Patents by Inventor Byung Yeol Park

Byung Yeol Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LED package with lead terminals having protrusions of differing widths and method for fabricating the same
    Patent number: 9698319
    Abstract: A light emitting diode (LED) package according to an exemplary embodiment of the present invention includes a base including a first lead terminal and a second lead terminal, an LED chip disposed on the base, a housing disposed on the base, the housing having a cavity in which the LED chip is disposed, and an encapsulation member having a side surface contacting the housing. The first lead terminal and the second lead terminal each have a first surface and a second surface opposite the first surface, and have an unbent form, respectively. The second surface is exposed to the outside of the LED package.
    Type: Grant
    Filed: December 27, 2013
    Date of Patent: July 4, 2017
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Chung Hoon Lee, Yoon Hee Kim, Byung Yeol Park, Bang Hyun Kim, Eun Jung Seo, Hyouk Won Kwon
  • LED PACKAGE AND METHOD FOR FABRICATING THE SAME
    Publication number: 20140306257
    Abstract: A light emitting diode (LED) package according to an exemplary embodiment of the present invention includes a base including a first lead terminal and a second lead terminal, an LED chip disposed on the base, a housing disposed on the base, the housing having a cavity in which the LED chip is disposed, and an encapsulation member having a side surface contacting the housing. The first lead terminal and the second lead terminal each have a first surface and a second surface opposite the first surface, and have an unbent form, respectively. The second surface is exposed to the outside of the LED package.
    Type: Application
    Filed: June 27, 2014
    Publication date: October 16, 2014
    Inventors: Chung Hoon LEE, Yoon Hee KIM, Byung Yeol PARK, Bang Hyun KIM, Eun Jung SEO, Hyouk Won KWON
  • LED PACKAGE AND METHOD FOR FABRICATING THE SAME
    Publication number: 20140110739
    Abstract: A light emitting diode (LED) package according to an exemplary embodiment of the present invention includes a base including a first lead terminal and a second lead terminal, an LED chip disposed on the base, a housing disposed on the base, the housing having a cavity in which the LED chip is disposed, and an encapsulation member having a side surface contacting the housing. The first lead terminal and the second lead terminal each have a first surface and a second surface opposite the first surface, and have an unbent form, respectively. The second surface is exposed to the outside of the LED package.
    Type: Application
    Filed: December 27, 2013
    Publication date: April 24, 2014
    Applicant: Seoul Semiconductor Co., Ltd.
    Inventors: Chung Hoon Lee, Yoon Hee Kim, Byung Yeol Park, Bang Hyun Kim, Eun Jung Seo, Hyouk Won Kwon
  • LED PACKAGE AND METHOD FOR FABRICATING THE SAME
    Publication number: 20110108866
    Abstract: An LED package is disclosed herein. The disclosed LED package comprises a base having an LED chip mounted thereon, an encapsulation member formed by a light-transmittable resin to encapsulate the LED chip, and a housing formed to expose a top portion of the encapsulation member and to encompass a side surface of the encapsulation member, wherein the encapsulation member is formed by a transfer molding process using a mold to have a predetermined shape. Further, the housing may be light-transmittable.
    Type: Application
    Filed: December 2, 2008
    Publication date: May 12, 2011
    Applicant: Seoul Semiconductor Col, Ltd.
    Inventors: Chung Hoon Lee, Yoon Hee Kim, Byung Yeol Park, Bang Hyun Kim, Eun Jung Seo, Hyouk Won Kwon