Abstract: In the present invention, a nanoporous membrane having a columnar structure is manufactured through a deposition technology used in a semiconductor process, and the size of a nanopore is adjusted by etching the lower surface of the manufactured nanoporous membrane or using a seed layer and a nanobead layer so that scaling up is available at a lowered process temperature and the size of the nanopore can be easily adjusted when manufacturing the nanoporous membrane having a columnar structure.

Abstract: Disclosed is a method for manufacturing 3-dimensional structure using a thin film with a columnar nano pores and a manufacture thereof. A method for packaging an MEMS device or an NEMS device in accordance with an embodiment of the present invention includes: forming a sacrificial layer; forming a thin film having columnar nano pores formed therein by depositing one of a metallic material, an oxide, a nitride and a fluoride on the sacrificial layer; forming a support layer on the thin film and patterning the support layer; removing the sacrificial layer through use of the nano pores of the thin film parts of which are exposed by patterning the support layer; and forming a shielding layer on the thin film and the support layer.

Abstract: In the present invention, a nanoporous membrane having a columnar structure is manufactured through a deposition technology used in a semiconductor process, and the size of a nanopore is adjusted by etching the lower surface of the manufactured nanoporous membrane or using a seed layer and a nanobead layer so that scaling up is available at a lowered process temperature and the size of the nanopore can be easily adjusted when manufacturing the nanoporous membrane having a columnar structure.

Abstract: Disclosed is a method for manufacturing 3-dimensional structure using a thin film with a columnar nano pores and a manufacture thereof. A method for packaging an MEMS device or an NEMS device in accordance with an embodiment of the present invention includes: forming a sacrificial layer; forming a thin film having columnar nano pores formed therein by depositing one of a metallic material, an oxide, a nitride and a fluoride on the sacrificial layer; forming a support layer on the thin film and patterning the support layer; removing the sacrificial layer through use of the nano pores of the thin film parts of which are exposed by patterning the support layer; and forming a shielding layer on the thin film and the support layer.

Abstract: Disclosed are a micro electro mechanical system (MEMS) device and a package thereof. The packaging method of a MEMS device comprises: sequentially forming a sacrificial layer, a support layer, and a block copolymer layer on a substrate on which the MEMS device is formed; self-assembling the block copolymer layer formed on the support layer; selectively etching a part of the self-assembled block copolymer layer to form a plurality of nano-pores; forming a plurality of etching holes in the support layer corresponding to the plurality of nano-pores using the block copolymer layer in which the plurality of nano-pores are formed as a mask; removing the sacrificial layer using the etching holes formed in the support layer; and forming a shielding layer on the support layer.

Abstract: A method for making a BaTiO3-based dielectric having a high dielectric constant and a low dielectric loss wherein, a BaTiO3-based body is subjected to a pre-heat treatment in a hydrogen (H2) atmosphere or a reducing atmosphere containing mixed gas of hydrogen and nitrogen in a ratio of hydrogen:nitrogen=5 to 100%:0 to 95% prior to a sintering process in the manufacture of dielectrics, in order to obtain a reduced average grain size of BaTiO3. By virtue of the reducing average grain size of BaTiO3, a BaTiO3-based dielectric having a high dielectric constant and a low dielectric loss is obtained.