Patents by Inventor Byung-Woog Bae

Byung-Woog Bae has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10003125
    Abstract: An electronic device includes a main board, a ground plate, at least one antenna, and at least one cable. The ground plate is disposed on the main board and include at least one cable containing groove containing at least a part of the at least one cable. The at least one antenna is disposed on the ground plate and electrically connected to the ground plate. The at least one cable electrically connects the at least one antenna with the main board and is at least partially disposed in the at least one cable containing groove.
    Type: Grant
    Filed: November 15, 2013
    Date of Patent: June 19, 2018
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Byung-Tae Yoon, Jong-Wook Zeong, Hak-Sul Kim, Seung-Hyeok Na, Byung-Woog Bae, Mi-Hyun Son, Tae-Young Lee, Chang-Rae Jeong
  • Publication number: 20140139393
    Abstract: An electronic device includes a main board, a ground plate, at least one antenna, and at least one cable. The ground plate is disposed on the main board and include at least one cable containing groove containing at least a part of the at least one cable. The at least one antenna is disposed on the ground plate and electrically connected to the ground plate. The at least one cable electrically connects the at least one antenna with the main board and is at least partially disposed in the at least one cable containing groove.
    Type: Application
    Filed: November 15, 2013
    Publication date: May 22, 2014
    Applicant: Samsung Electronics Co., Ltd
    Inventors: Byung-Tae Yoon, Jong-Wook Zeong, Hak-Sul Kim, Seung-Hyeok Na, Byung-Woog Bae, Mi-Hyun Son, Tae-Young Lee, Chang-Rae Jeong
  • Patent number: 7216401
    Abstract: A hinge assembly adapted for a housing having a main body and a sub-body rotatably positioned on the main body, the hinge assembly including: a first hinge portion adapted to rotatably support both lower sides of the sub-body; and a second hinge portion adapted to rotatably support a rear surface of the sub-body with a surface contact and to maintain a rotated angle of the sub-body. The first hinge portion includes: a hinge protrusion arranged on one side surface of the sub-body; a hinge protrusion inserting-hole arranged on one side surface of a sub-body rotational space and adapted to receive the hinge protrusion; a hinge-hole arranged on the other side surface of the sub-body; a through-hole arranged on the other side surface of a sub-body rotational space to correspond to the hinge-hole; and a hinge locker passing through the through-hole and the hinge-hole.
    Type: Grant
    Filed: October 12, 2004
    Date of Patent: May 15, 2007
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Byung-Woog Bae
  • Publication number: 20050078818
    Abstract: A hinge assembly adapted for a housing having a main body and a sub-body rotatably positioned on the main body, the hinge assembly including: a first hinge portion adapted to rotatably support both lower sides of the sub-body; and a second hinge portion adapted to rotatably support a rear surface of the sub-body with a surface contact and to maintain a rotated angle of the sub-body. The first hinge portion includes: a hinge protrusion arranged on one side surface of the sub-body; a hinge protrusion inserting-hole arranged on one side surface of a sub-body rotational space and adapted to receive the hinge protrusion; a hinge-hole arranged on the other side surface of the sub-body; a through-hole arranged on the other side surface of a sub-body rotational space to correspond to the hinge-hole; and a hinge locker passing through the through-hole and the hinge-hole.
    Type: Application
    Filed: October 12, 2004
    Publication date: April 14, 2005
    Inventor: Byung-Woog Bae