Abstract: A photosensitive resin composition includes: a) an acryl-based copolymer obtained by copolymerizing i) a hydroxyl group-containing unsaturated compound; ii) an unsaturated carboxylic acid, an unsaturated carboxylic anhydride, or a mixture thereof; iii) an epoxy group-containing unsaturated compound; and iv) an olefin-based unsaturated compound, b) a 1,2-quinonediazide 5-sulfonic ester compound having a phenol compound including a compound represented by the above Chemical Formula A as ballast, c) a silane coupling agent, and d) a solvent.

Abstract: A photosensitive resin composition includes: a) an acryl-based copolymer obtained by copolymerizing i) a hydroxyl group-containing unsaturated compound; ii) an unsaturated carboxylic acid, an unsaturated carboxylic anhydride, or a mixture thereof; iii) an epoxy group-containing unsaturated compound; and iv) an olefin-based unsaturated compound, b) a 1,2-quinonediazide 5-sulfonic ester compound having a phenol compound including a compound represented by the above Chemical Formula A as ballast, c) a silane coupling agent, and d) a solvent.

Abstract: A positive photosensitive siloxane resin composition includes a) a siloxane copolymer obtained by performing hydrolysis and condensation polymerization of i) at least one reactive silane represented by the following Chemical Formula 1 and ii) at least one 4-functional reactive silane represented by the following Chemical Formula 2 under a catalyst, the copolymer having a polystyrene-converted weight average molecular weight Mw of 1,000 to 20,000, b) a 1,2-quinonediazide compound, and c) a solvent, (R1)nSi(R2)4-n??[Chemical Formula 1] Si(R3)4??[Chemical Formula 2] wherein R1s may each independently be any one of an alkyl group having 1 to 10 carbon atoms and an aryl group having 6 to 15 carbon atoms, R2 may be an alkoxy group having 1 to 4 carbon atoms, phenoxy, or acetoxy, R3s may each independently be any one of an alkoxy group having 1 to 4 carbon atoms, phenoxy, or an acetoxy group, and n may be a natural number of 1 to 3.

Abstract: The present invention relates to a liquid crystal composition. The liquid crystal composition has low rotational viscosity, and simultaneously, has excellent low temperature stability, and thus, can be usefully used in IPS (In-Plane Switching) or FFS (Fringe-Field Switching) mode TV or monitors which require low voltage driving and high speed response properties, and liquid crystal display devices such as mobile notebooks or tablet PCs, which particularly requires low temperature stability.

Abstract: A photoresist composition includes about 0.1 to about 30 parts by weight of a photo-initiator, about 1 to 50 parts by weight of a first acrylate monomer including at least five functional groups, about 1 to 50 parts by weight of a second acrylate monomer including at most four functional groups with respect to about 100 parts by weight of an acryl-copolymer.

Abstract: A photoresist composition includes an acid-labile polymer that is decomposable by reaction with an acid, a photoacid generator, an organic base having a pKa value of 9 or less and a solvent. Based on 100 parts by weight of the acid-labile polymer, the photoacid generator is about 1 to about 30 parts by weight, and the organic base is about 0.1 to about 5 parts by weight. The solvent is about 50 to about 90 wt % based on the total weight of the composition.

Abstract: A photosensitive resin composition is disclosed. The disclosed photosensitive resin composition includes an acryl-based copolymer formed by copolymerizing i) unsaturated carboxylic acid, unsaturated carboxylic acid anhydride, or a mixture thereof, and ii) an olefin-based unsaturated compound or a mixture thereof, a dissolution inhibitor in which a phenolic hydroxyl group is protected by an acid-degradable acetal or ketal group, a photoacid generator, and a solvent.

Abstract: A positive photosensitive siloxane resin composition includes a) a siloxane copolymer obtained by performing hydrolysis and condensation polymerization of i) at least one reactive silane represented by the following Chemical Formula 1 and ii) at least one 4-functional reactive silane represented by the following Chemical Formula 2 under a catalyst, the copolymer having a polystyrene-converted weight average molecular weight Mw of 1,000 to 20,000, b) a 1,2-quinonediazide compound, and c) a solvent, (R1)nSi(R2)4-n ??[Chemical Formula 1] Si(R3)4 ??[Chemical Formula 2] wherein R1s may each independently be any one of an alkyl group having 1 to 10 carbon atoms and an aryl group having 6 to 15 carbon atoms, R2 may be an alkoxy group having 1 to 4 carbon atoms, phenoxy, or acetoxy, Ras may each independently be any one of an alkoxy group having 1 to 4 carbon atoms, phenoxy, or an acetoxy group, and n may be a natural number of 1 to 3.

Abstract: A photosensitive resin composition includes: an acrylic copolymer comprising a polymerization product of a first monomer comprising at least one selected from an unsaturated carboxylic acid and an unsaturated carboxylic acid anhydride, and a second monomer comprising an olefin-based unsaturated compound; a photosensitive component comprising at least one 1,2-quinonediazide-5-sulfonic acid ester compound selected from compounds represented by Chemical Formulae 1 to 4; a coupling agent; and a solvent, wherein a total amount of asymmetric compounds in the photosensitive component is greater than or equal to 45 area percent as determined by high performance liquid chromatography: wherein R1 is a hydroxyl group or a methyl group, and NQD is a 1,2-quinonediazide 5-sulfonyl group.

Abstract: Disclosed are an ink composition for an imprint lithography and a roll printing, wherein in forming patterns of the LCD device using the imprint lithography and the roll printing, an ink composition with high thermal resistance, consisting of polymer resin and additive both endurable even at a high temperature is used to form fine patterns with constantly maintaining pattern linewidths and line intervals, and wherein the ink composition is endurable even at a high temperature of 90-250° C.

Abstract: A photoresist composition a photoresist composition includes about 0.1 to about 30 parts by weight of a photo-initiator, about 1 to 50 parts by weight of a first acrylate monomer including at least five functional groups, about 1 to 50 parts by weight of a second acrylate monomer including at most four functional groups with respect to about 100 parts by weight of an acryl-copolymer.

Abstract: A photoresist composition includes an acid-labile polymer that is decomposable by reaction with an acid, a photoacid generator, an organic base having a pKa value of 9 or less and a solvent. Based on 100 parts by weight of the acid-labile polymer, the photoacid generator is about 1 to about 30 parts by weight, and the organic base is about 0.1 to about 5 parts by weight. The solvent is about 50 to about 90 wt % based on the total weight of the composition.

Abstract: A thinner composition for a reduced resist coating process includes an alkyl lactate, cyclohexanone, and an alkyl acetate, wherein an alkyl substituent of the alkyl acetate is a C1 to C5 non-ether based alkyl group.

Abstract: A cleaning solution and a method for manufacturing a display device, the cleaning solution including about 2 wt % to about 12 wt % of nitric acid; about 0.5 wt % to about 15 wt % of an organic acid; about 0.1 wt % to about 10 wt % of a salt compound; about 0.01 wt % to about 3 wt % of an inorganic salt that includes fluorine; and a balance of water, all amounts being based on a total weight of the cleaning solution.

Abstract: Disclosed are an ink composition for an imprint lithography and a roll printing, wherein in forming patterns of the LCD device using the imprint lithography and the roll printing, an ink composition with high thermal resistance, consisting of polymer resin and additive both endurable even at a high temperature is used to form fine patterns with constantly maintaining pattern linewidths and line intervals, and wherein the ink composition is endurable even at a high temperature of 90-250° C.

Abstract: There are provided a fluorine-containing photocurable resin composition and a method of preparing a mold comprising the same and more particularly, a photocurable resin composition having chemical resistance, mechanical properties and high transmittance, etc. as well as being easily wetted with and released from thermosetting or photocurable resins for pattern formation regardless of additional surface treatment, as opposed to the existing polymer resin materials used for resin molds, and a method of preparing a resin mold using the same.

Abstract: A photosensitive resin composition and a method for forming an organic film on a substrate are provided. Because the photosensitive resin composition for imprinting includes an erythrotol-based monomer or oligomer, an organic film formed by the photosensitive resin composition for imprinting has improved restoring force. Therefore, the photosensitive resin composition is appropriate for imprinting processes.

Abstract: A photosensitive resin composition is disclosed. The disclosed photosensitive resin composition includes an acryl-based copolymer formed by copolymerizing i) unsaturated carboxylic acid, unsaturated carboxylic acid anhydride, or a mixture thereof, and ii) an olefin-based unsaturated compound or a mixture thereof, a dissolution inhibitor in which a phenolic hydroxyl group is protected by an acid-degradable acetal or ketal group, a photoacid generator, and a solvent.

Abstract: A photosensitive resin composition comprises about 10 wt % to about 50 wt % of a solute comprising about 100 parts by weight of an acryl-based copolymer and about 5 to about 100 parts by weight of a 1,2-quinonediazide compound; and a solvent comprising a glycol-based material having a boiling point of greater than about 190° C., wherein the acryl-based copolymer is a copolymer of an unsaturated carbonic acid or an anhydride thereof, an epoxy group-containing unsaturated compound, and an olefin-based unsaturated compound.

Abstract: A photosensitive resin composition includes: an acrylic copolymer comprising a polymerization product of a first monomer comprising at least one selected from an unsaturated carboxylic acid and an unsaturated carboxylic acid anhydride, and a second monomer comprising an olefin-based unsaturated compound; a photosensitive component comprising at least one 1,2-quinonediazide-5-sulfonic acid ester compound selected from compounds represented by Chemical Formulae 1 to 4; a coupling agent; and a solvent, wherein a total amount of asymmetric compounds in the photosensitive component is greater than or equal to 45 area percent as determined by high performance liquid chromatography: wherein R1 is a hydroxyl group or a methyl group, and NQD is a 1,2-quinonediazide 5-sulfonyl group.