Patents by Inventor C. Bird

C. Bird has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11057984
    Abstract: A circuit includes a printed circuit board including a first portion defining a window formed as a first void on a first side of the printed circuit board and a second portion defining a cavity formed as a second void opposite the first void on a second side of the printed circuit board. The circuit further includes a heat sink inserted in the second void, the heat sink having a first side forming a bottom of the first void and the bottom of the first void within the printed circuit board. The circuit yet further includes at least one electronic circuit die mounted to the first side of the heat sink and electrically coupled to the first side of the printed circuit board.
    Type: Grant
    Filed: November 26, 2018
    Date of Patent: July 6, 2021
    Assignee: II-VI DELAWARE, INC.
    Inventors: Steven C. Bird, Henry Meyer Daghighian
  • Publication number: 20210060117
    Abstract: Embodiments of the invention generally fall into the category of activated thymulin synthesis and applications thereof. Embodiments, delivered orally or parenterally, are used to treat malignancies and immune system dysfunctions by activating cytotoxic T cells, increasing the generation of T helper 1 cells and/or boosting the production of interleukin 2.
    Type: Application
    Filed: August 14, 2020
    Publication date: March 4, 2021
    Applicant: CYTOLYF THERAPEUTICS LLC
    Inventors: ANAND S. PRASAD, ROY A. VARGHESE, PHILIP C. BIRD, CHARLES CLAYTON
  • Publication number: 20200398289
    Abstract: Presented herein are articles and methods relating to manufactured superhydrophobic, superoleophobic, and/or supermetallophobic surfaces with macro-scale features (macro features) configured to induce controlled asymmetry in a liquid film produced by impinging phase (e.g., impinging droplet(s)) onto the surface, thereby further reducing the contact time between an impinging liquid and the surface.
    Type: Application
    Filed: February 7, 2020
    Publication date: December 24, 2020
    Applicant: Massachusetts Institute of Technology
    Inventors: Rajeev Dhiman, James C. Bird, Hyukmin Kwon, Kripa K. Varanasi
  • Patent number: 10667388
    Abstract: An optical waveguide is disclosed. In a disclosed embodiment, the optical waveguide includes a first aluminum nitride (AlN) thin film disposed on a layer of high-frequency polymer. A second AlN thin film is embedded in the first AlN thin film. In disclosed embodiments, the nitrogen concentration level of the first AlN thin film is different than the concentration level of the second AlN thin film.
    Type: Grant
    Filed: November 4, 2019
    Date of Patent: May 26, 2020
    Assignee: II-VI Delaware Inc.
    Inventors: Henry Meyer Daghighian, Steven C. Bird
  • Publication number: 20200068706
    Abstract: An optical waveguide is disclosed. In a disclosed embodiment, the optical waveguide includes a first aluminum nitride (AlN) thin film disposed on a layer of high-frequency polymer. A second AlN thin film is embedded in the first AlN thin film. In disclosed embodiments, the nitrogen concentration level of the first AlN thin film is different than the concentration level of the second AlN thin film.
    Type: Application
    Filed: November 4, 2019
    Publication date: February 27, 2020
    Inventors: Henry Meyer Daghighian, Steven C. Bird
  • Patent number: 10470302
    Abstract: A printed circuit board may include an aluminum nitride (AIN) substrate that includes an AIN thin film and a layer of high-frequency polymer as a carrier substrate of the AIN thin film. The AIN substrate forms a first layer of the printed circuit board. The AIN substrate comprises a heat spreader that laterally spreads out heat from a heat sink on the printed circuit board to form a thermal dissipation path parallel with a signal path on the printed circuit board. The printed circuit board may include a main substrate aligned to and bonded with the AIN substrate. The main substrate may include one or more additional layers of the printed circuit board.
    Type: Grant
    Filed: April 25, 2016
    Date of Patent: November 5, 2019
    Assignee: Finisar Corporation
    Inventors: Henry Meyer Daghighian, Steven C. Bird
  • Publication number: 20190224695
    Abstract: This invention relates generally to an article that includes a non-wetting surface having a dynamic contact angle of at least about 90°. The surface is patterned with macro-scale features configured to induce controlled asymmetry in a liquid film produced by impingement of a droplet onto the surface, thereby reducing time of contact between the droplet and the surface.
    Type: Application
    Filed: August 16, 2018
    Publication date: July 25, 2019
    Applicant: Massachusetts Institute of Technology
    Inventors: Rajeev Dhiman, James C. Bird, Hyukmin Kwon, Kripa K. Varanasi
  • Publication number: 20190166684
    Abstract: A circuit includes a printed circuit board including a first portion defining a window formed as a first void on a first side of the printed circuit board and a second portion defining a cavity formed as a second void opposite the first void on a second side of the printed circuit board. The circuit further includes a heat sink inserted in the second void, the heat sink having a first side forming a bottom of the first void and the bottom of the first void within the printed circuit board. The circuit yet further includes at least one electronic circuit die mounted to the first side of the heat sink and electrically coupled to the first side of the printed circuit board.
    Type: Application
    Filed: November 26, 2018
    Publication date: May 30, 2019
    Inventors: Steven C. Bird, Henry Meyer Daghighian
  • Publication number: 20190164891
    Abstract: A circuit of tunable differential vias may include a first tunable via circuit configured to couple a first signal of a differential signal pair from a first outer surface of a printed circuit board (PCB) to a second outer surface of the PCB. The circuit may further include a second tunable via circuit configured to couple a second signal of the differential signal pair from the first outer surface of the PCB to the second outer surface of the PCB. The first tunable via circuit may further include a first buried via spatially offset from the second tunable via circuit to cause a predetermined impedance for the first and second signals through the first and second tunable via circuits at an operating frequency.
    Type: Application
    Filed: November 27, 2017
    Publication date: May 30, 2019
    Inventors: Steven C. Bird, Ron Greenlaw, Henry Meyer Daghighian
  • Publication number: 20190118232
    Abstract: Presented herein are articles and methods relating to manufactured superhydrophobic, superoleophobic, and/or supermetallophobic surfaces with macro-scale features (macro features) configured to induce controlled asymmetry in a liquid film produced by impinging phase (e.g., impinging droplet(s)) onto the surface, thereby further reducing the contact time between an impinging liquid and the surface.
    Type: Application
    Filed: May 15, 2018
    Publication date: April 25, 2019
    Applicant: Massachusetts Institute of Technology
    Inventors: Rajeev Dhiman, James C. Bird, Hyukmin Kwon, Kripa K. Varanasi
  • Patent number: 10111343
    Abstract: Some embodiments relate to micro vias in printed circuit boards (PCBs). In an example, a PCB may include a PCB substrate and a micro via. The micro via may extend between opposing surfaces of the PCB substrate and may have a diameter less than or equal to about 100 microns. In another example, a method of forming micro vias in a PCB may include forming a through hole in a PCB substrate of the PCB. The method may also include positioning a pillar that is electrically conductive within the through hole. The method may also include backfilling the through hole around the pillar with an epoxy backfill.
    Type: Grant
    Filed: November 11, 2014
    Date of Patent: October 23, 2018
    Assignee: FINISAR CORPORATION
    Inventors: Henry Meyer Daghighian, Steven C. Bird, YongShan Zhang
  • Publication number: 20170151575
    Abstract: This invention relates generally to an article that includes a non-wetting surface having a dynamic contact angle of at least about 90°. The surface is patterned with macro-scale features configured to induce controlled asymmetry in a liquid film produced by impingement of a droplet onto the surface, thereby reducing time of contact between the droplet and the surface.
    Type: Application
    Filed: July 1, 2016
    Publication date: June 1, 2017
    Applicant: Massachusetts Institute of Technology
    Inventors: Rajeev Dhiman, James C. Bird, Hyukmin Kwon, Kripa K. Varanasi
  • Patent number: 9526185
    Abstract: A hybrid printed circuit board may include a top layer, a bottom layer, and a plurality of internal layers stacked up between the top layer and the bottom layer. The plurality of internal layers may include a first internal layer below the top layer and a second internal layer above the bottom layer. The hybrid printed circuit board may include first unreinforced laminate placed between the top layer and the first internal layer. The hybrid circuit board may additionally include second unreinforced laminate placed between the second internal layer and the bottom layer. The hybrid printed circuit board may include third laminate placed between adjacent internal layers of the plurality of internal layers.
    Type: Grant
    Filed: April 8, 2014
    Date of Patent: December 20, 2016
    Assignee: FINISAR CORPORATION
    Inventors: Henry Meyer Daghighian, Steven C. Bird, Gerald Douglas Babel
  • Publication number: 20160323992
    Abstract: A printed circuit board may include an aluminum nitride (AIN) substrate that includes an AIN thin film and a layer of high-frequency polymer as a carrier substrate of the AIN thin film. The AIN substrate forms a first layer of the printed circuit board. The AIN substrate comprises a heat spreader that laterally spreads out heat from a heat sink on the printed circuit board to form a thermal dissipation path parallel with a signal path on the printed circuit board. The printed circuit board may include a main substrate aligned to and bonded with the AIN substrate. The main substrate may include one or more additional layers of the printed circuit board.
    Type: Application
    Filed: April 25, 2016
    Publication date: November 3, 2016
    Inventors: Henry Meyer Daghighian, Steven C. Bird
  • Publication number: 20160296985
    Abstract: Presented herein are articles and methods relating to manufactured superhydrophobic, superoleophobic, and/or supermetallophobic surfaces with macro-scale features (macro features) configured to induce controlled asymmetry in a liquid film produced by impinging phase (e.g., impinging droplet(s)) onto the surface, thereby further reducing the contact time between an impinging liquid and the surface.
    Type: Application
    Filed: November 18, 2014
    Publication date: October 13, 2016
    Inventors: Rajeev Dhiman, James C. Bird, Hyuk-Min Kwon, Kripa Kiran Varanasi
  • Patent number: 9381528
    Abstract: This invention relates generally to an article that includes a non-wetting surface having a dynamic contact angle of at least about 90°. The surface is patterned with macro-scale features configured to induce controlled asymmetry in a liquid film produced by impingement of a droplet onto the surface, thereby reducing time of contact between the droplet and the surface.
    Type: Grant
    Filed: June 11, 2014
    Date of Patent: July 5, 2016
    Assignee: Massachusetts Institute of Technology
    Inventors: Rajeev Dhiman, James C. Bird, Hyukmin Kwon, Kripa K. Varanasi
  • Patent number: 9326373
    Abstract: A printed circuit board may include an aluminum nitride (AIN) substrate that includes an AIN thin film and a layer of high-frequency polymer as a carrier substrate of the AIN thin film. The AIN substrate forms a first layer of the printed circuit board. The AIN substrate comprises a heat spreader that laterally spreads out heat from a heat sink on the printed circuit board to form a thermal dissipation path parallel with a signal path on the printed circuit board. The printed circuit board may include a main substrate aligned to and bonded with the AIN substrate. The main substrate may include one or more additional layers of the printed circuit board.
    Type: Grant
    Filed: April 7, 2015
    Date of Patent: April 26, 2016
    Assignee: FINISAR CORPORATION
    Inventors: Henry Meyer Daghighian, Steven C. Bird
  • Patent number: 9254496
    Abstract: This invention relates generally to an article that includes a non-wetting surface having a dynamic contact angle of at least about 90°. The surface is patterned with macro-scale features configured to induce controlled asymmetry in a liquid film produced by impingement of a droplet onto the surface, thereby reducing time of contact between the droplet and the surface.
    Type: Grant
    Filed: November 18, 2011
    Date of Patent: February 9, 2016
    Assignee: Massachusetts Institute of Technology
    Inventors: Rajeev Dhiman, James C. Bird, Hyukmin Kwon, Kripa K. Varanasi
  • Publication number: 20150296610
    Abstract: A printed circuit board may include an aluminum nitride (AlN) substrate that includes an AlN thin film and a layer of high-frequency polymer as a carrier substrate of the AlN thin film. The AlN substrate forms a first layer of the printed circuit board. The AlN substrate comprises a heat spreader that laterally spreads out heat from a heat sink on the printed circuit board to form a thermal dissipation path parallel with a signal path on the printed circuit board. The printed circuit board may include a main substrate aligned to and bonded with the AlN substrate. The main substrate may include one or more additional layers of the printed circuit board.
    Type: Application
    Filed: April 7, 2015
    Publication date: October 15, 2015
    Inventors: Henry Meyer Daghighian, Steven C. Bird
  • Publication number: 20150289368
    Abstract: A hybrid printed circuit board is described. The hybrid printed circuit board may include a top layer, a bottom layer, and a plurality of internal layers stacked up between the top layer and the bottom layer. The plurality of internal layers may include a first internal layer below the top layer and a second internal layer above the bottom layer. The hybrid printed circuit board may include first unreinforced laminate placed between the top layer and the first internal layer. The hybrid circuit board may additionally include second unreinforced laminate placed between the second internal layer and the bottom layer. The hybrid printed circuit board may include third laminate placed between adjacent internal layers of the plurality of internal layers.
    Type: Application
    Filed: April 8, 2014
    Publication date: October 8, 2015
    Applicant: FINISAR CORPORATION
    Inventors: Henry Meyer Daghighian, Steven C. Bird, Gerald Douglas Babel