Publication number: 20140319575Abstract: Provided is an organopolysiloxane and its use. The organopolysiloxane may exhibit excellent processibility and workability. In addition, when the organopolysiloxane is used as an encapsulant, it exhibits excellent light extraction efficiency, crack resistance, hardness, thermal and shock resistance and an adhesive property.Type: ApplicationFiled: May 12, 2014Publication date: October 30, 2014Applicant: LG CHEM, LTD.Inventors: Bum Gyu CHOI, Min Jin KO, Myung Sun MOON, Jae Ho JUNG, Dae Ho KANG, Min Kyoun KIM, Byung Kyu CHO
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Publication number: 20140249288Abstract: A method of preparing an organopolysiloxane is provided. An organopolysiloxane, which has both a linear or cross-linking structure derived from a trifunctional siloxane unit and a linear structure derived from a difunctional siloxane unit among the molecular structures and also has a sufficiently long linear structure, can be effectively prepared. Also, the organopolysiloxane can be synthesized so that it can have a sufficiently high molecular weight, and a target product showing excellent physical properties can be effectively prepared by minimizing a ratio of a functional group such as an alkoxy group or a hydroxyl group in the synthesized organopolysiloxane.Type: ApplicationFiled: May 13, 2014Publication date: September 4, 2014Applicant: LG CHEM, LTD.Inventors: Bum Gyu CHOI, Min Jin KO, Myung Sun MOON, Jae Ho JUNG, Dae Ho KANG, Min Kyoun KIM, Byung Kyu CHO
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Patent number: 8809127Abstract: Provided is a curable composition and its use. The curable composition may exhibit excellent processability and workability. The curable composition has excellent light extraction efficiency, crack resistance, hardness, thermal and shock resistance and an adhesive property after curing. The curable composition may provide a cured product exhibiting stable durability and reliability under severe conditions for a long time and having no whitening and surface stickiness.Type: GrantFiled: December 23, 2013Date of Patent: August 19, 2014Assignee: LG Chem, Ltd.Inventors: Min Jin Ko, Jae Ho Jung, Myung Sun Moon, Bum Gyu Choi, Dae Ho Kang, Min Kyoun Kim, Byung Kyu Cho
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Patent number: 8809932Abstract: In one embodiment, the semiconductor memory device includes a semiconductor substrate having projecting portions, a tunnel insulation layer formed over at least one of the projecting semiconductor substrate portions, and a floating gate structure disposed over the tunnel insulation layer. An upper portion of the floating gate structure is wider than a lower portion of the floating gate structure, and the lower portion of the floating gate structure has a width less than a width of the tunnel insulating layer. First insulation layer portions are formed in the semiconductor substrate and project from the semiconductor substrate such that the floating gate structure is disposed between the projecting first insulation layer portions. A dielectric layer is formed over the first insulation layer portions and the floating gate structure, and a control gate is formed over the dielectric layer.Type: GrantFiled: July 6, 2007Date of Patent: August 19, 2014Assignee: Samsung Electronics Co., Ltd.Inventors: Byung-Kyu Cho, Se-Hoon Lee, Kyu-Charn Park, Choong-Ho Lee