Patents by Inventor Byunggun CHOI

Byunggun CHOI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250098129
    Abstract: A speaker module includes a speaker housing including a first speaker housing defining at least one first surface of the speaker module and a second speaker housing defining at least one second surface of the speaker module that is opposite to the least one first surface, a speaker assembly including a voice coil and a vibration member, the speaker assembly being accommodated in an interior of the speaker housing, a back volume in an interior of the speaker housing and defined by the first speaker housing and the second speaker housing, and a side surface shield member between an inner surface of the speaker assembly and the back volume, the side surface shield member including a ferrite-based magnetic substance, where at least one vent hole communicating the speaker assembly and the back volume is in the side surface shield member.
    Type: Application
    Filed: December 5, 2024
    Publication date: March 20, 2025
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Sangmin YE, Byunggun CHOI, Kwanhee HAN
  • Patent number: 12248342
    Abstract: An electronic device according to various embodiments of the disclosure includes: a first housing; a second housing configured to be unfolded by a specified angle with respect to the first housing and to rotate about a folding axis; at least one hinge structure including a hinge providing the folding axis and disposed between the first housing and the second housing to rotatably connect the first housing and the second housing; a hinge cover accommodating at least a portion of the hinge structure therein and selectively exposed based on the rotation of the second housing; a first speaker module including a speaker accommodated in the first housing; and a second speaker module including a speaker accommodated in the second housing, wherein in the first state, the first speaker module is configured to discharge sound to the outside of the electronic device via a first area provided in the first housing, a second area provided in the hinge structure and contact with the first area, and a first through-hole exten
    Type: Grant
    Filed: August 16, 2022
    Date of Patent: March 11, 2025
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jihoon Park, Hanbom Park, Byunggun Choi
  • Patent number: 12153855
    Abstract: An electronic device, according to various embodiments, comprises: a connector configured to removably couple with a plug of an external audio device; a data signal line connected to at least one pin of the connector; and a processor, wherein the processor may be configured to identify a connection of the plug of the external audio device; and receive, through the data signal line, an audio signal from a codec connected to an antenna signal receiver in the external audio device. Additional various embodiments can be provided.
    Type: Grant
    Filed: September 21, 2021
    Date of Patent: November 26, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Byunggun Choi, Minseok Lee
  • Patent number: 12096178
    Abstract: In various example embodiments, an electronic device 300 may include: a housing 310 including a first housing 311 facing a first direction, and a second housing 312 facing a second direction opposite to the first direction; a sound module 340 disposed on a surface of the first housing 311 facing the second direction and configured to generate a sound; an acoustic duct 350 formed in the first housing 311 such that the sound module 340 and an outside of the electronic device 300 communicate with each other, and configured to transmit the sound generated by the sound module 340 to the outside of the electronic device 300; and a resonance structure 360 formed in the first housing 311 to communicate with the acoustic duct 350 to tune a resonance characteristic according to a shape of the acoustic duct 350.
    Type: Grant
    Filed: August 3, 2022
    Date of Patent: September 17, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Byunggun Choi, Sangmin Ye, Sangmin Baek, Changi Park
  • Publication number: 20240121333
    Abstract: An electronic device according to an embodiment of the disclosure includes: a microphone, a communication module including a first communication circuit configured to provide a call channel with a first external electronic device and a second communication circuit configured to provide a communication channel with a second external electronic device, a processor electrically connected with the communication module.
    Type: Application
    Filed: September 29, 2023
    Publication date: April 11, 2024
    Inventors: Byunggun CHOI, Younseob SEO
  • Publication number: 20230057510
    Abstract: An electronic device according to various embodiments of the disclosure includes: a first housing; a second housing configured to be unfolded by a specified angle with respect to the first housing and to rotate about a folding axis; at least one hinge structure including a hinge providing the folding axis and disposed between the first housing and the second housing to rotatably connect the first housing and the second housing; a hinge cover accommodating at least a portion of the hinge structure therein and selectively exposed based on the rotation of the second housing; a first speaker module including a speaker accommodated in the first housing; and a second speaker module including a speaker accommodated in the second housing, wherein in the first state, the first speaker module is configured to discharge sound to the outside of the electronic device via a first area provided in the first housing, a second area provided in the hinge structure and contact with the first area, and a first through-hole exten
    Type: Application
    Filed: August 16, 2022
    Publication date: February 23, 2023
    Inventors: Jihoon PARK, Hanbom PARK, Byunggun CHOI
  • Publication number: 20220417650
    Abstract: In various example embodiments, an electronic device 300 may include: a housing 310 including a first housing 311 facing a first direction, and a second housing 312 facing a second direction opposite to the first direction; a sound module 340 disposed on a surface of the first housing 311 facing the second direction and configured to generate a sound; an acoustic duct 350 formed in the first housing 311 such that the sound module 340 and an outside of the electronic device 300 communicate with each other, and configured to transmit the sound generated by the sound module 340 to the outside of the electronic device 300; and a resonance structure 360 formed in the first housing 311 to communicate with the acoustic duct 350 to tune a resonance characteristic according to a shape of the acoustic duct 350.
    Type: Application
    Filed: August 3, 2022
    Publication date: December 29, 2022
    Inventors: Byunggun CHOI, Sangmin YE, Sangmin BAEK, Changi PARK
  • Publication number: 20220329937
    Abstract: According to various embodiments of the disclosure, an electronic device may include a housing, a speaker module disposed inside the housing, a printed circuit board disposed within the housing and including a power transmission line configured to supply power to an electronic component of the electronic device, and a loop line extending from the power transmission line toward the speaker module.
    Type: Application
    Filed: April 7, 2022
    Publication date: October 13, 2022
    Inventors: Kwanhee HAN, Byunggun CHOI, Sangmin YE
  • Publication number: 20220004353
    Abstract: An electronic device, according to various embodiments, comprises: a connector configured to removably couple with a plug of an external audio device; a data signal line connected to at least one pin of the connector; and a processor, wherein the processor may be configured to identify a connection of the plug of the external audio device; and receive, through the data signal line, an audio signal from a codec connected to an antenna signal receiver in the external audio device. Additional various embodiments can be provided.
    Type: Application
    Filed: September 21, 2021
    Publication date: January 6, 2022
    Inventors: Byunggun CHOI, Minseok LEE