Patents by Inventor Byung T. Do

Byung T. Do has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package with integral heat dissipator
    Patent number: 5629561
    Abstract: A highly integrated semiconductor package having a light and compact construction and heat dissipating means suitable to effectively dissipate heat generated from the package during the operation of the package is disclosed. The semiconductor package has a lower heat sink for dissipating heat generated from a semiconductor chip of the package. The package also has a tape attached to the top of a plurality of inner leads of the package. The inner leads are attached to the top surface of the lower heat sink. The package further has a heat dissipating means for dissipating heat generated from the inner leads. The heat dissipating means has a heat bar attached to the tape. An upper heat sink may be integrated with the heat bar so as to form the heat dissipating means.
    Type: Grant
    Filed: December 12, 1995
    Date of Patent: May 13, 1997
    Assignees: Anam Industrial Co., Ltd., Amkor Electronics, Inc.
    Inventors: Won S. Shin, Byung T. Do