Patents by Inventor Byungho CHUN

Byungho CHUN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12327710
    Abstract: An apparatus for manufacturing a semiconductor device includes a chamber including a lower housing and an upper housing, heater chucks in the lower housing, shower heads on the heater chucks, the shower heads being between the lower housing and the upper housing, power supplies connected to the shower heads to provide radio-frequency powers to the shower heads, power straps in the upper housing to connect the shower heads to the power supplies, and shielding members in the upper housing, the shielding members enclosing the power straps and the shower heads, respectively, the shielding members to prevent electromagnetic interference of the radio-frequency powers between the power straps and between the shower heads.
    Type: Grant
    Filed: May 31, 2024
    Date of Patent: June 10, 2025
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jiye Kim, In Cheol Cheol Song, Woongpil Jeon, Daihong Kim, Jaebeom Park, Byungho Chun
  • Publication number: 20240321557
    Abstract: An apparatus for manufacturing a semiconductor device includes a chamber including a lower housing and an upper housing, heater chucks in the lower housing, shower heads on the heater chucks, the shower heads being between the lower housing and the upper housing, power supplies connected to the shower heads to provide radio-frequency powers to the shower heads, power straps in the upper housing to connect the shower heads to the power supplies, and shielding members in the upper housing, the shielding members enclosing the power straps and the shower heads, respectively, the shielding members to prevent electromagnetic interference of the radio-frequency powers between the power straps and between the shower heads.
    Type: Application
    Filed: May 31, 2024
    Publication date: September 26, 2024
    Inventors: Jiye KIM, In Cheol Cheol SONG, Woongpil JEON, Daihong KIM, Jaebeom PARK, Byungho CHUN
  • Patent number: 12074011
    Abstract: An apparatus for manufacturing a semiconductor device includes a chamber including a lower housing and an upper housing, heater chucks in the lower housing, shower heads on the heater chucks, the shower heads being between the lower housing and the upper housing, power supplies connected to the shower heads to provide radio-frequency powers to the shower heads, power straps in the upper housing to connect the shower heads to the power supplies, and shielding members in the upper housing, the shielding members enclosing the power straps and the shower heads, respectively, the shielding members to prevent electromagnetic interference of the radio-frequency powers between the power straps and between the shower heads.
    Type: Grant
    Filed: June 24, 2021
    Date of Patent: August 27, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jiye Kim, In Cheol Song, Woongpil Jeon, Daihong Kim, Jaebeom Park, Byungho Chun
  • Publication number: 20220157566
    Abstract: An apparatus for manufacturing a semiconductor device includes a chamber including a lower housing and an upper housing, heater chucks in the lower housing, shower heads on the heater chucks, the shower heads being between the lower housing and the upper housing, power supplies connected to the shower heads to provide radio-frequency powers to the shower heads, power straps in the upper housing to connect the shower heads to the power supplies, and shielding members in the upper housing, the shielding members enclosing the power straps and the shower heads, respectively, the shielding members to prevent electromagnetic interference of the radio-frequency powers between the power straps and between the shower heads.
    Type: Application
    Filed: June 24, 2021
    Publication date: May 19, 2022
    Inventors: Jiye KIM, In Cheol SONG, Woongpil JEON, Daihong KIM, Jaebeom PARK, Byungho CHUN
  • Patent number: 9780113
    Abstract: A method for fabricating a semiconductor device includes forming a stacked structure on a substrate, forming a first interlayer dielectric covering the stacked structure, and forming a second interlayer dielectric covering the first interlayer dielectric. The stacked structure includes a stepwise shape. The first interlayer dielectric includes at least one step portion having a slope surface connecting a first top surface to a second top surface. The first top surface and the sloped surface define a first angle that is an obtuse angle. A level of the second top surface is higher than a level of the first top surface.
    Type: Grant
    Filed: December 9, 2015
    Date of Patent: October 3, 2017
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jiwoon Im, Kwangchul Park, Jiyoun Seo, Jongmyeong Lee, Kyung-Tae Jang, Byungho Chun, Won-Seok Jung, Jongwan Choi, Tae-Jong Han
  • Publication number: 20160233232
    Abstract: A method for fabricating a semiconductor device includes forming a stacked structure on a substrate, forming a first interlayer dielectric covering the stacked structure, and forming a second interlayer dielectric covering the first interlayer dielectric. The stacked structure includes a stepwise shape. The first interlayer dielectric includes at least one step portion having a slope surface connecting a first top surface to a second top surface. The first top surface and the sloped surface define a first angle that is an obtuse angle. A level of the second top surface is higher than a level of the first top surface.
    Type: Application
    Filed: December 9, 2015
    Publication date: August 11, 2016
    Inventors: Jiwoon IM, Kwangchul PARK, Jiyoun SEO, Jongmyeong LEE, Kyung-Tae JANG, Byungho CHUN, Won-Seok JUNG, Jongwan CHOI, Tae-Jong HAN