Abstract: A three-dimensional semiconductor integrated circuit device including an inter-die interface is provided. The device includes a top die including a plurality of micro cells provided on a top surface of the top die, a plurality of micro bumps provided on a bottom surface of the top die, and wiring patterns connecting the plurality of micro cells to the plurality of micro bumps; and a bottom die including a plurality of macro cells provided on a top surface thereof, wherein the plurality of macro cells are electrically connected to the plurality of micro bumps, respectively, wherein a size of a region in which the plurality of micro cells are provided is smaller than a size of a region in which the plurality of micro bumps are provided.

Abstract: A method for multi-connectivity between a plurality of base stations and user equipment includes estimating, at the user equipment, a first round trip time (RTT) taken in transmitting first data to a first base station, estimating, at the user equipment, a second RTT taken in transmitting second data to a second base station, and determining a size of the first data which is to be transmitted to the first base station, based on the first RTT and the second RTT.

Abstract: A method for multi-connectivity between a plurality of base stations and user equipment includes estimating, at the user equipment, a first round trip time (RTT) taken in transmitting first data to a first base station, estimating, at the user equipment, a second RTT taken in transmitting second data to a second base station, and determining a size of the first data which is to be transmitted to the first base station, based on the first RTT and the second RTT.

Abstract: A communication system configured to perform an address translation and a method of translating an address of the communication system are provided. The communication system configured to transceive a packet through a network includes a modem circuit configured to modulate the packet into a transmission signal to be transmitted to the network and demodulate a receiving signal from the network into the packet, and an address translation circuit configured to translate a network address of the packet, wherein the address translation circuit includes an embedded memory configured to receive a header of the packet from an external memory in which the packet is stored and store the header, a first translator configured to translate a format of the header, and a second translator configured to translate an address included in the header.

Abstract: A method for multi-connectivity between a plurality of base stations and user equipment includes estimating, at the user equipment, a first round trip time (RTT) taken in transmitting first data to a first base station, estimating, at the user equipment, a second RTT taken in transmitting second data to a second base station, and determining a size of the first data which is to be transmitted to the first base station, based on the first RTT and the second RTT.

Abstract: A communication system configured to perform an address translation and a method of translating an address of the communication system are provided. The communication system configured to transceive a packet through a network includes a modem circuit configured to modulate the packet into a transmission signal to be transmitted to the network and demodulate a receiving signal from the network into the packet, and an address translation circuit configured to translate a network address of the packet, wherein the address translation circuit includes an embedded memory configured to receive a header of the packet from an external memory in which the packet is stored and store the header, a first translator configured to translate a format of the header, and a second translator configured to translate an address included in the header.