Abstract: An optical transmission and reception connector system includes a cable that has a plug section formed at both ends thereof so as to relay and transmit light and an interfacing module that is mounted on an electronic apparatus and that includes an insertion space into which the plug section is detachably inserted. The cable is provided with a first relay optical path and a second relay optical path.

Abstract: An optical transmission and reception connector system includes a cable that has a plug section formed at both ends thereof so as to relay and transmit light and an interfacing module that is mounted on an electronic apparatus and that includes an insertion space into which the plug section is detachably inserted. The cable is provided with a first relay optical path and a second relay optical path.

Abstract: A system package using flexible optical waveguides and electrical wires, and a signal processing method thereof are disclosed. Several rigid substrates having highly integrated electronic elements and optical elements mounted thereon can be electrically and optically connected by using flexible substrates that are electrically wired and optically connected. The package can be variously changed when configuring the package by the flexible substrate and the heat dissipation device and the electromagnetic shielding device are installed in the inside of the package, making it possible to solve electromagnetic wave interference problems and thermal problems occurring in the inside of the package.

Abstract: A fabrication method of an optical module comprises a mixed/hybrid optical alignment method, and an optical module uses the same fabrication method using an optical element chip such as a light source chip or a photodetector chip, etc. on an optical wiring substrate and making it possible to simultaneously secure mass productivity that is the advantage of the passive alignment method according to the related art and alignment accuracy that is the advantage of the active alignment method.

Abstract: A system package using flexible optical waveguides and electrical wires, and a signal processing method thereof are disclosed. Several rigid substrates having highly integrated electronic elements and optical elements mounted thereon can be electrically and optically connected by using flexible substrates that are electrically wired and optically connected. The package can be variously changed when configuring the package by the flexible substrate and the heat dissipation device and the electromagnetic shielding device are installed in the inside of the package, making it possible to solve electromagnetic wave interference problems and thermal problems occurring in the inside of the package.

Abstract: An optical module is disclosed. The optical module includes a substrate, and at least one planar optical waveguide that includes a plurality of waveguides and at least one groove vertically penetrating the upper surface of the substrate and which is successively laminated on the substrate. The optical module also includes at least one PCB having at least one integrated photoelectric conversion device that is positioned on the planar optical waveguide facing a corresponding groove, and at least one optical connection block including a body and optical fibers embedded in the body in such a manner that both ends thereof are exposed to the lateral and upper surfaces of the body. The optical connection block is inserted into the corresponding groove of the planar optical waveguide in such a manner that both ends of the optical fibers, which have been exposed, face the waveguides and the PCBs, respectively.

Abstract: A packaging apparatus for optical interconnection on an optical PCB includes a first substrate with a via hole formed therethrough and in which an optical waveguide is formed, an optical interconnection block having a reflective plane on its lower end inserted into the via hole, a second substrate flip-bonded to an upper surface of the first substrate, and an optically active element flip-bonded to a lower surface of the second substrate and aligned for optical communication.

Abstract: An optical module is disclosed. The optical module includes a substrate, and at least one planar optical waveguide that includes a plurality of waveguides and at least one groove vertically penetrating the upper surface of the substrate and which is successively laminated on the substrate. The optical module also includes at least one PCB having at least one integrated photoelectric conversion device that is positioned on the planar optical waveguide facing a corresponding groove, and at least one optical connection block including a body and optical fibers embedded in the body in such a manner that both ends thereof are exposed to the lateral and upper surfaces of the body. The optical connection block is inserted into the corresponding groove of the planar optical waveguide in such a manner that both ends of the optical fibers, which have been exposed, face the waveguides and the PCBs, respectively.

Abstract: A packaging apparatus for optical interconnection on an optical PCB includes a first substrate with a via hole formed therethrough and in which an optical waveguide is formed, an optical interconnection block having a reflective plane on its lower end inserted into the via hole, a second substrate flip-bonded to an upper surface of the first substrate, and an optically active element flip-bonded to a lower surface of the second substrate and aligned for optical communication.