Patents by Inventor Byung-Man Kang

Byung-Man Kang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11735329
    Abstract: The present invention relates to a radioactive chemical waste treatment apparatus including an adsorption unit including an radioactive chemical waste adsorption member for adsorbing and separating radioactive chemical wastes from radioactive chemical waste-containing fluid, and a regeneration unit which is in fluidic communication with the adsorption unit and is for regenerating the radioactive chemical waste adsorption member by desorbing the radioactive chemical wastes from the adsorption member with the radioactive chemical wastes adsorbed thereonto, and to a radioactive chemical waste treatment method including (A) adsorbing radioactive chemical wastes onto a radioactive chemical waste adsorption member and separating the radioactive chemical wastes from a radioactive chemical waste-containing fluid, and (B) desorbing the radioactive chemical wastes from the radioactive chemical waste adsorption member with the radioactive chemical wastes adsorbed thereonto, and regenerating the radioactive chemical wast
    Type: Grant
    Filed: October 14, 2020
    Date of Patent: August 22, 2023
    Assignee: KOREA ATOMIC ENERGY RESEARCH INSTITUTE
    Inventors: Sang Eun Bae, Hwa Kyeung Jeong, Dong Woo Lee, Tae Hong Park, Jei Won Yeon, Kun Ho Chung, Sang Ho Lim, Jai Il Park, Wan Sik Cha, Byung Man Kang
  • Patent number: 11598887
    Abstract: The present invention relates to a method for measuring radioactivity of radioactive waste, the method comprising an adsorption step (A) of selectively adsorbing a radioactive substance comprising at least one from among radioactive iodine and radioactive cesium from radioactive waste containing radioactive substances on an adsorption member for adsorbing a radioactive substance, and a measurement step (B) of measuring radioactivity of the radioactive substance.
    Type: Grant
    Filed: March 23, 2021
    Date of Patent: March 7, 2023
    Assignee: KOREA ATOMIC ENERGY RESEARCH INSTITUTE
    Inventors: Sang Eun Bae, Jung Hwan Park, Jun Hyuck Kim, Hwa Kyeung Jeong, Byung Man Kang, Tae Hong Park, Sang Ho Lim, Kun Ho Chung
  • Publication number: 20210302598
    Abstract: The present invention relates to a method for measuring radioactivity of radioactive waste, the method comprising an adsorption step (A) of selectively adsorbing a radioactive substance comprising at least one from among radioactive iodine and radioactive cesium from radioactive waste containing radioactive substances on an adsorption member for adsorbing a radioactive substance, and a measurement step (B) of measuring radioactivity of the radioactive substance.
    Type: Application
    Filed: March 23, 2021
    Publication date: September 30, 2021
    Inventors: Sang Eun BAE, Jung Hwan PARK, Jun Hyuck KIM, Hwa Kyeung JEONG, Byung Man KANG, Tae Hong PARK, Sang Ho LIM, Kun Ho CHUNG
  • Publication number: 20210118587
    Abstract: The present invention relates to a radioactive chemical waste treatment apparatus including an adsorption unit including an radioactive chemical waste adsorption member for adsorbing and separating radioactive chemical wastes from radioactive chemical waste-containing fluid, and a regeneration unit which is in fluidic communication with the adsorption unit and is for regenerating the radioactive chemical waste adsorption member by desorbing the radioactive chemical wastes from the adsorption member with the radioactive chemical wastes adsorbed thereonto, and to a radioactive chemical waste treatment method including (A) adsorbing radioactive chemical wastes onto a radioactive chemical waste adsorption member and separating the radioactive chemical wastes from a radioactive chemical waste-containing fluid, and (B) desorbing the radioactive chemical wastes from the radioactive chemical waste adsorption member with the radioactive chemical wastes adsorbed thereonto, and regenerating the radioactive chemical wast
    Type: Application
    Filed: October 14, 2020
    Publication date: April 22, 2021
    Inventors: Sang Eun BAE, Hwa Kyeung JEONG, Dong Woo LEE, Tae Hong PARK, Jei Won YEON, Kun Ho CHUNG, Sang Ho LIM, Jai Il PARK, Wan Sik CHA, Byung Man KANG
  • Publication number: 20180247835
    Abstract: The present invention provides a substrate treating apparatus. The substrate treating apparatus includes a chamber configured to provide a space for processing a substrate, a support unit provided in the chamber and configured to support the substrate, and a nozzle configured to supply a cleaning medium to the substrate supported by the support unit, the nozzle may include a contraction part which has an inlet, through which the cleaning medium is introduced, and a cross-sectional area of which decreases as it goes far from the inlet, an expansion part which has an ejection hole, through which the cleaning medium is ejected, and a cross-sectional area of which increases as it becomes closer to the ejection hole, and an orifice located between the contraction part and the expansion part, and the cleaning medium introduced into the contraction part is a single gas.
    Type: Application
    Filed: October 20, 2016
    Publication date: August 30, 2018
    Inventors: SOO YEON LEE, HO-YOUNG KIM, SEUNGHO KIM, JAE HONG LEE, JOONOH KIM, JINKYU KIM, BYUNG MAN KANG, IN IL JUNG
  • Publication number: 20180005849
    Abstract: Disclosed is a substrate treating apparatus. The substrate treating apparatus includes a spin head, a support shaft connected to a lower portion of the spin head to support the spin head, a pin located on an upper surface of the spin head to support the substrate and having a space in the interior thereof, and a nozzle member configured to supply a liquid to the substrate located on the spin head.
    Type: Application
    Filed: June 26, 2017
    Publication date: January 4, 2018
    Inventors: Ji-hwan LEE, Jungbong CHOI, Chan Young HEO, Pil Kyun HEO, Byung Man KANG
  • Publication number: 20170345686
    Abstract: Disclosed are a liquid treating apparatus and a liquid treating method. The liquid treating apparatus includes a chamber that provides a space for processing a substrate, a support unit that is provided in the chamber to support the substrate, an ejection unit that has a nozzle for supplying a cleaning medium to the substrate supported by the support unit, and an auxiliary ejection unit that has an auxiliary nozzle for supplying a contamination prevention liquid to the substrate supported by the support unit.
    Type: Application
    Filed: May 23, 2017
    Publication date: November 30, 2017
    Inventors: KIHOON CHOI, JINKYU KIM, YOON JONG JU, MIN SUNG HAN, BYUNG MAN KANG
  • Publication number: 20170301944
    Abstract: The present invention relates to a redox flow battery and, more specifically, to a redox flow battery comprising an anolyte, a catholyte, and an ion exchange membrane, wherein the anolyte and the catholyte respectively comprise an electrolyte containing a Cl? ion and an active material containing a vanadium ion, and the electrolyte comprises at least one side reaction inhibitor selected from the group consisting of a metal phosphate, a metal hydrochloride and a metal sulfate.
    Type: Application
    Filed: September 3, 2015
    Publication date: October 19, 2017
    Inventors: Byung-Man KANG, Soo-Whan KIM, Min-Ki HONG, Byung-Chul KIM
  • Publication number: 20160346795
    Abstract: Disclosed is a nozzle for supplying a treatment liquid to a substrate, the nozzle including a body having a passage, through which the treatment liquid flows, in the interior thereof, and having a discharge hole communicated with the passage and through which the treatment liquid is discharged, and a piezoelectric element that pressurize the treatment liquid flowing through the body to discharge the treatment liquid through the discharge hole in a state of droplets, wherein an average diameter of the droplets discharged through the discharge hole is equal to or greater than 5 micrometers and is less than 15 micrometers.
    Type: Application
    Filed: May 20, 2016
    Publication date: December 1, 2016
    Applicant: Semes Co., Ltd.
    Inventors: Kihoon CHOI, Yoon Jong Ju, Byung Man Kang
  • Patent number: 9349626
    Abstract: Provided is a buffer unit, which includes a frame including a base plate, a first vertical plate, and a second vertical plate, wherein the first and second vertical plates are spaced apart from each other on the base plate, a first buffer on which a photomask is placed, the first buffer being allowed to be reversed between the first and second vertical plates; and a plurality of driving parts disposed at outsides of the first and second vertical plates, and driving the first buffer to grip and reverse the photomask placed on the first buffer.
    Type: Grant
    Filed: May 30, 2012
    Date of Patent: May 24, 2016
    Assignee: SEMES CO., LTD.
    Inventors: Kihoon Choi, Byung Man Kang, Byung Chul Kang, Donghyuk Jang
  • Publication number: 20150348805
    Abstract: The inventive concepts provide an apparatus for treating a substrate. The apparatus includes a housing having a treatment space therein, a support unit supporting the substrate in the treatment space, a nozzle unit discharging a solution onto the substrate supported by the support unit, and a solution supply unit supplying the solution to the nozzle unit. The solution supply unit includes a solution supply line connected to the nozzle unit, a heating member installed on the solution supply line to heat the solution, and a recovery line diverging from the solution supply line at a first point disposed downstream from the heating member.
    Type: Application
    Filed: May 20, 2015
    Publication date: December 3, 2015
    Inventors: Bong Joo KIM, Seung Ho LEE, Yong-Hyoun CHOI, Byung-Man KANG
  • Patent number: 9153464
    Abstract: Provided is a substrate processing apparatus. The substrate processing apparatus includes an index part including a port on which a container containing a substrate is placed and an index robot, a processing part for processing the substrate, and a buffer unit disposed between the processing part and the index part to allow the substrate transferred between the processing part and the index part to be temporarily stayed therein. The processing part includes a glue removal processing module, a substrate cooling processing module, a heat processing module, and a functional water processing module which are disposed along a transfer passage for transferring the substrate.
    Type: Grant
    Filed: May 30, 2012
    Date of Patent: October 6, 2015
    Assignee: SEMES CO., LTD.
    Inventors: Byung Chul Kang, Byung Man Kang, Donghyuk Jang, Seong-soo Kim
  • Publication number: 20150153421
    Abstract: Disclosed are a method and apparatus for analyzing an electrolyte of a redox flow battery. The method includes passing a first electrolyte solution or a second electrolyte solution through each of a first auxiliary cell and a second auxiliary cell connected to a main cell and a storage tank, closing at least one of the first auxiliary cell and the second auxiliary cell, applying current to the first auxiliary cell and the second auxiliary cell; creating data by measuring a voltage between the first auxiliary cell and the second auxiliary cell, and analyzing an electrolyte contained in the electrolyte solution in the first auxiliary cell or the second auxiliary cell based on variation in the voltage between the first auxiliary cell and the second auxiliary cell according to time. According to the present invention, information on an electrolyte can be obtained more efficiently and easily.
    Type: Application
    Filed: November 28, 2014
    Publication date: June 4, 2015
    Inventors: Min-Ki HONG, Byung-Man KANG, Soo-Whan KIM, byung-Chul KIM, Hee-Chang YE
  • Publication number: 20130284367
    Abstract: Provided is a substrate processing apparatus. The apparatus includes a processing chamber containing a substrate and processing the substrate by using a processing solution and a supplying unit supplying the processing solution to the processing chamber. The supplying unit includes a supply line through which the processing solution is supplied, a preliminary heater installed on the supply line and preliminary heating the processing solution, a main heater installed on the supply line at a lower stream of the preliminary heater and secondarily heating the processing solution, a first detour line connected to the supply line to detour to the preliminary heater and comprising a first valve, a second detour line connected to the supply line to detour the preliminary heater and the main heater or the main heater and comprising a second valve, and a controller controlling the first valve and the second valve.
    Type: Application
    Filed: April 30, 2013
    Publication date: October 31, 2013
    Inventors: Byung Chul Kang, Bong Joo Kim, Byung Man Kang, Young Ho Choo
  • Publication number: 20130284209
    Abstract: The substrate cleaning apparatus includes a first process chamber in which a liquid treating process is performed on a substrate by supplying a treating solution, a second process chamber in which a drying process is performed on the substrate, and a carrying unit carrying the substrate between the first process chamber and the second process chamber. The first process chamber includes a liquid treating housing providing a space in which the liquid treating process is performed on the substrate, a spin chuck supporting the substrate within the liquid treating housing, and a liquid supply member supplying the treating solution onto the substrate supported by the spin chuck. The second process chamber includes a drying housing providing a space in which the substrate is dried, a substrate support member supporting the substrate within the drying housing, and a heater heating the substrate.
    Type: Application
    Filed: April 30, 2013
    Publication date: October 31, 2013
    Applicant: SEMES CO., LTD.
    Inventors: YU HWAN KIM, BYUNG MAN KANG, SE HOON OH, YEON JOON KIM
  • Publication number: 20120305024
    Abstract: Provided is a substrate processing apparatus. The substrate processing apparatus includes an index part including a port on which a container containing a substrate is placed and an index robot, a processing part for processing the substrate, and a buffer unit disposed between the processing part and the index part to allow the substrate transferred between the processing part and the index part to be temporarily stayed therein. The processing part includes a glue removal processing module, a substrate cooling processing module, a heat processing module, and a functional water processing module which are disposed along a transfer passage for transferring the substrate.
    Type: Application
    Filed: May 30, 2012
    Publication date: December 6, 2012
    Applicant: SEMES CO., LTD.
    Inventors: Byung Chul Kang, Byung Man Kang, Donghyuk Jang, Seong-soo Kim
  • Publication number: 20120305028
    Abstract: Provided is a buffer unit, which includes a frame including a base plate, a first vertical plate, and a second vertical plate, wherein the first and second vertical plates are spaced apart from each other on the base plate, a first buffer on which a photomask is placed, the first buffer being allowed to be reversed between the first and second vertical plates; and a plurality of driving parts disposed at outsides of the first and second vertical plates, and driving the first buffer to grip and reverse the photomask placed on the first buffer.
    Type: Application
    Filed: May 30, 2012
    Publication date: December 6, 2012
    Applicant: SEMES CO., LTD.
    Inventors: Kihoon Choi, Byung Man Kang, Byung Chul Kang, Donghyuk Jang
  • Patent number: 8104490
    Abstract: Provided are a substrate treating apparatus and a method of manufacturing the substrate treating apparatus. Processing units of a process equipment are modularized, and the modularized processing units are detachably disposed in a main frame. According to this characteristic, work time and work effort required for manufacturing the process equipment can be reduced. In addition, maintenance/repair of each of the processing units can be further easily performed.
    Type: Grant
    Filed: October 23, 2008
    Date of Patent: January 31, 2012
    Assignee: Semes Co., Ltd.
    Inventors: Sung-Ho Jang, Byung-Man Kang
  • Publication number: 20090101180
    Abstract: Provided are a substrate treating apparatus and a method of manufacturing the substrate treating apparatus. Processing units of a process equipment are modularized, and the modularized processing units are detachably disposed in a main frame. According to this characteristic, work time and work effort required for manufacturing the process equipment can be reduced. In addition, maintenance/repair of each of the processing units can be further easily performed.
    Type: Application
    Filed: October 23, 2008
    Publication date: April 23, 2009
    Inventors: Sung-Ho Jang, Byung-Man Kang