Patents by Inventor Byungwook Kim

Byungwook Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11855456
    Abstract: A method of controlling charging of a plurality of batteries and an electronic device to which the same is applied are provided. The electronic device includes a housing, a plurality of batteries arranged in the housing, a power management module that controls the plurality of batteries, a plurality of current limiting ICs that limits a maximum intensity of a current flowing into each of the plurality of batteries, and at least one processor operationally connected to the plurality of batteries, the power management module and the plurality of current limiting ICs. The at least one processor may set a total charging current output from the power management module, set an individual charging current flowing into each of the plurality of batteries in proportion to a total capacity of each of the plurality of batteries, and recalculate the individual charging currents when the total charging current changes.
    Type: Grant
    Filed: January 9, 2020
    Date of Patent: December 26, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Youngmi Ha, Duhyun Kim, Seungbeom Kang, Kyounghoon Kim, Byungwook Kim, Kwanbae Son, Sungjoon Cho, Hansol Choi
  • Publication number: 20230410057
    Abstract: An electronic device includes a display and a processor, and wherein the processor is configured to display a calendar and a text input part within a user interface of a software application for schedule management, identify that a first part and a second part of text included in the text input part represent time information based on a first user input, identify the first part as first time information and identify the second part as second time information, identify a third part of text, which is different from the first part, as first title information of the first schedule and identify a fourth part of text, which is different from the second part, as second title information, and display the first title information and the second title information, in response to a second user input.
    Type: Application
    Filed: March 17, 2023
    Publication date: December 21, 2023
    Inventor: Byungwook KIM
  • Patent number: 11784139
    Abstract: Provided a package substrate including an insulation substrate, a conductive layer provided in the insulation substrate, upper pads provided on an upper surface of the insulation substrate and electrically connected to the conductive layer, lower pads provided on a lower surface of the insulation substrate and electrically connected to the conductive layer, and at least one trench provided at a portion of the insulation substrate adjacent to at least one of the upper pads and configured to block stress, which is generated by an expansion of the insulation substrate, from spreading to the at least one of the upper pads.
    Type: Grant
    Filed: May 23, 2022
    Date of Patent: October 10, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Byungwook Kim, Ayoung Kim, Seongwon Jeong, Sangsu Ha
  • Patent number: 11749630
    Abstract: A semiconductor chip includes a back end of line (BEOL) structure on a first surface of the semiconductor substrate and including a conductive connection structure and an interlayer insulating layer covering the conductive connection structure, a conductive reinforcing layer arranged on the BEOL structure, a cover insulating layer covering the conductive reinforcing layer, an under bump metal (UBM) layer including a plurality of pad connection portions connected to the conductive reinforcing layer through openings in the cover insulating layer, and a plurality of first connection bumps arranged on the plurality of pad connection portions of the UBM layer, electrically connected to one another through the conductive reinforcing layer, and located to overlap the conductive reinforcing layer. The conductive reinforcing layer has a plate shape and extends parallel to the first surface of the semiconductor substrate.
    Type: Grant
    Filed: March 12, 2021
    Date of Patent: September 5, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Byungwook Kim, Ayoung Kim, Haeseong Jeong, Sangsu Ha
  • Publication number: 20230177130
    Abstract: Disclosed is an electronic device including: a first authentication module configured to determine whether a driver corresponds to a valid user of a vehicle, according to an artificial intelligence (AI)-based authentication process, a control module configured to select a low-speed authentication process or a high-speed authentication process based on a speed of the vehicle, based on determining through the AI-based authentication process that the driver does not correspond to the valid user, and a second authentication module configured to determine whether the driver corresponds to the valid user, according to the authentication process selected by the control module, wherein the AI-based authentication process is configured to be performed based on a neural network configured to process sensing data collected by a sensor of at least one of the vehicle or a mobile device of the driver while the driver is using the vehicle.
    Type: Application
    Filed: December 6, 2022
    Publication date: June 8, 2023
    Inventors: Byungwook KIM, Hyunsik KI, Sanghoon LEE, Woong LEE
  • Patent number: 11640950
    Abstract: A semiconductor chip includes; an intermetal dielectric (IMD) layer on a substrate, an uppermost insulation layer on the IMD layer, the uppermost insulation layer having a dielectric constant different from a dielectric constant of the IMD layer, a metal wiring in the IMD layer, the metal wiring including a via contact and a metal pattern, a metal pad in the uppermost insulation layer, the metal pad being electrically connected to the metal wiring, and a bump pad on the metal pad. An interface portion between the IMD layer and the uppermost insulation layer is disposed at a height of a portion between an upper surface and a lower surface of an uppermost metal pattern in the IMD layer.
    Type: Grant
    Filed: March 24, 2021
    Date of Patent: May 2, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Byungwook Kim, Ahram Kang, Seongwon Jeong
  • Publication number: 20230130436
    Abstract: A semiconductor package includes a package substrate having a first surface and a second surface opposite to the first surface, and including a plurality of bonding pads exposed to the first surface and a plurality of solder bumps respectively disposed on the bonding pads, and at least one semiconductor device arranged on the package substrate. Each of the solder bumps includes a bump body disposed on the bonding pad, a plurality of bonding particles provided inside the bump body to be adjacent to the bonding pad, and a first metal compound layer provided to surround the bonding particles and having a protrusion structure for strengthening adhesion with the bonding pad.
    Type: Application
    Filed: May 13, 2022
    Publication date: April 27, 2023
    Inventors: Byungwook Kim, Ayoung Kim, Seongwon Jeong, Sangsu Ha
  • Patent number: 11575280
    Abstract: According to various embodiments, an electronic device comprises a battery, a wireless interface including a coil and configured to wirelessly transmit electric power from the battery via the coil, and at least one processor configured to: perform a wireless charging function of wirelessly transmitting electric power to an external device via the wireless interface, while neither the electronic device nor the external device is being supplied with electric power from an external power source via a wire, and based on identifying that the external device starts being supplied with electric power from an external power source via a wire while performing the wireless charging function, stop performing the wireless charging function of wirelessly transmitting electric power to the external device.
    Type: Grant
    Filed: November 30, 2020
    Date of Patent: February 7, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yusu Kim, Kyoungwon Kim, Kyounghoon Kim, Byungwook Kim, Jeongmin Moon, Kyungmin Park, Jungmin Lee, Juhyang Lee, Kuchul Jung, Sungjoon Cho, Chihyun Cho, Hansol Choi, Youngmi Ha, Yongsang Yun
  • Patent number: 11495986
    Abstract: An electronic device is provided. The electronic device includes a housing, a power interface exposed through at least a portion of the housing to be connected to an external power source in a wired manner or disposed inside the housing to be connected to the external power source in a wireless manner, at least one battery disposed inside the housing and electrically connected to the power interface, a processor disposed inside the housing and operatively connected to the power interface, and a memory disposed inside the housing and operatively connected to the processor.
    Type: Grant
    Filed: January 28, 2020
    Date of Patent: November 8, 2022
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Byungwook Kim, Hyungjun Kwon, Jongkyu Lee, Jaemu Ha
  • Patent number: 11489212
    Abstract: A method of controlling a plurality of batteries and an electronic device to which the same is applied. The electronic device includes a housing and a plurality of batteries. The electronic device also includes a power management module, a plurality of current limiting ICs, and a processor operationally connected to the plurality of batteries, the power management module and the plurality of current limiting ICs. The processor is configured to sense a sum of the currents flowing into the plurality of batteries or a voltage of the power management module, perform a primary end of reducing a magnitude of the sum of the currents flowing into the plurality of batteries, sense the currents or voltages of the plurality of batteries, and perform a secondary end of blocking a current flowing into a battery.
    Type: Grant
    Filed: January 20, 2020
    Date of Patent: November 1, 2022
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Youngmi Ha, Sungjoon Cho, Seungbeom Kang, Kyounghoon Kim, Duhyun Kim, Byungwook Kim, Jaeho Song, Dongik Sin, Hansol Choi
  • Publication number: 20220285290
    Abstract: Provided a package substrate including an insulation substrate, a conductive layer provided in the insulation substrate, upper pads provided on an upper surface of the insulation substrate and electrically connected to the conductive layer, lower pads provided on a lower surface of the insulation substrate and electrically connected to the conductive layer, and at least one trench provided at a portion of the insulation substrate adjacent to at least one of the upper pads and configured to block stress, which is generated by an expansion of the insulation substrate, from spreading to the at least one of the upper pads.
    Type: Application
    Filed: May 23, 2022
    Publication date: September 8, 2022
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Byungwook KIM, Ayoung KIM, Seongwon JEONG, Sangsu HA
  • Patent number: 11437839
    Abstract: An electronic device is provided. The electronic device includes a housing, a first battery and a second battery arranged in the housing, a power management module, a first temperature sensor, a second temperature sensor, a first current limiting integrated circuit (IC) configured to limit a maximum intensity of a first current flowing into the first battery, a second current limiting IC configured to limit a maximum intensity of a second current flowing into the second battery, and a processor. The processor may determine whether the first temperature or the second temperature is outside a specified temperature range and, when the first temperature is outside of the specified temperature range, control the first current limiting IC to reduce a magnitude of the first current.
    Type: Grant
    Filed: December 9, 2019
    Date of Patent: September 6, 2022
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Youngmi Ha, Seungbeom Kang, Kyounghoon Kim, Daeneung Kim, Duhyun Kim, Byungwook Kim, Boeun Lee, Jungmin Lee, Sungjoon Cho, Jaemu Ha
  • Patent number: 11394217
    Abstract: A method and an apparatus for detecting a battery state of an electronic device are provided. The electronic device includes a battery, a charger circuit for charging the battery, a measurement circuit for checking a state of the battery, and a processor configured to charge the battery using the charger circuit, determine whether the charging operation satisfies a preset condition, when the charging operation satisfies the preset condition, obtain first state information of the battery using the measurement circuit, determine an abnormal state of the battery at least based on a difference between the first state information and second state information which is obtained when the preset condition is satisfied before the first state information is acquired, and output notification information regarding the abnormal state.
    Type: Grant
    Filed: December 26, 2017
    Date of Patent: July 19, 2022
    Inventors: Byungwook Kim, Jaemu Ha, Hyunho Park, Ki-Jong Byun, Jongkyu Lee, Jaekyong Choi, Moo-Young Kim
  • Patent number: 11342283
    Abstract: Provided a package substrate including an insulation substrate, a conductive layer provided in the insulation substrate, upper pads provided on an upper surface of the insulation substrate and electrically connected to the conductive layer, lower pads provided on a lower surface of the insulation substrate and electrically connected to the conductive layer, and at least one trench provided at a portion of the insulation substrate adjacent to at least one of the upper pads and configured to block stress, which is generated by an expansion of the insulation substrate, from spreading to the at least one of the upper pads.
    Type: Grant
    Filed: March 5, 2020
    Date of Patent: May 24, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Byungwook Kim, Ayoung Kim, Seongwon Jeong, Sangsu Ha
  • Patent number: 11322993
    Abstract: An electronic device including a battery, a wireless interface operatively or electrically connected with the battery, a display, a memory, and a processor, wherein the processor is configured to: detect an event while the electronic device is in contact with or is connected to another electronic device via the wireless interface and wirelessly charging-shares power of the battery with the another electronic device via the wireless interface; turn off a wireless charging-sharing function when the event corresponds to a predetermined condition; provide a user notification about the turning-off of the wireless charging-sharing function via the display; and turn on the wireless charging-sharing function when a state of the electronic device corresponds to a wireless charging-sharing condition. The various embodiments also a method of operating the electronic device. Various embodiments are also possible.
    Type: Grant
    Filed: January 22, 2020
    Date of Patent: May 3, 2022
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jungmin Lee, Sungjoon Cho, Hansol Choi, Youngmi Ha, Kyounghoon Kim, Byungwook Kim, Yusu Kim, Kyungmin Park, Jaesung Lee, Juhyang Lee
  • Patent number: 11303140
    Abstract: Various embodiments of the disclosure relate to an apparatus and method for preventing overcharging of a battery. In this case, the electronic device includes a battery, at least one processor, and a memory electrically coupled to the at least one processor. The memory may store instructions, when executed, allowing the at least one processor to set a charge safety time corresponding to an external device upon connection with the external power device, charge the battery, based at least in part on power of the external power device, and update the charge safety time, based on a change of at least one of charging current and discharging current of the battery. Other embodiments may also be possible.
    Type: Grant
    Filed: February 21, 2018
    Date of Patent: April 12, 2022
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Youngmi Ha, Jaemu Ha, Hansol Choi, Byungwook Kim, Kwanbae Son, Sungjoon Cho
  • Publication number: 20220077095
    Abstract: A semiconductor chip includes; an intermetal dielectric (IMD) layer on a substrate, an uppermost insulation layer on the IMD layer, the uppermost insulation layer having a dielectric constant different from a dielectric constant of the IMD layer, a metal wiring in the IMD layer, the metal wiring including a via contact and a metal pattern, a metal pad in the uppermost insulation layer, the metal pad being electrically connected to the metal wiring, and a bump pad on the metal pad. An interface portion between the IMD layer and the uppermost insulation layer is disposed at a height of a portion between an upper surface and a lower surface of an uppermost metal pattern in the IMD layer.
    Type: Application
    Filed: March 24, 2021
    Publication date: March 10, 2022
    Inventors: BYUNGWOOK KIM, AHRAM KANG, SEONGWON JEONG
  • Publication number: 20220052005
    Abstract: A semiconductor chip includes a back end of line (BEOL) structure on a first surface of the semiconductor substrate and including a conductive connection structure and an interlayer insulating layer covering the conductive connection structure, a conductive reinforcing layer arranged on the BEOL structure, a cover insulating layer covering the conductive reinforcing layer, an under bump metal (UBM) layer including a plurality of pad connection portions connected to the conductive reinforcing layer through openings in the cover insulating layer, and a plurality of first connection bumps arranged on the plurality of pad connection portions of the UBM layer, electrically connected to one another through the conductive reinforcing layer, and located to overlap the conductive reinforcing layer. The conductive reinforcing layer has a plate shape and extends parallel to the first surface of the semiconductor substrate.
    Type: Application
    Filed: March 12, 2021
    Publication date: February 17, 2022
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Byungwook KIM, Ayoung KIM, Haeseong JEONG, Sangsu HA
  • Patent number: 11218016
    Abstract: An electronic device and method are provided for frequency interference cancellation. The electronic device includes a coil, a wireless power receive circuit, a charging circuit, a display, and a processor. The processor may be configured to perform wireless charging with power wirelessly received from a wireless charger, change, via the charging circuit, a charging current of the electronic device from an initial current level to a first current level, based on the display being switched on during wireless charging, change, via the wireless power receive circuit, a charging voltage of the electronic device from an initial voltage level to a first voltage level, transmit, via the coil, a packet for changing a charging voltage of the wireless charger, change, via the wireless power receive circuit, the charging voltage of the electronic device to a second voltage level upon transmission of the packet, and change the charging current to the initial current level.
    Type: Grant
    Filed: June 30, 2020
    Date of Patent: January 4, 2022
    Inventors: Youngmi Ha, Hansol Choi, Dongzo Kim, Byungwook Kim, Jaeho Song, Dongik Sin, Wooram Lee, Sungjoon Cho
  • Publication number: 20210083515
    Abstract: According to various embodiments, an electronic device comprises a battery, a wireless interface including a coil and configured to wirelessly transmit electric power from the battery via the coil, and at least one processor configured to: perform a wireless charging function of wirelessly transmitting electric power to an external device via the wireless interface, while neither the electronic device nor the external device is being supplied with electric power from an external power source via a wire, and based on identifying that the external device starts being supplied with electric power from an external power source via a wire while performing the wireless charging function, stop performing the wireless charging function of wirelessly transmitting electric power to the external device.
    Type: Application
    Filed: November 30, 2020
    Publication date: March 18, 2021
    Inventors: Yusu KIM, Kyoungwon KIM, Kyounghoon KIM, Byungwook KIM, Jeongmin MOON, Kyungmin PARK, Jungmin LEE, Juhyang LEE, Kuchul JUNG, Sungjoon CHO, Chihyun CHO, Hansol CHOI, Youngmi HA, Yongsang YUN