Patents by Inventor Byung Sung Kang
Byung Sung Kang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11967462Abstract: A capacitor component includes a body, including a dielectric layer and an internal electrode layer, and an external electrode disposed on the body and connected to the internal electrode layer. At least one hole is formed in the internal electrode layer, and a region, containing at least one selected from the group consisting of indium (In) and tin (Sn), is disposed in the hole. A method of manufacturing a capacitor component includes forming a dielectric green sheet, forming a conductive thin film, including a first conductive material and a second conductive material, on the dielectric green sheet, and sintering the conductive thin film to form an internal electrode layer. The internal electrode layer includes the first conductive material, and a region, including the second conductive material, is formed in the internal electrode layer.Type: GrantFiled: October 12, 2021Date of Patent: April 23, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Yun Sung Kang, Su Yeon Lee, Won Jun Na, Byung Kun Kim, Yu Hong Oh, Sun Hwa Kim, Jae Eun Heo, Hoe Chul Jung
-
Publication number: 20230093953Abstract: A method of producing a core-shell particle includes introducing a barium titanate-based base powder and an additive to a reactor, and exposing the barium titanate-based base powder and the additive to a thermal plasma torch to obtain core-shell particles including a core portion having barium titanate (BaTiO3) and a shell portion including the additive and formed on a surface of the core portion.Type: ApplicationFiled: November 22, 2022Publication date: March 30, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jin Sung CHUN, Hae Suk CHUNG, Byung Sung KANG, Yun Jung PARK, Young Hoon SONG
-
Patent number: 11551871Abstract: A dielectric composition includes a ceramic powder, a high polymerization binder, and a low polymerization binder type dispersant having a degree of polymerization between 100 and 1,000.Type: GrantFiled: January 14, 2021Date of Patent: January 10, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jin Sung Chun, Seul Gi Kim, Hyo Kyong Seo, Hae Suk Chung, Byung Sung Kang
-
Patent number: 11538630Abstract: A method of producing a core-shell particle includes introducing a barium titanate-based base powder and an additive to a reactor, and exposing the barium titanate-based base powder and the additive to a thermal plasma torch to obtain core-shell particles including a core portion having barium titanate (BaTiO3) and a shell portion including the additive and formed on a surface of the core portion.Type: GrantFiled: May 1, 2020Date of Patent: December 27, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jin Sung Chun, Hae Suk Chung, Byung Sung Kang, Yun Jung Park, Young Hoon Song
-
Patent number: 11227724Abstract: A method of manufacturing a multilayer ceramic capacitor includes forming a water-repellent coating layer on surfaces of a multilayer ceramic capacitor having an internal electrode, a dielectric layer, and an external electrode; and removing at least a portion of the water-repellent coating layer formed on the surfaces of the external electrode such that another portion of the water-repellent coating layer remains on surfaces of the dielectric layer. The external electrode has first and second surfaces opposing each other in a thickness direction, third and fourth surfaces opposing each other in a width direction, and fifth and sixth surfaces opposing each other in a length direction.Type: GrantFiled: August 20, 2019Date of Patent: January 18, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jin Sung Chun, Hyo Kyong Seo, Hae Suk Chung, Chae Min Park, Byung Sung Kang
-
Publication number: 20210159013Abstract: A method of producing a core-shell particle includes introducing a barium titanate-based base powder and an additive to a reactor, and exposing the barium titanate-based base powder and the additive to a thermal plasma torch to obtain core-shell particles including a core portion having barium titanate (BaTiO3) and a shell portion including the additive and formed on a surface of the core portion.Type: ApplicationFiled: May 1, 2020Publication date: May 27, 2021Inventors: Jin Sung CHUN, Hae Suk CHUNG, Byung Sung KANG, Yun Jung PARK, Young Hoon SONG
-
Patent number: 11017953Abstract: A multilayer ceramic electronic component includes: a ceramic body having a dielectric layer, and a plurality of first and second internal electrodes facing each other with the dielectric layer interposed therebetween; and first and second external electrodes disposed on an outer surface of the ceramic body, respectively. The ceramic body includes an active portion including a plurality of internal electrodes facing each other with the dielectric layer interposed therebetween to form capacitance, and cover portions formed on upper and lower portions of the active portion. A buffer region is disposed between at least one pair of first and second internal electrodes among the plurality of first and second internal electrodes disposed inside the active portion, and satisfies the relation 0<tb<150 ?m+td, where td is a thickness of the dielectric layer, and tb is a thickness of the buffer region.Type: GrantFiled: July 30, 2020Date of Patent: May 25, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kyeong Jun Kim, Jang Hyun Lee, Hae Suk Chung, Do Lee, Byung Sung Kang, Ho In Jun
-
Publication number: 20210134528Abstract: A dielectric composition includes a ceramic powder, a high polymerization binder, and a low polymerization binder type dispersant having a degree of polymerization between 100 and 1,000.Type: ApplicationFiled: January 14, 2021Publication date: May 6, 2021Inventors: Jin Sung CHUN, Seul Gi KIM, Hyo Kyong SEO, Hae Suk CHUNG, Byung Sung KANG
-
Patent number: 10929563Abstract: An electronic device protecting privacy of a user is provided. The electronic device includes a transceiver configured to transmit and receive wireless communication signals of Wi-Fi networks, and at least one processor configured to detect occurring of an event for identifying a location of the electronic device, determine whether to use the Wi-Fi networks for identifying the location of the electronic device, control the transceiver to perform an active scan, when the Wi-Fi networks is used to identify the location of the electronic device, and control the transceiver to transmit one or more probe request frames including a virtual media access control (MAC) address to an access point of the Wi-Fi networks for identifying the location of the electronic device, when the transceiver to be performed in the active scan.Type: GrantFiled: December 17, 2018Date of Patent: February 23, 2021Assignee: Samsung Electronics Co., Ltd.Inventors: Su Ha Yoon, Sin Jae Kang, Byung Sung Kang, Sae Rome Kim, In Su Yoon
-
Patent number: 10867749Abstract: A multilayer capacitor includes a capacitor body, a first external electrode, and a second external electrode. The capacitor body includes a plurality of first and second internal electrodes alternately stacked with dielectric layer interposed therebetween. The first and second external electrodes are electrically connected to the first and second internal electrodes, respectively. A first Schottky layer is Schottky-junctioned to an interface between the dielectric layer and the first internal electrode in the capacitor body. A second Schottky layer is Schottky-junctioned to an interface between the dielectric later and the second internal electrode in the capacitor body. The work function values of the first and second Schottky layers is higher than the work function values of the first and second internal electrodes.Type: GrantFiled: October 26, 2018Date of Patent: December 15, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jin Sung Chun, Hae Suk Chung, Kyeong Jun Kim, Byung Sung Kang
-
Publication number: 20200357575Abstract: A multilayer ceramic electronic component includes: a ceramic body having a dielectric layer, and a plurality of first and second internal electrodes facing each other with the dielectric layer interposed therebetween; and first and second external electrodes disposed on an outer surface of the ceramic body, respectively. The ceramic body includes an active portion including a plurality of internal electrodes facing each other with the dielectric layer interposed therebetween to form capacitance, and cover portions formed on upper and lower portions of the active portion. A buffer region is disposed between at least one pair of first and second internal electrodes among the plurality of first and second internal electrodes disposed inside the active portion, and satisfies the relation 0<tb<150 ?m+td, where td is a thickness of the dielectric layer, and tb is a thickness of the buffer region.Type: ApplicationFiled: July 30, 2020Publication date: November 12, 2020Inventors: Kyeong Jun KIM, Jang Hyun LEE, Hae Suk CHUNG, Do LEE, Byung Sung KANG, Ho In JUN
-
Patent number: 10755860Abstract: A multilayer ceramic electronic component includes: a ceramic body having a dielectric layer, and a plurality of first and second internal electrodes facing each other with the dielectric layer interposed therebetween; and first and second external electrodes disposed on an outer surface of the ceramic body, respectively. The ceramic body includes an active portion including a plurality of internal electrodes facing each other with the dielectric layer interposed therebetween to form capacitance, and cover portions formed on upper and lower portions of the active portion. A buffer region is disposed between at least one pair of first and second internal electrodes among the plurality of first and second internal electrodes disposed inside the active portion, and satisfies the relation 0<tb<150 ?m+td, where td is a thickness of the dielectric layer, and tb is a thickness of the buffer region.Type: GrantFiled: February 13, 2019Date of Patent: August 25, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kyeong Jun Kim, Jang Hyun Lee, Hae Suk Chung, Do Lee, Byung Sung Kang, Ho In Jun
-
Publication number: 20200161048Abstract: A dielectric composition includes a ceramic powder, a high polymerization binder, and a low polymerization binder type dispersant having a degree of polymerization between 100 and 1,000.Type: ApplicationFiled: February 14, 2019Publication date: May 21, 2020Inventors: Jin Sung CHUN, Seul Gi KIM, Hyo Kyong SEO, Hae Suk CHUNG, Byung Sung KANG
-
Publication number: 20200152389Abstract: A multilayer ceramic electronic component includes: a ceramic body having a dielectric layer, and a plurality of first and second internal electrodes facing each other with the dielectric layer interposed therebetween; and first and second external electrodes disposed on an outer surface of the ceramic body, respectively. The ceramic body includes an active portion including a plurality of internal electrodes facing each other with the dielectric layer interposed therebetween to form capacitance, and cover portions formed on upper and lower portions of the active portion. A buffer region is disposed between at least one pair of first and second internal electrodes among the plurality of first and second internal electrodes disposed inside the active portion, and satisfies the relation 0<tb<150 ?m+td, where td is a thickness of the dielectric layer, and tb is a thickness of the buffer region.Type: ApplicationFiled: February 13, 2019Publication date: May 14, 2020Inventors: Kyeong Jun Kim, Jang Hyun Lee, Hae Suk Chung, Do LEE, Byung Sung Kang, Ho In Jun
-
Publication number: 20200135404Abstract: In a method of manufacturing a multilayer ceramic capacitor, and a multilayer ceramic capacitor manufactured by the same, moisture resistance at a junction between a ceramic body and an external electrode may be improved and excellent substrate mounting properties may be provided.Type: ApplicationFiled: August 20, 2019Publication date: April 30, 2020Inventors: Jin Sung CHUN, Hyo Kyong SEO, Hae Suk CHUNG, Chae Min PARK, Byung Sung KANG
-
Publication number: 20200027660Abstract: A multilayer capacitor includes a capacitor body, a first external electrode, and a second external electrode. The capacitor body includes a plurality of first and second internal electrodes alternately stacked with dielectric layer interposed therebetween. The first and second external electrodes are electrically connected to the first and second internal electrodes, respectively. A first Schottky layer is Schottky-junctioned to an interface between the dielectric layer and the first internal electrode in the capacitor body. A second Schottky layer is Schottky-junctioned to an interface between the dielectric later and the second internal electrode in the capacitor body. The work function values of the first and second Schottky layers is higher than the work function values of the first and second internal electrodes.Type: ApplicationFiled: October 26, 2018Publication date: January 23, 2020Inventors: Jin Sung CHUN, Hae Suk CHUNG, Kyeong Jun KIM, Byung Sung KANG
-
Publication number: 20190138752Abstract: An electronic device protecting privacy is provided. The electronic device includes a communication module configured to perform wireless communication, and a control module configured to select one of an active scan and a passive scan by controlling the communication module.Type: ApplicationFiled: December 17, 2018Publication date: May 9, 2019Inventors: Su Ha YOON, Sin Jae KANG, Byung Sung KANG, Sae Rome KIM, In Su YOON
-
Patent number: 9390844Abstract: A chip resistor may include: a body having a plurality of substrates stacked therein; a plurality of resistors formed in the body with respective substrates interposed therebetween and exposed through both end surfaces of the body; and first and second electrodes covering both end surfaces of the body, respectively, and connected to both end portions of the exposed resistors, respectively.Type: GrantFiled: March 21, 2014Date of Patent: July 12, 2016Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Sung Hun Cho, Young Key Joo Kim, Chang Ho Lee, Byung Sung Kang
-
Patent number: 9305686Abstract: There are provided a multilayer ceramic electronic component that does not require a heat treatment under a reduction atmosphere, and a manufacturing method thereof, wherein a conductive oxide is used as a material of internal and external electrodes and conductive layers having elasticity are formed on the external electrodes. In the case of the multilayer ceramic electronic component, a firing process may be performed under an air atmosphere, such that a manufacturing process may be simplified and manufacturing costs may be reduced.Type: GrantFiled: October 2, 2012Date of Patent: April 5, 2016Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Byung Sung Kang, Byung Kil Seo
-
Publication number: 20150235052Abstract: An electronic device protecting privacy is provided. The electronic device includes a communication module configured to perform wireless communication, and a control module configured to select one of an active scan and a passive scan by controlling the communication module.Type: ApplicationFiled: June 16, 2014Publication date: August 20, 2015Inventors: Su Ha YOON, Sin Jae KANG, Byung Sung KANG, Sae Rome KIM, In Su YOON