Patents by Inventor Byung-Wook Nam

Byung-Wook Nam has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for manufacturing high flatness silicon wafer
    Publication number: 20080206992
    Abstract: The present invention relates to a method for manufacturing a high flatness silicon wafer comprising (S21) slicing a silicon single crystal ingot to produce a wafer; (S22) chamfering an edge of the wafer sliced from the ingot; (S23) lapping the edge-chamfered wafer; (S24) etching the lapped wafer; (S25) grinding the etched wafer; (S26) slight-etching the ground wafer using an alkali aqueous solution to remove a surface degraded layer generated on the ground wafer; (S27) polishing one or two surfaces of the slight-etched wafer; and (S28) cleaning the polished wafer.
    Type: Application
    Filed: December 27, 2007
    Publication date: August 28, 2008
    Applicant: Siltron Inc.
    Inventor: Byung-Wook Nam