Patents by Inventor Byung Woo Kang

Byung Woo Kang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240170219
    Abstract: A multilayer electronic component includes: a body having a dielectric layer and first and second internal electrodes alternately disposed with each other while having the dielectric layer interposed therebetween in a first direction; and an external electrode including a connection portion and a band portion extending from the connection portion onto first and second surfaces of the body, wherein the external electrode further includes an electrode layer connected to one of the first and second internal electrodes, a resin layer in contact with the first and second surfaces, and a conductive resin layer disposed on the electrode layer and extending to the resin layer, and L1??L1 when L1 indicates a second-directional size of the resin layer in the band portion, and L1? indicates a second-directional size of the conductive resin layer in the band portion.
    Type: Application
    Filed: March 9, 2023
    Publication date: May 23, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Byung Woo KANG, Jung Min KIM, Hong Je CHOI, Ji Hye HAN, Hye Jin PARK, Su Yun YUN, Sang Wook LEE
  • Publication number: 20240162824
    Abstract: An embodiment vehicle includes a DC/DC converter having a first power terminal connected to a first electrode of a first battery, a second power terminal connected to a first electrode of a second battery, and a load terminal connected to a first end of an electric load, and including a switching circuit, a transformer, and a rectifier circuit, and a controller configured to set an operation mode of the DC/DC converter to a low-voltage DC/DC converter (LDC) mode or a state-of-charge (SOC) balancing mode, wherein the DC/DC converter is configured to step down a voltage of the first power terminal through the switching circuit, the transformer, and the rectifier circuit and output the voltage to the load terminal when the LDC mode is performed and to control power transfer between the first and second power terminals through the switching circuit when the SOC balancing mode is performed.
    Type: Application
    Filed: April 14, 2023
    Publication date: May 16, 2024
    Inventors: Tae Jong Ha, Jun Young Lee, Dae Woo Lee, Byung Gu Kang
  • Publication number: 20240123827
    Abstract: A high-voltage battery control apparatus includes a plurality of high-voltage battery controllers configured to respectively monitor states of a plurality of high-voltage batteries included in one high-voltage battery pack depending on a predetermined period for monitoring the high-voltage battery pack, wherein the high-voltage battery controllers are configured to transition state of the plurality of high-voltage battery controllers together to an end state when a high-voltage battery controller among the high-voltage battery controllers, which has completed a monitoring operation, first waits until all monitoring operations of the high-voltage battery controllers that have not yet completed monitoring operations are completed and then all the monitoring operations of the high-voltage battery controllers are completed.
    Type: Application
    Filed: April 14, 2023
    Publication date: April 18, 2024
    Inventors: Geon Woo Park, Young Tae Ko, Hyeon Jun Kim, Byung Mo Kang, Jong Seo Yoon
  • Patent number: 11947132
    Abstract: There is provided a camera module including a plurality of ball bearings to support the driving of a lens barrel at the time of compensating for unintended camera movement due to disturbance such as hand shake. The lens barrel may be driven in first and second directions, independently, by one driving force exerted in the first direction perpendicular to an optical axis and by another driving force exerted in the second direction perpendicular to both the optical axis and the first direction, thereby preventing driving displacement from being generated at the time of compensating for unwanted motion such as hand shake while securing reliability against external impact, and having reduced power consumption at the time of compensating for the disturbance.
    Type: Grant
    Filed: November 19, 2021
    Date of Patent: April 2, 2024
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Sung Ryung Park, Oh Byoung Kwon, Soo Cheol Lim, Byung Woo Kang
  • Publication number: 20240105378
    Abstract: A planar transformer and a converter including the same include a first core unit including a first receiving portion extending in a first direction; a second core unit spaced from the first core unit, disposed in parallel with the first core unit in a second direction thereof, and including a second receiving portion extending in the first direction; a first coil unit including a first through hole formed in a center portion thereof and a first coil pattern passing through the first receiving portion and the second receiving portion around the first through hole to form a turn; and a second coil unit including a second through hole formed in a center portion thereof and aligned with the first through hole in a third direction thereof, and a second coil pattern passing through the first receiving portion and the second receiving portion around the second through hole.
    Type: Application
    Filed: January 19, 2023
    Publication date: March 28, 2024
    Applicants: Hyundai Motor Company, Kia Corporation
    Inventors: Dae Woo LEE, Sang Jin KIM, Tae Jong HA, Byung Gu KANG
  • Publication number: 20240094601
    Abstract: A camera module includes a housing, a movable body configured to move in a direction of an optical axis of the housing; a reinforcing member formed integrally on one surface of the movable body, and configured to increase a rigidity of the movable body; and a first buffer member formed in the reinforcing member, and configured to reduce an impactive force between the housing and the movable body.
    Type: Application
    Filed: November 29, 2023
    Publication date: March 21, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Hyuk LEE, Soo Cheol LIM, Byung Woo KANG, Young Bok YOON, Jong Woo HONG, Jung Seok LEE
  • Patent number: 11935703
    Abstract: A multilayer electronic component has a body and a non-conductive resin layer. The non-conductive resin layer includes a body cover portion disposed in a region of an external surface of the body in which an electrode layer of an external electrode is not disposed, and an extending portion extending from the body cover portion between the electrode layer and a conductive resin layer of the external electrode, to thereby suppress arc discharge, improve bending strength, and improve moisture resistance.
    Type: Grant
    Filed: January 9, 2023
    Date of Patent: March 19, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Seok Yi, Jung Min Kim, Bon Seok Koo, Chang Hak Choi, Il Ro Lee, Byung Woo Kang, San Kyeong, Hae Sol Kang
  • Publication number: 20240074965
    Abstract: The present disclosure relates to an ultraviolet light-blocking composition containing a centipede grass extract and a cosmetic composition and, more specifically, to an ultraviolet light-blocking composition comprising a centipede grass (Eremochloa ophiuroides) leaf extract as an active ingredient; and a cosmetic composition containing the ultraviolet light-blocking composition.
    Type: Application
    Filed: January 6, 2022
    Publication date: March 7, 2024
    Applicant: KOREA ATOMIC ENERGY REREARCH INSTITUTE
    Inventors: Byung-Yeoup CHUNG, Hyoung-Woo BAI, Seong-Hee KANG, Sung-Beom LEE, Seung-Sik LEE, Tae-Hoon KIM, Mi-Yeon KIM
  • Patent number: 11874594
    Abstract: A camera module includes a housing, a movable body configured to move in a direction of an optical axis of the housing; a reinforcing member formed integrally on one surface of the movable body, and configured to increase a rigidity of the movable body; and a first buffer member formed in the reinforcing member, and configured to reduce an impactive force between the housing and the movable body.
    Type: Grant
    Filed: October 13, 2020
    Date of Patent: January 16, 2024
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jae Hyuk Lee, Soo Cheol Lim, Byung Woo Kang, Young Bok Yoon, Jong Woo Hong, Jung Seok Lee
  • Patent number: 11823844
    Abstract: A capacitor component includes a body including a dielectric layer and an internal electrode layer; and an external electrode disposed on one surface of the body, wherein the external electrode includes first electrode layers disposed on the one surface of the body to be spaced apart from each other, and covering a region of the one surface of the body through which the internal electrode layer is exposed; a second electrode layer including a base resin and a conductive connection portion disposed in the base resin, and disposed on the one surface of the body to cover the first electrode layers; and an intermetallic compound disposed only between each of the first electrode layers and the second electrode layer.
    Type: Grant
    Filed: January 10, 2022
    Date of Patent: November 21, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jung Min Kim, Hong Je Choi, Ji Hye Han, Byung Woo Kang, Hye Jin Park, Sang Wook Lee, Bon Seok Koo, Jung Won Lee
  • Patent number: 11817267
    Abstract: A multilayer capacitor, includes: a body including a dielectric layer and first and second internal electrode, and a first external electrode and a second external electrode, each disposed an exterior of the body, the first external electrode being connected to the first internal electrode and the second external electrode being connected to the second internal electrode, wherein the first external electrode and the second external electrode include an electrode layer disposed on the body, and including a first intermetallic compound and glass; and a conductive resin layer disposed on the electrode layer, and including a plurality of metal particles and a resin.
    Type: Grant
    Filed: April 4, 2022
    Date of Patent: November 14, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Byung Woo Kang, Bon Seok Koo, Jung Min Kim, Ji Hye Han, Hye Jin Park, Sang Wook Lee, Hong Je Choi
  • Patent number: 11817251
    Abstract: An electronic component includes an internal electrode and an external electrode electrically connected thereto. The external electrode includes a conductive base having a porous structure and a resin filled in voids in the porous structure of the conductive base. The electronic component further includes a connection layer disposed between the internal electrode and the external electrode.
    Type: Grant
    Filed: October 29, 2021
    Date of Patent: November 14, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kun Hoi Koo, Byung Woo Kang, Ji Hye Han, Bon Seok Koo
  • Patent number: 11817269
    Abstract: A multilayer capacitor includes a body including a stack structure in which at least one first internal electrode and at least one second internal electrode are alternately stacked in a first direction with at least one dielectric layer interposed therebetween; and first and second external electrodes spaced apart from each other and disposed on the body, wherein each of the first and second external electrodes includes a conductive resin layer including a resin, a plurality of metal particles, and a conductive connection portion connecting portions of the plurality of metal particles to each other, and in the conductive resin layer, a volume ratio of metal particles spaced apart from the conductive connection portion, among the plurality of metal particles, to a sum of the plurality of metal particles and the conductive connection portion is greater than 0% and less than 4.9%.
    Type: Grant
    Filed: May 18, 2022
    Date of Patent: November 14, 2023
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hong Je Choi, Jung Min Kim, Ji Hye Han, Byung Woo Kang, Hye Jin Park, Sang Wook Lee, Bon Seok Koo, Jung Won Lee
  • Patent number: 11804332
    Abstract: A multilayer electronic component includes: a body including a dielectric layer and a plurality of internal electrodes stacked on each other interposing the dielectric layer therebetween, and external electrodes respectively disposed on the body, wherein the external electrode includes: a first electrode layer connected to the internal electrode; and a second electrode layer disposed on the first electrode layer, and including a conductive portion including an silver (Ag)-tin (Sn) alloy and a resin, and a ratio of an area of the Ag—Sn alloy to an area of the conductive portion satisfies 3 to 50% in at least a portion of a cross-section of the second electrode layer.
    Type: Grant
    Filed: February 4, 2022
    Date of Patent: October 31, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hye Jin Park, Bon Seok Koo, Jung Min Kim, Hong Je Choi, Byung Woo Kang, Ji Hye Han, Sang Wook Lee
  • Patent number: 11798747
    Abstract: A multilayer electronic component include a first non-conductive resin layer, extending between a conductive resin layer and an electrode layer of a first external electrode, and a second non-conductive resin layer extending between a conductive resin layer and an electrode layer of a second external electrode. The first non-conductive layer and the second non-conductive layer may be spaced apart from each other to suppress arc discharge and to improve bending strength.
    Type: Grant
    Filed: October 24, 2022
    Date of Patent: October 24, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Seok Yi, Il Ro Lee, Chang Hak Choi, Bon Seok Koo, Jung Min Kim, Byung Woo Kang, San Kyeong
  • Publication number: 20230290572
    Abstract: A multilayer electronic component includes a body including first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction and including a dielectric layer and internal electrodes alternately disposed with the dielectric layer interposed therebetween in the first direction, and external electrodes disposed on the third and fourth surfaces, wherein the external electrodes include an electrode layer disposed on the body and a conductive resin layer disposed on the electrode layer, and the conductive resin layer includes a conductive metal, an epoxy resin, and an acrylic resin.
    Type: Application
    Filed: May 17, 2023
    Publication date: September 14, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Byung Woo Kang, Bon Seok Koo, Jeong Ryeol Kim, Jung Min Kim, Jae Seok Yi, Ji Hye Han, Hye Jin Park
  • Publication number: 20230217662
    Abstract: A semiconductor device and a method of manufacturing the semiconductor includes a first source layer spaced apart from a substrate and disposed in a memory cell region of the substrate, a second source layer spaced apart from the substrate and disposed in a contact region of the substrate, a cell stacked structure including interlayer insulating layers and conductive patterns alternately stacked on each other over the first source layer, a discharge contact passing through at least a part of the second source layer, and a dielectric layer disposed between the second source layer and the discharge contact.
    Type: Application
    Filed: June 10, 2022
    Publication date: July 6, 2023
    Applicant: SK hynix Inc.
    Inventor: Byung Woo KANG
  • Patent number: 11694844
    Abstract: A multilayer electronic component includes a body including first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction and including a dielectric layer and internal electrodes alternately disposed with the dielectric layer interposed therebetween in the first direction, and external electrodes disposed on the third and fourth surfaces, wherein the external electrodes include an electrode layer disposed on the body and a conductive resin layer disposed on the electrode layer, and the conductive resin layer includes a conductive metal, an epoxy resin, and an acrylic resin.
    Type: Grant
    Filed: May 5, 2021
    Date of Patent: July 4, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Byung Woo Kang, Bon Seok Koo, Jeong Ryeol Kim, Jung Min Kim, Jae Seok Yi, Ji Hye Han, Hye Jin Park
  • Publication number: 20230197344
    Abstract: A multilayer electronic component includes a body including a dielectric layer and a plurality of internal electrodes stacked with the dielectric layer interposed therebetween and external electrodes disposed outside the body, wherein the external electrodes include a first electrode layer connected to the internal electrodes and including a conductive metal, a first resin electrode layer disposed on the first electrode layer and including a first conductive connecting portion including an intermetallic compound and a resin and a second resin electrode layer disposed on the first resin electrode layer and including a plurality of metal particles and a resin.
    Type: Application
    Filed: November 1, 2022
    Publication date: June 22, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ji Hye Han, Jung Min Kim, Hong Je Choi, Byung Woo Kang, Hye Jin Park, Sang Wook Lee, Bon Seok Koo
  • Publication number: 20230170146
    Abstract: A multilayer capacitor includes a body including a stack structure in which at least one first internal electrode and at least one second internal electrode are alternately stacked in a first direction with at least one dielectric layer interposed therebetween; and first and second external electrodes spaced apart from each other and disposed on the body, wherein each of the first and second external electrodes includes a conductive resin layer including a resin, a plurality of metal particles, and a conductive connection portion connecting portions of the plurality of metal particles to each other, and in the conductive resin layer, a volume ratio of metal particles spaced apart from the conductive connection portion, among the plurality of metal particles, to a sum of the plurality of metal particles and the conductive connection portion is greater than 0% and less than 4.9%.
    Type: Application
    Filed: May 18, 2022
    Publication date: June 1, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hong Je Choi, Jung Min Kim, Ji Hye Han, Byung Woo Kang, Hye Jin Park, Sang Wook Lee, Bon Seok Koo, Jung Won Lee