Patents by Inventor Byung-Soo Kang

Byung-Soo Kang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11944998
    Abstract: A method of fabricating a capacitive micromachined ultrasonic transducer (CMUT) according to one aspect of the present invention may include forming, on a semiconductor substrate, a first region implanted with impurity ions at a first average concentration and a second region implanted with no impurity ions or implanted with the impurity ions at a second average concentration lower than the first average concentration, forming an insulating layer by oxidizing the semiconductor substrate wherein the insulating layer includes a first oxide layer having a first thickness on at least a part of the first region and a second oxide layer having a second thickness smaller than the first thickness on at least a part of the second region, and forming a membrane layer on the insulating layer such that a gap is defined between the second oxide layer and the membrane layer.
    Type: Grant
    Filed: March 18, 2020
    Date of Patent: April 2, 2024
    Assignee: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Byung Chul Lee, Dong-Hyun Kang, Jin soo Park, Tae Song Kim
  • Patent number: 11942264
    Abstract: A coil component includes a body having a first surface, and a first end surface and a second end surface connected to the first surface and opposing each other in a length direction; a support substrate disposed inside the body; a coil portion comprising a first coil pattern and first and second lead-out patterns, each disposed on a first surface of the support substrate; first and second slit portions, respectively defined on edge portions of the first surface of the body to expose the first and second lead-out patterns; and first and second external electrodes disposed on the first and second slit portions to be connected to the first and second lead-out patterns. At least one of the first and second lead-out patterns has a thickness greater than a thickness of each of the first coil pattern and the first dummy lead-out pattern.
    Type: Grant
    Filed: December 8, 2020
    Date of Patent: March 26, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: No Il Park, Byung Soo Kang, Seung Mo Lim, Byeong Cheol Moon, Boum Seock Kim, Yong Hui Li, Seung Min Lee
  • Publication number: 20240084145
    Abstract: Disclosed are a pearlescent pigment and a preparation method therefor, wherein the pigment has a multilayered structure including a low-refractive index material layer between high-refractive index material layers on a glass flake substrate and thus has high color intensity, various colors depending on the viewing angle, and an improved sparkling effect. The pearlescent pigment according to the present invention comprises: a glass flake substrate having a D10 value of 40-80 ?m, a D50 value of 160-250 ?m, and a D90 value of 350-600 ?m and a thickness of 500 nm or more; and a metal oxide layer coated on the substrate, the metal oxide layer having a structure of a first metal oxide layer/an intermediate oxide layer containing MgO·SiO2/a second metal oxide layer.
    Type: Application
    Filed: June 28, 2022
    Publication date: March 14, 2024
    Inventors: Jae Il JEONG, Kwang Choong KANG, Byung Ki CHOI, Kwang Soo LIM, Kil Wan CHANG
  • Patent number: 11923124
    Abstract: A coil component includes a body having one surface, and one end surface and the other end surface, respectively connected to the one surface and opposing each other, a support substrate embedded in the body, and a coil portion disposed on the support substrate and including first and second lead-out patterns respectively exposed from surfaces of the body. The first lead-out pattern is exposed from the one surface of the body and the one end surface of the body. The second lead-out pattern is exposed from the one surface of the body and the other end surface of the body. The body includes an anchor portion disposed in each of the first and second lead-out patterns.
    Type: Grant
    Filed: August 2, 2019
    Date of Patent: March 5, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ju Hwan Yang, Jae Hun Kim, Joung Gul Ryu, Byung Soo Kang, Byeong Cheol Moon, Jeong Gu Yeo
  • Publication number: 20240066059
    Abstract: A method for producing CAR-M1 macrophages expressing a chimeric antigen receptor in vitro and in vivo includes using a conjugate of a non-viral gene delivery system and a chimeric antigen receptor gene. The CAR-M1 macrophages are produced in vivo by delivering genes encoding a chimeric antigen receptor and IFN-?, specifically to macrophages in the body, and thus does not require culturing and preparing an in-vitro cellular therapeutic agent, thus reducing the manufacturing costs of therapeutic agents. The CAR-M1 macrophages are a safer therapy since a non-viral vector is used, as compared to the production of CAR-M1 macrophages by gene delivery using a viral vector, and are a novel therapeutic candidate having the advantage of high anticancer efficiency for solid cancers, due to CAR-M1 macrophages in which intrinsic properties of macrophages infiltrating solid cancers and cancer cell phagocytosis are improved.
    Type: Application
    Filed: March 3, 2022
    Publication date: February 29, 2024
    Inventors: Byung Soo KIM, Mi Kyung KANG, Hee Ho PARK
  • Patent number: 11911983
    Abstract: Provided is a method of forming a micro/nanowire having a nanometer- to micrometer-sized diameter at predetermined positions of an object. The method includes: preparing a micro/nanopipette having a tip with an inner diameter which is substantially the same as the diameter of the micro/nanowire to be formed; filling the micro/nanopipette with a solution containing a micro/nanowire-forming material; brining the solution into contact with the object through the tip of the micro/nanopipette; and pulling the micro/nanopipette from the object at a pulling speed lower than or equal to a predetermined critical speed (?c) to obtain a micro/nanowire having substantially the same diameter as the inner diameter of the micro/nanopipette tip.
    Type: Grant
    Filed: May 3, 2021
    Date of Patent: February 27, 2024
    Assignee: POSTECH RESEARCH AND BUSINESS DEVELOPMENT FOUNDATION
    Inventors: Jung Ho Je, Un Yang, Seung Soo Oh, Moon Jung Yong, Byung Hwa Kang
  • Patent number: 11915853
    Abstract: A coil component is provided. The coil component includes a body having fifth and sixth surfaces opposing each other, first and second surfaces respectively connecting the fifth and sixth surfaces of the body and opposing each other, and third and fourth surfaces respectively connecting the first and second surfaces of the body and opposing each other in one direction, a recess disposed in an edge between one of the first and second surfaces of the body and the sixth surface of the body, a coil portion disposed inside the body and exposed through the recess, and an external electrode including a connection portion disposed in the recess and connected to the coil portion, and a pad portion disposed on one surface of the body. A length of the pad portion in the one direction is greater than a length of the connection portion in the one direction.
    Type: Grant
    Filed: November 6, 2020
    Date of Patent: February 27, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seung Mo Lim, Seung Min Lee, Byeong Cheol Moon, Yong Hui Li, Byung Soo Kang, Ju Hwan Yang, Tai Yon Cho, No Il Park, Tae Jun Choi
  • Patent number: 11901112
    Abstract: A coil component includes a support substrate, a coil portion disposed on at least one surface of the support substrate, a body including the support substrate and the coil portion disposed therein, an external electrode disposed on a surface of the body and connected to the coil portion, and an insulating layer disposed in a region of the surface of the body other than a region in which the external electrode is disposed, wherein an average roughness (Ra) of the surface of the body in contact with the external electrode is different from an average roughness (Ra) of the surface of the body in contact with the insulating layer.
    Type: Grant
    Filed: August 12, 2020
    Date of Patent: February 13, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ju Hwan Yang, Seung Mo Lim, No Il Park, Byung Soo Kang, Byeong Cheol Moon
  • Patent number: 11869698
    Abstract: A coil component includes a body having one surface and the other surface, opposing each other, and one side surface and the other side surface, each connecting the one surface and the other surface to each other, opposing each other, a recess formed in each of the one side surface and the other side surface of the body to extend to the one surface of the body, a support substrate disposed inside the body, a coil portion, disposed on the support substrate, having one end portion and the other end portion exposed to the recess, an oxide insulating layer disposed on a surface of the body, and a first insulating layer disposed along a surface of the oxide insulating layer to cover the surface of the body.
    Type: Grant
    Filed: January 27, 2020
    Date of Patent: January 9, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ju Hwan Yang, Seung Min Lee, Byung Soo Kang, Byeong Cheol Moon, Yong Hui Li
  • Patent number: 11862386
    Abstract: A coil component includes a body having a first surface and a second surface opposing each other in a thickness direction of the body and including a core formed in the thickness direction; a coil part embedded in the body and including at least one turn around the core; an insulating layer disposed on the first surface of the body; a bonded conductive layer disposed on the insulating layer and having a surface roughness of the first surface which is in contact with the insulating layer greater than a surface roughness of the second surface opposing the first surface of the bonded conductive layer; and external electrodes connected to the coil part and covering the bonded conductive layer.
    Type: Grant
    Filed: August 11, 2021
    Date of Patent: January 2, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Byung Soo Kang, Byeong Cheol Moon, Joung Gul Ryu, Ju Hwan Yang
  • Patent number: 11837388
    Abstract: A coil component includes a body including magnetic metal powder particles and an insulating resin; a coil portion embedded in the body; and first and second external electrodes respectively disposed on the body to be spaced apart from each other and respectively connected to both end portions of the coil portion. A magnetic metal powder particle exposed from a surface of the body, among the magnetic metal powder particles, has a plating prevention film formed on at least a portion of a surface thereof and containing metal ions of the exposed magnetic metal powder particle.
    Type: Grant
    Filed: September 17, 2019
    Date of Patent: December 5, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Byung Soo Kang, Ju Hwan Yang, Byeong Cheol Moon, Yoon Mi Cha, Mi Geum Kim
  • Patent number: 11830663
    Abstract: A coil component includes a body having one surface and the other surface, opposing each other, and wall surfaces, and including a metal magnetic powder particle and an insulating resin; a coil portion disposed in the body and including first and second lead-out portions exposed from the one surface of the body to be spaced apart from each other; first and second external electrodes arranged on the one surface of the body to be spaced apart from each other and respectively connected to the first and second lead-out portions; a cover insulating layer covering the other surface of the body and extending to at least portion of each of the wall surfaces of the body; and an oxide insulating film disposed on a surface of the metal magnetic powder particle exposed from the one surface of the body and including metal ions of the metal magnetic powder particle.
    Type: Grant
    Filed: August 10, 2020
    Date of Patent: November 28, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Byung Soo Kang, Byeong Cheol Moon, Ju Hwan Yang, Yoon Mi Cha, Tai Yon Cho, Tae Jun Choi
  • Patent number: 11830653
    Abstract: A coil electronic component includes a body having a first surface and a second surface opposing each other and a third and a fourth surface opposing each other, an insulating substrate disposed inside the body, first and second coil portions respectively disposed on opposing surfaces of the insulating substrate, a first lead-out portion connected the first coil portion and exposed from the first and third surfaces, a second lead-out portion connected to the second coil portion and exposed from the second and third surfaces, and first and second external electrodes respectively covering the first and second lead-out portions. The insulating substrate includes a support portion supporting the first and second coil portions, a first tip exposed from the first and third surfaces and supporting the first lead-out portion, and a second tip exposed from the second and third surfaces and supporting the second lead-out portion.
    Type: Grant
    Filed: August 1, 2019
    Date of Patent: November 28, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ju Hwan Yang, Byung Soo Kang, Yoon Mi Cha, Byeong Cheol Moon
  • Patent number: 11830655
    Abstract: A coil component includes a body, a support substrate disposed in the body, and a coil portion including a first coil pattern on one surface of the support substrate, a first lead-out pattern extending from the first coil pattern to an end surface of the body, and a second lead-out pattern disposed on the one surface of the support substrate to be spaced apart from the first coil pattern and extending to another end surface of the body. A reinforcing pattern portion is disposed between each lead-out pattern and the one surface of the support substrate, first and second slit portions are disposed in edge portions of the body and respectively expose the first and second lead-out patterns, and first and second external electrodes are respectively disposed on the inner surfaces of the first and second slit portions and respectively connected to the first and second lead-out patterns.
    Type: Grant
    Filed: August 11, 2020
    Date of Patent: November 28, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ju Hwan Yang, Joung Gul Ryu, Ji Man Ryu, Byung Soo Kang, Byeong Cheol Moon
  • Patent number: 11763978
    Abstract: A coil component may include a body having one surface and the other surface facing each other; a wound coil embedded in the body; a first lead frame and a second lead frame, embedded in the body and each having one surface exposed to the one surface of the body to be spaced apart from each other; and a connection portion connecting at least one of the first and second lead frames and at least one end portion of the wound coil.
    Type: Grant
    Filed: August 5, 2019
    Date of Patent: September 19, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD
    Inventors: Ju Hwan Yang, Tae Jun Choi, Byung Soo Kang, Woo Chui Shin, Byeong Cheol Moon
  • Patent number: 11742131
    Abstract: A coil component includes a body, a coil portion disposed inside the body, a first external electrode and a second external electrode spaced apart from each other on one surface of the body and connected to the coil portion, a first insulating layer and a second insulating layer respectively connected to the one surface of the body, respectively disposed to side surfaces of the body to extend upwardly of the one surface of the body, and a third insulating layer and a fourth insulating layer respectively connected to the one surface of the body, respectively disposed on end surfaces of the body and each extending upwardly of the one surface of the body. A portion of each of the first and second external electrodes, exposed from the first to fourth insulating layers, is spaced apart from each of a plurality of edges of the one surface of the body.
    Type: Grant
    Filed: November 12, 2020
    Date of Patent: August 29, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Byung Soo Kang, Yong Hui Li, Seung Mo Lim, Byeong Cheol Moon
  • Patent number: 11699546
    Abstract: A coil component includes a body; a supporting substrate embedded in the body; a coil portion including a coil pattern, and a lead-out pattern exposed to an outside of the body through an external surface of the body, and disposed on the supporting substrate and embedded in the body; and an insulating film disposed between the coil portion and the body, wherein at least a portion of the lead-out pattern contacts the body through an opening formed in the insulating film.
    Type: Grant
    Filed: May 6, 2020
    Date of Patent: July 11, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yong Hui Li, Byung Soo Kang, Byeong Cheol Moon, Ju Hwan Yang, Seung Min Lee
  • Publication number: 20230187129
    Abstract: A coil component includes a molded portion having one surface and another surface opposing each other, and a wound coil disposed on the one surface of the molded portion and including an innermost turn, at least one intermediate turn, and an outermost turn disposed outwardly of a central portion of the one surface of the molded portion. A cover portion is disposed to face the one surface of the molded portion and to cover the wound coil, and first and second external electrodes are connected to the wound coil and arranged to be spaced apart from each other on the other surface of the molded portion. A thickness of one region of the cover portion disposed on the innermost turn is thicker than a thickness of another region of the cover portion disposed on the outermost turn.
    Type: Application
    Filed: February 7, 2023
    Publication date: June 15, 2023
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Byung Soo Kang, Byeong Cheol Moon, Tae Jun Choi, Ju Hwan Yang
  • Patent number: 11664156
    Abstract: A coil component includes a support substrate, a coil portion disposed on at least one surface of the support substrate, a body, in which the support substrate and the coil portion are disposed, having one surface and the other surface opposing each other, a first external electrode and a second external electrode disposed on the other surface of the body to be spaced apart from each other and connected to the coil portion, a marking portion disposed on the one surface of the body, and a first insulating layer disposed on the one surface of the body and having an opening exposing the marking portion. The marking portion has a thickness less than or equal to a thickness of the first insulating layer.
    Type: Grant
    Filed: July 17, 2020
    Date of Patent: May 30, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: No Il Park, Seung Mo Lim, Byung Soo Kang, Byeong Cheol Moon
  • Patent number: 11664153
    Abstract: A coil component includes a body having one surface and the other surface opposing each other and including a magnetic metal powder particle and an insulating resin; a coil portion embedded in the body and having end portions respectively exposed from end surfaces of the body; first and second external electrodes arranged to be spaced apart from each other on the one surface and extending to the end surfaces to be connected to the end portions, respectively; and an external insulating layer disposed between each of the first and second external electrodes and the one surface of the body. A magnetic metal powder particle exposed on the wall surface of the body, among the magnetic metal powder particle, has a plating prevention film disposed on at least a portion of a surface of the exposed magnetic metal powder particle and including metal ions of the magnetic metal powder particle.
    Type: Grant
    Filed: September 10, 2019
    Date of Patent: May 30, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ju Hwan Yang, Byeong Cheol Moon, Byung Soo Kang, Yoon Mi Cha