Abstract: A printed circuit board includes: a first insulating material; a metal layer disposed on a first surface of the first insulating material; a second insulating material disposed on the first surface of the first insulating material; a cavity penetrating through the second insulating material in an area of the second insulating material corresponding to the metal layer; and an insulating film disposed on a surface of the metal layer that is exposed by the cavity.

Abstract: A printed circuit board includes: a first insulating material; a metal layer disposed on a first surface of the first insulating material; a second insulating material disposed on the first surface of the first insulating material; a cavity penetrating through the second insulating material in an area of the second insulating material corresponding to the metal layer; and an insulating film disposed on a surface of the metal layer that is exposed by the cavity.

Abstract: A coil component includes a substrate and a coil portion disposed on at least one surface thereof. The coil portion includes a first coil pattern disposed on one surface of the substrate, a first insulating layer covering the first coil pattern and having a first surface facing the substrate and a second surface opposing the first surface, and an intermediate layer including third and fourth surfaces opposing each other, the third surface being disposed to face the second surface of the first insulating layer, and average surface roughness of the fourth surface being lower than that of the second surface. The coil portion further includes a second coil pattern disposed on the fourth surface of the intermediate layer and connected to the first coil pattern through a conductive via, and a second insulating layer disposed in a space between the fourth surface and the second coil pattern.

Abstract: There are provided a chip electronic component comprising: a magnetic body including an insulation substrate; an internal coil part formed on at least one surface of the insulation substrate; and an external electrode formed on an end surface of the magnetic body and connected to the internal coil part, wherein the internal coil part includes a first coil pattern formed on the insulation substrate and a second coil pattern formed to coat the first coil pattern, and a ratio a/b of a width a of an upper surface of the first coil pattern with respect to a width b of a lower surface of the first coil pattern is less than 1.

Abstract: A coil component includes a substrate and a coil portion disposed on at least one surface thereof. The coil portion includes a first coil pattern disposed on one surface of the substrate, a first insulating layer covering the first coil pattern and having a first surface facing the substrate and a second surface opposing the first surface, and an intermediate layer including third and fourth surfaces opposing each other, the third surface being disposed to face the second surface of the first insulating layer, and average surface roughness of the fourth surface being lower than that of the second surface. The coil portion further includes a second coil pattern disposed on the fourth surface of the intermediate layer and connected to the first coil pattern through a conductive via, and a second insulating layer disposed in a space between the fourth surface and the second coil pattern.

Abstract: There are provided a chip electronic component comprising: a magnetic body including an insulation substrate; an internal coil part formed on at least one surface of the insulation substrate; and an external electrode formed on an end surface of the magnetic body and connected to the internal coil part, wherein the internal coil part includes a first coil pattern formed on the insulation substrate and a second coil pattern formed to coat the first coil pattern, and a ratio a/b of a width a of an upper surface of the first coil pattern with respect to a width b of a lower surface of the first coil pattern is less than 1.

Abstract: Disclosed herein are a printed circuit board and a method for manufacturing the same. The method for manufacturing a printed circuit board includes: (a) forming at least one plate through hole penetrating through an insulating layer; (b) forming pattern grooves for implementing inner layer circuits on both surfaces of the insulating layer; and (c) filling the plate through hole and the pattern grooves with a conductive material. The method for manufacturing a printed circuit board may provide the printed circuit board having excellent heat radiating characteristics and reduce process cost.