Patents by Inventor Byung Mun Choi

Byung Mun Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240087277
    Abstract: A control method of a fastening tool for fastening a component part includes photographing a fastening portion of the component part through a camera portion mounted on the fastening tool. The control method includes pre-processing that rotates an input image, which has been photographed by the camera portion, to match with representative model image. The control method includes estimating the fastening portion through an inference process through a convolutional neural network (CNN) algorithm-based image classification work on a video input image of a same fastening portion finished with the pre-processing work. The control method also includes setting a torque value that is matched with a recognized fastening portion when a probability value of the fastening portion in the inference process exceeds a predetermined reference ratio.
    Type: Application
    Filed: November 15, 2023
    Publication date: March 14, 2024
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, INHA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION
    Inventors: Tae Mun Hwang, DongHa Jeong, Byung Cheol Song, Dong Yoon Choi
  • Patent number: 6087623
    Abstract: The present invention provides a semiconductor device marking apparatus comprising a package loader, on which a plurality of semiconductor device packages are loaded, a package provider, which provides the semiconductor device packages one by one from the package loader, a transfer rail, which transfers the semiconductor device packages provided by the package provider, a marker, which marks an alphanumeric code on the front surfaces of the semiconductor device packages transferred by the transfer rail, a rotating stopper comprising a stop plate and a package control shaft, and a package unloader, on which the semiconductor device packages passing through the rotating stopper are loaded. Further, the present invention provides a rotating stopper for temporarily stopping semiconductor device packages to be transferred along a transfer rail, the rotating stopper comprising a stop plate and a package control shaft.
    Type: Grant
    Filed: June 9, 1998
    Date of Patent: July 11, 2000
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Mun Ki Kwon, Sung Ho Choi, Byung Mun Choi