Abstract: An apparatus for treating a substrate includes a process chamber having a treatment space defined therein, a support unit for supporting the substrate in the treatment space, a liquid supply unit for supplying treating liquid to the substrate supported on the support unit, and a heating unit disposed in the support unit for heating the substrate supported on the support unit, wherein the heating unit includes a plurality of lamps to heat the substrate, and a window disposed above the lamps to transmit light emitted from the lamps, wherein the window includes a base in a form of a plate, and light adjustment means formed on the base to spread or converge light emitted from the lamps.

Abstract: An apparatus includes a support unit supporting a substrate including a film, a laser generation unit that generates a laser beam to process the film, a beam splitter that splits the laser beam into a first laser beam travelling along a first path toward an upper edge of the substrate and a second laser beam travelling along a second path toward a lower edge of the substrate, a first beam shaping unit on the first path shaping the first laser beam, a second beam shaping unit on the second path shaping the second laser beam, a first beam scanning unit downstream of the first beam shaping unit that applies the first laser beam to the upper edge in the manner of scanning, and a second beam scanning unit downstream of the second beam shaping unit that applies the second laser beam to the lower edge in the manner of scanning.

Abstract: Provided is a method and apparatus for treating a substrate with a liquid. The substrate treating method comprises a pre-treating step for supplying the treatment liquid containing hydrogen fluoride (HF) to the substrate and treating the substrate before the surface modification step and a surface modification step for supplying an alkene-based chemical onto a substrate to change the surface of the substrate to a hydrophobic state. As a result, the surface of the substrate is uniform, and generation of particles can be reduced when the substrate is removed.

Abstract: A method for processing a substrate includes a liquid treatment step of performing liquid treatment on the substrate by dispensing a treatment liquid onto the rotating substrate and a cleaning step of stopping the dispensing of the treatment liquid and dispensing a cleaning solution onto the substrate. In the cleaning step, a first liquid is dispensed from a first nozzle above the rotating substrate to a point spaced apart from the center of the substrate in a first direction, and a second liquid is dispensed from a second nozzle above the rotating substrate to a point spaced apart from the center of the substrate in a second direction. When viewed from above, the first liquid flows toward the second nozzle after dispensed onto the substrate, and the second liquid flows toward the first nozzle after dispensed onto the substrate.

Abstract: The inventive concept relates to a method for treating a substrate. In an embodiment, a method for etching a substrate having a silicon nitride layer includes etching the silicon nitride layer by dispensing a first treatment liquid having a set temperature and a set concentration onto the substrate heated to a set temperature, in which a second treatment liquid is additionally dispensed for a set period of time in an overlapping manner while the first treatment liquid is dispensed in the silicon nitride layer etching process.

Abstract: The inventive concept provides a support unit for supporting a substrate. The support unit includes a support plate that has an interior space and on which the substrate is placed, a heating member that is provided in the interior space and that heats the substrate placed on the support plate, a heat insulating plate provided in the interior space and disposed under the heating member, a reflective plate provided in the interior space and disposed under the heat insulating plate, and a heat dissipation plate provided in the interior space and disposed under the a reflective plate.

Abstract: An apparatus for treating a substrate includes a process chamber having a treatment space defined therein, a support unit for supporting the substrate in the treatment space, a liquid supply unit for supplying treating liquid to the substrate supported on the support unit, and a heating unit disposed in the support unit for heating the substrate supported on the support unit, wherein the heating unit includes a plurality of lamps to heat the substrate, and a window disposed above the lamps to transmit light emitted from the lamps, wherein the window includes a base in a form of a plate, and light adjustment means formed on the base to spread or converge light emitted from the lamps.

Abstract: An apparatus includes a support unit supporting a substrate including a film, a laser generation unit that generates a laser beam to process the film, a beam splitter that splits the laser beam into a first laser beam travelling along a first path toward an upper edge of the substrate and a second laser beam travelling along a second path toward a lower edge of the substrate, a first beam shaping unit on the first path shaping the first laser beam, a second beam shaping unit on the second path shaping the second laser beam, a first beam scanning unit downstream of the first beam shaping unit that applies the first laser beam to the upper edge in the manner of scanning, and a second beam scanning unit downstream of the second beam shaping unit that applies the second laser beam to the lower edge in the manner of scanning.

Abstract: Disclosed are a standby port and a substrate processing apparatus having the same. The standby port exhausts fumes generated when a processing liquid is discharged into the standby port before the supply of the processing liquid onto a substrate, thereby preventing pollution of a chamber atmosphere.

Abstract: Disclosed are an apparatus and a method for liquid-treating a substrate. The substrate treating apparatus includes a liquid supply unit configured to supply a treatment liquid in which a first liquid and a second liquid are mixed, onto the substrate unit, wherein the liquid supply unit includes a nozzle configured to discharge the treatment liquid, a first liquid supply line supplying the first liquid to the nozzle, and a second liquid supply supplying the second liquid to the nozzle, and the nozzle includes a body having a mixing space in which the first liquid and the second liquid are mixed and a buffer space extending from the mixing space, in the interior thereof, and a collision member located in the buffer space and configured to decrease a flow velocity of the treatment liquid supplied to the buffer space.

Abstract: Disclosed are a dissolved ozone removal unit that removes dissolved ozone from liquid, an apparatus for treating a substrate, a method of removing dissolved ozone, and a method of cleaning a substrate. The method of removing dissolved ozone in liquid includes supplying micro bubbles to the liquid, and allowing dissolved ozone to exit from the liquid by energy or radical ions that are generated while the micro bubbles are dissolved in the liquid.

Abstract: Disclosed are a standby port and a substrate processing apparatus having the same. The standby port exhausts fumes generated when a processing liquid is discharged into the standby port before the supply of the processing liquid onto a substrate, thereby preventing pollution of a chamber atmosphere.

Abstract: Disclosed are a substrate treating apparatus and a substrate treating method. The substrate treating method includes removing a portion of the thin film by irradiating a laser to the substrate, and after the removing of the portion of the thin film, removing the remaining portion of the thin film by supplying a chemical to the substrate.

Abstract: Disclosed are an apparatus and a method for liquid-treating a substrate. The substrate treating apparatus includes a liquid supply unit configured to supply a treatment liquid in which a first liquid and a second liquid are mixed, onto the substrate unit, wherein the liquid supply unit includes a nozzle configured to discharge the treatment liquid, a first liquid supply line supplying the first liquid to the nozzle, and a second liquid supply supplying the second liquid to the nozzle, and the nozzle includes a body having a mixing space in which the first liquid and the second liquid are mixed and a buffer space extending from the mixing space, in the interior thereof, and a collision member located in the buffer space and configured to decrease a flow velocity of the treatment liquid supplied to the buffer space.

Abstract: Provided is a method and apparatus for treating a substrate with a liquid. The substrate treating method comprises a pre-treating step for supplying the treatment liquid containing hydrogen fluoride (HF) to the substrate and treating the substrate before the surface modification step and a surface modification step for supplying an alkene-based chemical onto a substrate to change the surface of the substrate to a hydrophobic state. As a result, the surface of the substrate is uniform, and generation of particles can be reduced when the substrate is removed.

Abstract: Disclosed are a dissolved ozone removal unit that removes dissolved ozone from liquid, an apparatus for treating a substrate, a method of removing dissolved ozone, and a method of cleaning a substrate. The method of removing dissolved ozone in liquid includes supplying micro bubbles to the liquid, and allowing dissolved ozone to exit from the liquid by energy or radical ions that are generated while the micro bubbles are dissolved in the liquid.