Patents by Inventor Byung Woo Kang

Byung Woo Kang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230076042
    Abstract: An embodiment apparatus includes a converter including a plurality of switching elements configured as a bridge circuit connected to an input terminal and having a plurality of bridge arms, wherein a topology of the converter is configured to be switchable to a full-bridge type topology or a half-bridge type topology, and wherein a resonant capacitor is connected to a midpoint between respective ones of the bridge arms, and a controller configured to switch the topology of the converter to the full-bridge type or the half-bridge type by controlling whether the resonant capacitor is activated based on a load current of the converter.
    Type: Application
    Filed: July 11, 2022
    Publication date: March 9, 2023
    Inventors: Dae Woo Lee, Tae Jong Ha, Byung Gu Kang
  • Publication number: 20230066593
    Abstract: A multilayer electronic component include a first non-conductive resin layer, extending between a conductive resin layer and an electrode layer of a first external electrode, and a second non-conductive resin layer extending between a conductive resin layer and an electrode layer of a second external electrode. The first non-conductive layer and the second non-conductive layer may be spaced apart from each other to suppress arc discharge and to improve bending strength.
    Type: Application
    Filed: October 24, 2022
    Publication date: March 2, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Seok YI, Il Ro LEE, Chang Hak CHOI, Bon Seok KOO, Jung Min KIM, Byung Woo KANG, San KYEONG
  • Patent number: 11587941
    Abstract: A method of manufacturing a semiconductor device includes forming a stacked structure including trenches having different depths, forming an insulating layer on the stacked structure to fill the trenches, and forming a plurality of protrusions located corresponding to locations of the trenches by patterning the insulating layer. The method also includes forming insulating patterns filling the trenches, respectively, by planarizing the patterned insulating layer including the plurality of protrusions.
    Type: Grant
    Filed: April 16, 2020
    Date of Patent: February 21, 2023
    Assignee: SK hynix Inc.
    Inventors: Byung Woo Kang, Sae Jun Kwon, Hwal Pyo Kim, Jin Taek Park, Yang Seok Lim, Young Ock Hong
  • Publication number: 20230049848
    Abstract: A camera module includes: a magnet disposed on a lens module; a bearing member disposed in a ball guide portion formed between the lens module and a housing that accommodates the lens module; a coil disposed in the housing to face the magnet; and a yoke member disposed on the housing to interact with the magnet to generate a biased magnetic force.
    Type: Application
    Filed: October 28, 2022
    Publication date: February 16, 2023
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Nam Ki PARK, Soo Cheol LIM, Byung Woo KANG, Sung Taek OH, Young Bok YOON, Bo Sung SEO, Oh Byoung KWON, Jun Sup SHIN
  • Patent number: 11574920
    Abstract: A semiconductor device includes: a stack structure including a cell region and a contact region; a channel structure penetrating the cell region of the stack structure; trenches penetrating the contact region of the stack structure to different depths; and a stop structure penetrating the contact region of the stack structure, the stop structure being located between the trenches.
    Type: Grant
    Filed: May 11, 2020
    Date of Patent: February 7, 2023
    Assignee: SK hynix Inc.
    Inventors: Byung Woo Kang, Sae Jun Kwon, Seung Min Lee, Hwal Pyo Kim, Jin Taek Park, Seung Woo Han, Young Ock Hong
  • Patent number: 11570345
    Abstract: A camera module includes a housing having a first ball support surface disposed on an inner surface thereof, a driving body movably disposed in the housing and having a second ball support surface disposed on an outer surface thereof, and a plurality of ball bearings disposed between the first ball support surface of the housing and the second ball support surface of the driving body. A distance between the first ball support surface and the second ball support surface along a direction perpendicular to an optical axis direction is different at respective first end portions of the first ball support surface and the second ball support surface in the optical axis direction than at respective second end portions of the first ball support surface and the second ball support surface in the optical axis direction.
    Type: Grant
    Filed: September 7, 2021
    Date of Patent: January 31, 2023
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jae Man Park, Byung Woo Kang, Soo Cheol Lim, Jung Seok Lee, Jae Hyuk Lee, Byung Gi An, Yoo Chang Kim, Sung Hoon Kim
  • Patent number: 11562859
    Abstract: A multilayered capacitor includes a shock absorbing layer disposed between an upper layer of a capacitor body and a conductive resin layer of an external electrode and between a lower layer of the capacitor body and the conductive resin layer of the external electrode. A length of the shock absorbing layer is longer than that of the conductive resin layer, thereby improving warpage strength characteristics of the capacitor body.
    Type: Grant
    Filed: October 19, 2021
    Date of Patent: January 24, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Seok Yi, Jung Min Kim, Chang Hak Choi, Bon Seok Koo, Byung Woo Kang, Hae Sol Kang, San Kyeong, Jun Hyeon Kim
  • Publication number: 20220380424
    Abstract: The present invention relates to a human Lefty A protein variant with improved productivity and stability, a fusion protein comprising the protein variant, and a composition for preventing and/or treating neuromuscular disease comprising the protein variant or the fusion protein. According to the present invention, a human Lefty A protein variant and a fusion protein comprising the variant are constructed, which have better stability than naturally occurring human Lefty A protein, and thus are expressed at high levels and produced in high yield in animal cells. In addition, administration of the constructed human Lefty A protein variant or fusion protein can restore the nerve and motor functions of nerve disease model animals. Accordingly, the use of the human Lefty A protein variant or fusion protein can effectively prevent or treat various nerve diseases and muscle diseases.
    Type: Application
    Filed: December 17, 2019
    Publication date: December 1, 2022
    Inventors: Sun-Young JEONG, Kyoung Woo LEE, Seung Kee MOON, Sung Jun KANG, Byung-OK CHOI, Geon KWAK, Jong Wook CHANG, Jong Hyun KIM
  • Patent number: 11513308
    Abstract: A camera module includes: a magnet disposed on a lens module; a bearing member disposed in a ball guide portion formed between the lens module and a housing that accommodates the lens module; a coil disposed in the housing to face the magnet; and a yoke member disposed on the housing to interact with the magnet to generate a biased magnetic force.
    Type: Grant
    Filed: March 19, 2020
    Date of Patent: November 29, 2022
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Nam Ki Park, Soo Cheol Lim, Byung Woo Kang, Sung Taek Oh, Young Bok Yoon, Bo Sung Seo, Oh Byoung Kwon, Jun Sup Shin
  • Patent number: 11508522
    Abstract: A multilayer electronic component include a first non-conductive resin layer, extending between a conductive resin layer and an electrode layer of a first external electrode, and a second non-conductive resin layer extending between a conductive resin layer and an electrode layer of a second external electrode. The first non-conductive layer and the second non-conductive layer may be spaced apart from each other to suppress arc discharge and to improve bending strength.
    Type: Grant
    Filed: April 24, 2020
    Date of Patent: November 22, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Seok Yi, Il Ro Lee, Chang Hak Choi, Bon Seok Koo, Jung Min Kim, Byung Woo Kang, San Kyeong
  • Publication number: 20220368215
    Abstract: A power conversion system for electrically driven mobility device includes a first energy storage device and a second energy storage device having a voltage output lower than a voltage of the first energy storage device, a relay having one terminal connected to the first energy storage device, a DC link capacitor connected to the other terminal of the relay, a first DC converter provided between the DC link capacitor and the second energy storage device and capable of bidirectional voltage conversion, and a controller configured to control the first DC converter to convert a level of the voltage of the second energy storage device and to apply the voltage having the converted level to the capacitor before switching of the relay from an off state to an on state to charge the DC link capacitor to a preset voltage or higher, and then to switch the relay to the on state.
    Type: Application
    Filed: September 9, 2021
    Publication date: November 17, 2022
    Inventors: Tae Jong Ha, Dae Woo Lee, Byung Gu Kang
  • Patent number: 11489476
    Abstract: A vehicle power conversion apparatus is provided to reduce an overall system size by integrating a motor controller which generates power and a power supply apparatus which converts the power. The vehicle power conversion apparatus includes a driving motor which is connected to an engine and a power converter which selectively converts power in a plurality of modes to generate the power related to an operation of the driving motor. A first battery supplies the power for the conversion or receives the converted power.
    Type: Grant
    Filed: July 27, 2020
    Date of Patent: November 1, 2022
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventors: Tae-Jong Ha, Byung-Gu Kang, Dae-Woo Lee, Youn-Sik Lee
  • Patent number: 11479596
    Abstract: Disclosed are a fusion protein comprising a thyrotropin receptor (TSHR) fragment and the use thereof. More specifically, disclosed are a fusion protein comprising a TSHR fragment comprising an extracellular domain of a wild-type TSHR and having a substitution of an amino acid at specific position and an immunoglobulin Fc region or a carboxy-terminal cap (C-CAP), and the use thereof. The fusion protein has improved pharmaceutical efficacy, in-vivo persistence and protein stability and a pharmaceutical composition containing the fusion protein as an active ingredient is useful as a therapeutic agent or diagnostic reagent for the alleviation of Graves' disease and Graves' ophthalmopathy.
    Type: Grant
    Filed: July 24, 2019
    Date of Patent: October 25, 2022
    Assignees: YUHAN CORPORATION, INDUSTRY-ACADEMIC COOPERATION FOUNDATION, YONSEI UNIVERSITY
    Inventors: Moo Young Song, Taejin Yoon, Jung-Sun Lee, Byung Hyun Choi, In Hwan Lim, Man Sil Park, Jin-Hyoung Lee, Hyoung Sig Seo, Hyeon Woo Kang, Sung Ho Kim, Eun Jig Lee, Jin Sook Yoon, Cheol Ryong Ku
  • Patent number: 11469051
    Abstract: A multilayer capacitor includes a capacitor body including first to six surfaces, and including a dielectric layer, first and second internal electrodes, and first and second external electrodes. The first and second external electrodes include first and second sintered layers, and first and second plating layers, respectively. An insulating layer is disposed on the capacitor body, to cover an end portion of a first band portion of the first sintered layer and an end portion of a second band portion of the second sintered layer, and has a maximum thickness of 10 ?m or more. A portion of the first band portion of the first sintered layer is exposed from the insulating layer. A portion of the second band portion of the second sintered layer is exposed from the insulating layer.
    Type: Grant
    Filed: April 16, 2021
    Date of Patent: October 11, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ji Hye Han, Jung Min Kim, Jae Seok Yi, Hye Jin Park, Byung Woo Kang, Jeong Ryeol Kim, Bon Seok Koo, Il Ro Lee
  • Patent number: 11423238
    Abstract: Provided are sentence embedding method and apparatus based on subword embedding and skip-thoughts. To integrate skip-thought sentence embedding learning methodology with a subword embedding technique, a skip-thought sentence embedding learning method based on subword embedding and methodology for simultaneously learning subword embedding learning and skip-thought sentence embedding learning, that is, multitask learning methodology, are provided as methodology for applying intra-sentence contextual information to subword embedding in the case of subword embedding learning. This makes it possible to apply a sentence embedding approach to agglutinative languages such as Korean in a bag-of-words form. Also, skip-thought sentence embedding learning methodology is integrated with a subword embedding technique such that intra-sentence contextual information can be used in the case of subword embedding learning.
    Type: Grant
    Filed: November 1, 2019
    Date of Patent: August 23, 2022
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Eui Sok Chung, Hyun Woo Kim, Hwa Jeon Song, Ho Young Jung, Byung Ok Kang, Jeon Gue Park, Yoo Rhee Oh, Yun Keun Lee
  • Publication number: 20220262571
    Abstract: A multilayer electronic component has a body and a non-conductive resin layer. The non-conductive resin layer includes a body cover portion disposed in a region of an external surface of the body in which an electrode layer of an external electrode is not disposed, and an extending portion extending from the body cover portion between the electrode layer and a conductive resin layer of the external electrode, to thereby suppress arc discharge, improve bending strength, and improve moisture resistance.
    Type: Application
    Filed: April 29, 2022
    Publication date: August 18, 2022
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Seok YI, Jung Min KIM, Bon Seok KOO, Chang Hak CHOI, Il Ro LEE, Byung Woo KANG, San KYEONG, Hae Sol KANG
  • Publication number: 20220259045
    Abstract: The present invention relates to a bundle-type carbon nanotube which has a bulk density of 25 to 45 kg/m3, a ratio of the bulk density to a production yield of 1 to 3, and a ratio of a tap density to the bulk density of 1.3 to 2.0, and a method for preparing the same.
    Type: Application
    Filed: May 3, 2022
    Publication date: August 18, 2022
    Inventors: Sung Jin Kim, Jae Keun Yoon, Dong Hyun Cho, Hyun Joon Kang, Byung Yul Choi, Duk Ki Kim, Hyun Woo Park, Hyo Sang You
  • Patent number: 11393630
    Abstract: A multilayer electronic component has a body and a non-conductive resin layer. The non-conductive resin layer includes a body cover portion disposed in a region of an external surface of the body in which an electrode layer of an external electrode is not disposed, and an extending portion extending from the body cover portion between the electrode layer and a conductive resin layer of the external electrode, to thereby suppress arc discharge, improve bending strength, and improve moisture resistance.
    Type: Grant
    Filed: March 30, 2020
    Date of Patent: July 19, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Seok Yi, Jung Min Kim, Bon Seok Koo, Chang Hak Choi, Il Ro Lee, Byung Woo Kang, San Kyeong, Hae Sol Kang
  • Publication number: 20220204347
    Abstract: A graphene nanosheet and a manufacturing method therefor and, more particularly, to a water-dispersible graphene nanosheet and a manufacturing method therefor. The water-dispersible graphene nanosheet of the present invention is characterized in that at least a part of the end portion of a basal plane is sulfated.
    Type: Application
    Filed: April 9, 2020
    Publication date: June 30, 2022
    Inventors: Sung Oong KANG, Si Woo PARK, Byung Kwon JANG
  • Patent number: 11362104
    Abstract: A semiconductor memory device includes a substrate including a peripheral circuit, a stepped dummy stack overlapping the substrate and including a plurality of steps extending in a first direction, a plurality of contact groups passing through the stepped dummy stack, and upper lines respectively connected to the contact groups. The contact groups include a first contact group having two or more first contact plugs arranged in the first direction. The upper lines include a first upper line commonly connected to the first contact plugs.
    Type: Grant
    Filed: June 30, 2020
    Date of Patent: June 14, 2022
    Assignee: SK hynix Inc.
    Inventors: Byung Woo Kang, Min Sung Ko, Gwang Been Kim, Hwal Pyo Kim, Jin Taek Park, Young Ock Hong