Patents by Inventor C.C. Mao

C.C. Mao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bond pad structures and semiconductor devices using the same
    Publication number: 20060244156
    Abstract: Bond pad structures and semiconductor devices using the same. An exemplary semiconductor device comprises a substrate. An intermediate structure is formed over the substrate. A bond pad structure is formed over the intermediate structure. In one exemplary embodiment, the intermediate structure comprises a first metal layer neighboring and supporting the bond pad structure and a plurality of second metal layers underlying the intermediate structure, wherein one of the second metal layers functions as a power line.
    Type: Application
    Filed: April 18, 2005
    Publication date: November 2, 2006
    Inventors: Tao Cheng, Chao-Chun Tu, Min-Chieh Lin, C.C. Mao, Hsiu Chen Peng, D. S. Chou