Patents by Inventor Byung Seok Kwon

Byung Seok Kwon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220265149
    Abstract: An apparatus for measuring bio-signals is provided. According to an example embodiment, the apparatus for measuring bio-signals includes: a light source configured to emit light onto an object; an image sensor including: a pixel array configured to detect the light emitted by the light source and reacted by the object and a pixel binning unit configured to bin data of the light, detected by the pixel array, by using at least two different binning sizes; and a processor configured to acquire a plurality of bio-signals respectively based on data of the at least two different binning sizes, which are output from the image sensor.
    Type: Application
    Filed: June 22, 2021
    Publication date: August 25, 2022
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jong Wook LEE, Byung Hoon Ko, Yong Joo Kwon, Seung Woo Noh, Hyun Seok Moon, Sung Mo Ahn, Kun Sun Eom, Tak Hyung Lee, Myoung Hoon Jung, Chang Mok Choi
  • Publication number: 20210043455
    Abstract: In one or more embodiments, a method for depositing a carbon hard-mask material by plasma-enhanced chemical vapor deposition (PECVD) includes heating a substrate contained within a process chamber to a temperature in a range from about 100 C to about 700 C and producing a plasma with a power generator emitting an RF power of greater than 3 kW. In some examples, the temperature is in a range from about 300C to about 700C and the RF power is greater than 3 kW to about 7 kW. The method also includes flowing a hydrocarbon precursor into the plasma within the process chamber and forming a carbon hard-mask layer on the substrate at a rate of greater than 5,000/min, such as up to about 10,000/min or faster.
    Type: Application
    Filed: March 21, 2019
    Publication date: February 11, 2021
    Inventors: Byung Seok KWON, Prashant Kumar KULSHRESHTHA, Kwangduk Douglas LEE, Bushra AFZAL, Sungwon HA, Vinay K. PRABHAKAR, Viren KALSEKAR, Satya Teja Babu THOKACHICHU, Edward P. HAMMOND, IV
  • Publication number: 20210017645
    Abstract: Embodiments of the present invention generally relate to an apparatus for reducing arcing during thick film deposition in a plasma process chamber. In one embodiment, an edge ring including an inner edge diameter that is about 0.28 inches to about 0.38 inches larger than an outer diameter of a substrate is utilized when depositing a thick (greater than two microns) layer on the substrate. The layer may be a dielectric layer, such as a carbon hard mask layer, for example an amorphous carbon layer. With the 0.14 inches to 0.19 inches gap between the outer edge of substrate and the inner edge of the edge ring during the deposition of the thick layer, substrate support surface arcing is reduced while the layer thickness uniformity is maintained.
    Type: Application
    Filed: April 9, 2019
    Publication date: January 21, 2021
    Inventors: Lu XU, Byung Seok KWON, Viren KALSEKAR, Vinay K. PRABHAKAR, Prashant Kumar KULSHRESHTHA, Dong Hyung LEE, Kwangduk Douglas LEE
  • Publication number: 20200362457
    Abstract: The present disclosure relates to systems and methods for reducing the formation of hardware residue and minimizing secondary plasma formation during substrate processing in a process chamber. The process chamber may include a gas distribution member configured to flow a first gas into a process volume and generate a plasma therefrom. A second gas is supplied into a lower region of the process volume. Further, an exhaust port is disposed in the lower region to remove excess gases or by-products from the process volume during or after processing.
    Type: Application
    Filed: April 24, 2020
    Publication date: November 19, 2020
    Inventors: Liangfa HU, Prashant Kumar KULSHRESHTHA, Anjana M. PATEL, Abdul Aziz KHAJA, Viren KALSEKAR, Vinay K. PRABHAKAR, Satya Teja Babu THOKACHICHU, Byung Seok KWON, Ratsamee LIMDULPAIBOON, Kwangduk Douglas LEE, Ganesh BALASUBRAMANIAN
  • Publication number: 20200328066
    Abstract: A system and method for forming a film includes generating a plasma in a processing volume of a processing chamber to form the film on a substrate. The processing chamber may include a gas distributor configured to generate the plasma in the processing volume. Further, a barrier gas is provided into the processing volume to form a gas curtain around a plasma located in the processing volume. The barrier gas is supplied by a gas supply source through an inlet port disposed along a first side of the processing chamber. Further, an exhaust port is disposed along the first side of the processing chamber and the plasma and the barrier gas is purged via the exhaust port.
    Type: Application
    Filed: March 25, 2020
    Publication date: October 15, 2020
    Inventors: Byung Seok KWON, Dong Hyung LEE, Prashant Kumar KULSHRESHTHA, Kwangduk Douglas LEE, Ratsamee LIMDULPAIBOON, Irfan JAMIL, Pyeong Youn ROH, Jun MA, Amit Kumar BANSAL, Tuan Anh NGUYEN, Juan Carlos ROCHA-ALVAREZ
  • Publication number: 20200255940
    Abstract: Implementations of the disclosure generally relate to a method of cleaning a semiconductor processing chamber. In one implementation, a method of cleaning a deposition chamber includes flowing a nitrogen containing gas into a processing region within the deposition chamber, striking a plasma in the processing region utilizing a radio frequency power, introducing a cleaning gas into a remote plasma source that is fluidly connected to the deposition chamber, generating reactive species of the cleaning gas in the remote plasma source, introducing the cleaning gas into the deposition chamber, and removing deposits on interior surfaces of the deposition chamber at different etch rates.
    Type: Application
    Filed: February 7, 2020
    Publication date: August 13, 2020
    Inventors: Byung Seok KWON, Lu XU, Prashant Kumar KULSHRESHTHA, Seoyoung LEE, Dong Hyung LEE, Kwangduk Douglas LEE
  • Publication number: 20200249263
    Abstract: Embodiments described herein relate to methods and tools for monitoring electrostatic chucking performance. A performance test is performed that requires only one bowed substrate and one reference substrate. To run the test, the reference substrate is positioned on an electrostatic chuck in a process chamber and the bowed substrate is positioned on the reference substrate. A voltage is applied from a power source to the electrostatic chuck, generating an electrostatic chucking force to secure the bowed substrate to the reference substrate. Thereafter, the applied voltage is decreased incrementally until the electrostatic chucking force is too weak to maintain the bowed substrate in flat form, resulting in dechucking of the bowed wafer. By monitoring the impedance of the chamber during deposition using a sensor, the dechucking threshold voltage can be identified at the point where the impedance of the reference substrate and the impedance of the bowed substrate deviates.
    Type: Application
    Filed: January 21, 2020
    Publication date: August 6, 2020
    Inventors: Lu XU, Sarah Michelle BOBEK, Prashant Kumar KULSHRESHTHA, Byung Seok KWON, Venkata Sharat Chandra PARIMI, Kwangduk Douglas LEE, Juan Carlos ROCHA-ALVAREZ
  • Publication number: 20200234932
    Abstract: Embodiments of the present disclosure generally relate to a pedestal for increasing temperature uniformity in a substrate supported thereon. The pedestal comprises a body having a heater embedded therein. The body comprises a patterned surface that includes a first region having a first plurality of posts extending from a base surface of the body at a first height, and a second region surrounding the central region having a second plurality of posts extending from the base surface at a second height that is greater than the first height, wherein an upper surface of each of the first plurality of posts and the second plurality of posts are substantially coplanar and define a substrate receiving surface.
    Type: Application
    Filed: December 4, 2019
    Publication date: July 23, 2020
    Inventors: Venkata Sharat Chandra PARIMI, Zubin HUANG, Jian LI, Satish RADHAKRISHNAN, Rui CHENG, Diwakar N. KEDLAYA, Juan Carlos ROCHA-ALVAREZ, Umesh M. KELKAR, Karthik JANAKIRAMAN, Sarah Michelle BOBEK, Prashant Kumar KULSHRESHTHA, Vinay K. PRABHAKAR, Byung Seok KWON
  • Patent number: 10692542
    Abstract: A slider is provided with a conformal coating (e.g., an oxide) on the air-bearing surface (ABS) to provide a consistent surface energy to the ABS. The conformal coating may be formed by an atomic layer deposition (ALD) process. A consistent surface energy inhibits accumulation of contaminants on the slider ABS, such as at topographical transition areas.
    Type: Grant
    Filed: December 20, 2019
    Date of Patent: June 23, 2020
    Assignee: SEAGATE TECHNOLOGY LLC
    Inventors: Byung Seok Kwon, David Ellison
  • Publication number: 20200140999
    Abstract: A method of cleaning a component of a semiconductor processing chamber is provided. The method includes exposing residue in a component to a process plasma containing a nitrogen-containing gas and an oxygen-containing gas. The residue in the component undergoes a chemical reaction, cleaning the component. The component is cleaned, restoring the component to the conditions before the process chemistry is run.
    Type: Application
    Filed: November 6, 2018
    Publication date: May 7, 2020
    Inventors: Byung Seok KWON, Prashant Kumar KULSHRESHTHA, Kwangduk LEE, Sarah Michelle BOBEK
  • Publication number: 20200135240
    Abstract: A slider is provided with a conformal coating (e.g., an oxide) on the air-bearing surface (ABS) to provide a consistent surface energy to the ABS. The conformal coating may be formed by an atomic layer deposition (ALD) process. A consistent surface energy inhibits accumulation of contaminants on the slider ABS, such as at topographical transition areas.
    Type: Application
    Filed: December 20, 2019
    Publication date: April 30, 2020
    Inventors: Byung Seok KWON, David ELLISON
  • Patent number: 10522192
    Abstract: A slider is provided with a conformal coating (e.g., an oxide) on the air-bearing surface (ABS) to provide a consistent surface energy to the ABS. The conformal coating may be formed by an atomic layer deposition (ALD) process. A consistent surface energy inhibits accumulation of contaminants on the slider ABS, such as at topographical transition areas.
    Type: Grant
    Filed: May 24, 2018
    Date of Patent: December 31, 2019
    Assignee: SEAGATE TECHNOLOGY LLC
    Inventors: Byung Seok Kwon, David Ellison