Patents by Inventor C. Chu

C. Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9750159
    Abstract: Cooling apparatuses and methods of fabricating thereof are provided which facilitate pumped immersion-cooling of an electronic component(s). The cooling apparatus includes an enclosure having a compartment accommodating the electronic component(s), and dielectric fluid within the compartment at least partially immersing the electronic component(s). A liquid-cooled heat sink is associated with the enclosure to cool at least one cooling surface associated with the compartment, and facilitate heat transfer to the heat sink from the electronic component(s) via the dielectric fluid. A pump is disposed external to the compartment and in fluid communication therewith to facilitate pumped dielectric fluid flow through the compartment. The pumped dielectric fluid flow through the compartment enhances heat transfer from the electronic component(s) to the liquid-cooled heat sink via the cooling surface(s).
    Type: Grant
    Filed: August 14, 2015
    Date of Patent: August 29, 2017
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt, Robert E. Simons
  • Patent number: 9711507
    Abstract: A method for forming a semiconductor device includes blocking a first region of a wafer and forming a plurality of fins in a second region of the wafer. A protective conformal mask layer is deposited over the plurality of fins in the second region, the second region is blocked, and a plurality of fins are formed in the first region of the wafer using a variety of wet and/or dry etching procedures. The protective conformal mask layer protects the plurality of fins in the second region from the variety of wet and/or dry etching procedures that are used to form the plurality of fins in the first region.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: July 18, 2017
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Isabel C. Chu, Lawrence A. Clevenger, Leigh Anne H. Clevenger, Mona A. Ebrish, Gauri Karve, Fee Li Lie, Deepika Priyadarshini, Nicole A. Saulnier, Indira P. Seshadri
  • Patent number: 9687943
    Abstract: A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes a membrane associated with the coolant-carrying channel(s). The membrane includes at least one vapor-permeable region, which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s), and at least one orifice coupled to inject coolant onto at least one surface of the coolant-carrying channel(s) intermediate opposite ends of the channel(s).
    Type: Grant
    Filed: June 15, 2016
    Date of Patent: June 27, 2017
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons
  • Patent number: 9686889
    Abstract: A cooled electronic system and cooling method are provided, wherein a field-replaceable bank of electronic components is cooled by an apparatus which includes an enclosure at least partially surrounding and forming a compartment about the electronic components, a fluid disposed within the compartment, and a heat sink associated with the enclosure. The field-replaceable bank extends, in part, through the enclosure to facilitate operative docking of the electronic components into one or more respective receiving sockets of the electronic system. The electronic components of the field-replaceable bank are, at least partially, immersed within the fluid to facilitate immersion-cooling of the components, and the heat sink facilitates rejection of heat from the fluid disposed within the compartment. In one embodiment, multiple thermal conductors project from an inner surface of the enclosure into the compartment to facilitate transfer of heat from the fluid to the heat sink.
    Type: Grant
    Filed: August 17, 2015
    Date of Patent: June 20, 2017
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt, Robert E. Simons
  • Patent number: 9623520
    Abstract: A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes a membrane associated with the coolant-carrying channel(s). The membrane includes at least one vapor-permeable region, which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s), and at least one orifice coupled to inject coolant onto at least one surface of the coolant-carrying channel(s) intermediate opposite ends of the channel(s).
    Type: Grant
    Filed: December 13, 2013
    Date of Patent: April 18, 2017
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons
  • Patent number: 9608292
    Abstract: A lithium-ion battery is provided that has a fast charge and discharge rate capability and low rate of capacity fade during high rate cycling. The battery can exhibit low impedance growth and other properties allowing for its use in hybrid electric vehicle applications and other applications where high power and long battery life are important features.
    Type: Grant
    Filed: December 30, 2013
    Date of Patent: March 28, 2017
    Assignee: A123 Systems LLC
    Inventors: Antoni S. Gozdz, Andrew C. Chu, Ricardo Fulop, Yet-Ming Chiang, Gilbert N. Riley, Jr., Roger Lin
  • Patent number: 9560446
    Abstract: A sound source locator efficiently employs a distributed physical or logical microphone array to determine a location of a source of a sound. In some instances, the sound source locator is deployed in an augmented reality environment. The sound source locator detects sound at a plurality of microphones, generates a signal corresponding to the sound, and causes attributes of signal as generated at the plurality of microphones to be stored in association with the corresponding microphone. The sound source locator uses these stored attributes to identify multiple groups of the plurality of microphones from which delays between the times the signal is generated can be used to compute the location of the source of the sound.
    Type: Grant
    Filed: June 27, 2012
    Date of Patent: January 31, 2017
    Assignee: Amazon Technologies, Inc.
    Inventors: Samuel Henry Chang, Wai C. Chu
  • Patent number: 9537521
    Abstract: A system for and method of removing one or more unwanted inband signals from a received communications signal is described. The inband signal or signals may comprise noise, interference signals, or any other unwanted signals that impact the quality of the underlying communications. A signal attenuator is configured to selectively attenuate the one or more unwanted inband signals to form a modified received signal that includes the desired communication signal and the attenuated inband signals. A signal separator processes the modified received signal to form an estimate of the desired communication signal and an estimate of the inband signals.
    Type: Grant
    Filed: October 18, 2013
    Date of Patent: January 3, 2017
    Assignee: Glowlink Communications Technology, Inc.
    Inventors: Michael L. Downey, Jeffrey C. Chu
  • Patent number: 9509019
    Abstract: Electroactive compositions are disclosed for use in lithium ion battery electrodes. The compositions, such as multifunctional mixed metal olivines, provide an electrochemical cell having a plurality of open circuit voltages at different states of charge. The compositions afford improved state-of-charge monitoring, overcharge protection and/or overdischarge protection for lithium ion batteries.
    Type: Grant
    Filed: May 29, 2012
    Date of Patent: November 29, 2016
    Assignee: A123 Systems LLC
    Inventors: Yet-Ming Chiang, Andrew C. Chu, Young-Il Jang, Nonglak Meethong, Yu-Hua Kao, Gilbert N. Riley, Jr., Anthony E. Pullen, Karen E. Thomas-Alyea
  • Patent number: 9494341
    Abstract: The present invention relates to a highly-available and fault-tolerant solar tracking system and the process required to manage such a system. A fleet of multiple, redundant mobile robots managed by a task coordinator is deployed to track solar panels in a solar farm in alignment with the sun. Each robot has a control unit for engaging with a coupler connected to one or multiple solar panels and adjusting their orientation, as well as communicating with the task coordinator to receive tasks. The task coordinator senses various events such as robot failure/deterioration, as well as various environmental conditions, and sends tasks reconciled with event types. The system is highly-available and fault-tolerant as it remains operational as long as there is one operational robot. The task coordinator assigns tasks to the mobile robots so as to optimize battery life or other factors, such as, e.g., overall maintenance costs across the fleet.
    Type: Grant
    Filed: September 10, 2013
    Date of Patent: November 15, 2016
    Assignee: SolarCity Corporation
    Inventors: Salomon J. Trujillo, Vayardo L. Ruiz, Noe Esparza, Jessica A. Riley, Kevin C. Chu, Wasiq Bokhari
  • Patent number: 9489948
    Abstract: An augmented reality environment allows interaction between virtual and real objects. Multiple microphone arrays of different physical sizes are used to acquire signals for spatial tracking of one or more sound sources within the environment. A first array with a larger size may be used to track an object beyond a threshold distance, while a second array having a size smaller than the first may be used to track the object up to the threshold distance. By selecting different sized arrays, accuracy of the spatial location is improved.
    Type: Grant
    Filed: March 13, 2015
    Date of Patent: November 8, 2016
    Assignee: Amazon Technologies, Inc.
    Inventors: Wai C. Chu, Edward Dietz Crump
  • Patent number: 9470439
    Abstract: Apparatuses and methods are provided for facilitating cooling of an electronic component. The apparatus includes a vapor-compression refrigeration system, which includes an expansion component, an evaporator, a compressor and a condenser coupled in fluid communication. The evaporator is coupled to and cools the electronic component. The apparatus further includes a contaminant separator coupled in fluid communication with the refrigerant flow path. The separator includes a refrigerant cold filter and a thermoelectric array. At least a portion of refrigerant passing through the refrigerant flow path passes through the cold filter, and the thermoelectric array provides cooling to the cold filter to cool refrigerant passing through the filter. By cooling refrigerant passing through the filter, contaminants solidify from the refrigerant, and are deposited in the cold filter.
    Type: Grant
    Filed: October 30, 2013
    Date of Patent: October 18, 2016
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Levi A. Campbell, Richard C. Chu, Evan G. Colgan, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons
  • Patent number: 9474186
    Abstract: A method is provided for dissipating heat from a rack. The method includes: disposing a coolant-cooled heat exchanger within the rack, and providing a coolant control apparatus. The coolant control apparatus includes at least one coolant recirculation conduit coupled in fluid communication between a facility coolant supply and return, wherein the facility coolant supply and return facilitate providing facility coolant to the heat exchanger. The control apparatus further includes a coolant pump(s) associated with the recirculation conduit(s) and a controller which monitors a temperature of facility coolant supplied to the heat exchanger, and redirects facility coolant, via the coolant recirculation conduit(s) and coolant pump(s), from the facility coolant return to the facility coolant supply to, at least in part, ensure that facility coolant supplied to the heat exchanger remains above a dew point temperature.
    Type: Grant
    Filed: December 6, 2012
    Date of Patent: October 18, 2016
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons
  • Publication number: 20160288279
    Abstract: A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes a membrane associated with the coolant-carrying channel(s). The membrane includes at least one vapor-permeable region, which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s), and at least one orifice coupled to inject coolant onto at least one surface of the coolant-carrying channel(s) intermediate opposite ends of the channel(s).
    Type: Application
    Filed: June 15, 2016
    Publication date: October 6, 2016
    Inventors: Levi A. CAMPBELL, Richard C. CHU, Milnes P. DAVID, Michael J. ELLSWORTH, JR., Madhusudan K. IYENGAR, Robert E. SIMONS
  • Patent number: 9446487
    Abstract: A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes a membrane associated with the coolant-carrying channel(s). The membrane includes at least one vapor-permeable region, which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s), and at least one orifice coupled to inject coolant onto at least one surface of the coolant-carrying channel(s) intermediate opposite ends of the channel(s).
    Type: Grant
    Filed: December 13, 2013
    Date of Patent: September 20, 2016
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons
  • Patent number: 9439325
    Abstract: Cooling apparatuses, cooled electronic modules, and methods of fabrication are provided which facilitate heat transfer from one or more electronic components to a coolant. The cooling apparatus includes a coolant-cooled heat sink with a thermally conductive structure having a coolant-carrying compartment including a varying cross-sectional coolant flow area through which coolant flows in a direction substantially parallel to a main heat transfer surface of the structure coupled to the electronic component(s). The coolant-cooled heat sink includes a coolant inlet and a coolant outlet in fluid communication with the coolant-carrying compartment, and the coolant flow area of the coolant-carrying compartment decreases, at least in part, in a direction of coolant flow through the coolant-carrying compartment.
    Type: Grant
    Filed: October 21, 2013
    Date of Patent: September 6, 2016
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt, Robert E. Simons
  • Patent number: 9430996
    Abstract: System and method for identifying tones present in a short segment of digitized music stream, and for reporting simultaneously and quantitatively their respective magnitude and phase in near real time. Also captured are pitch deviations from the nominal tones of a predetermined music scale. The resulting spectral data can be scrolled manually from frame to frame to facilitate detail music evaluation and editing. The apparatus can also operate at real time to display notes being played, or to tone-activate audio-visual music enhancement and display with automatic synchronization.
    Type: Grant
    Filed: June 13, 2013
    Date of Patent: August 30, 2016
    Inventor: David C. Chu
  • Patent number: 9414519
    Abstract: Dehumidifying cooling apparatus and method are provided for an electronics rack. The apparatus includes an air-to-liquid heat exchanger disposed at an air inlet or outlet side of the rack, wherein air flows through the rack from the air inlet to the air outlet side. The heat exchanger is positioned for air passing through the electronics rack to pass across the heat exchanger, and is in fluid communication with a coolant loop for passing coolant therethrough at a temperature below a dew point temperature of the air passing across the heat exchanger so that air passing across the heat exchanger is dehumidified and cooled. A condensate collector, disposed below the heat exchanger, collects liquid condensate from the dehumidifying of air passing through the electronics rack, wherein the heat exchanger includes a plurality of sloped surfaces configured to facilitate drainage of liquid condensate from the heat exchanger to the condensate collector.
    Type: Grant
    Filed: October 25, 2013
    Date of Patent: August 9, 2016
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons
  • Patent number: 9414525
    Abstract: Cooling apparatuses, cooled electronic modules, and methods of fabrication are provided which facilitate heat transfer from one or more electronic components to a coolant. The cooling apparatus includes a coolant-cooled heat sink with a thermally conductive structure having a coolant-carrying compartment including a varying cross-sectional coolant flow area through which coolant flows in a direction substantially parallel to a main heat transfer surface of the structure coupled to the electronic component(s). The coolant-cooled heat sink includes a coolant inlet and a coolant outlet in fluid communication with the coolant-carrying compartment, and the coolant flow area of the coolant-carrying compartment decreases, at least in part, in a direction of coolant flow through the coolant-carrying compartment.
    Type: Grant
    Filed: August 17, 2015
    Date of Patent: August 9, 2016
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt, Robert E. Simons
  • Publication number: 20160226537
    Abstract: A system for and method of removing one or more unwanted inband signals from a received communications signal is described. The inband signal or signals may comprise noise, interference signals, or any other unwanted signals that impact the quality of the underlying communications. A signal attenuator is configured to selectively attenuate the one or more unwanted inband signals to form a modified received signal that includes the desired communication signal and the attenuated inband signals. A signal separator processes the modified received signal to form an estimate of the desired communication signal and an estimate of the inband signals.
    Type: Application
    Filed: October 18, 2013
    Publication date: August 4, 2016
    Applicant: Glowlink Communications Technology, Inc.
    Inventors: Michael L. Downey, Jeffrey C. Chu