Abstract: Electronic devices including a layer of polymeric material and solid semiconductor dies partially embedded in the layer are provided. The dies have first ends projecting away from the first major surface of the layer. The electronic devices can be formed by sinking the first ends of the dies into a major surface of a liner. A flowable polymeric material is filled into the space between the dies and solidified to form the layer of polymeric material. The first ends of the dies are exposed by delaminating the liner from the first ends of the dies. Electrical conductors are provided on the layer to connect the first ends of the dies.

Abstract: A composite article having a conductive layer on at least a portion of a flexible substrate. Electrical connectivity between various portions of the substrate can be obtained through this conductive layer. The conductive layer comprises a conductive surface, and there is a patterned layer on at least a portion of a first region of the conductive surface. The patterned layer comprises a conductive material having a surface roughness, and is in electrical contact with the conductive surface. An overcoat layer is present on at least a portion of the first region, such that the overcoat layer has a thickness less than the surface roughness, such that the conductive layer within the first region is covered by the overcoat layer, and such that at least a portion of the patterned layer substantially protrudes above the overcoat layer.

Abstract: A composite article includes a conductive layer on at least a portion of a flexible substrate, wherein the conductive layer has a conductive surface. A patterned layer of a low surface energy material is on a first region of the conductive surface. An overcoat layer free of conductive particulates is on a first portion of a second region of the conductive surface unoccupied by the patterned layer. A via is in a second portion of the second region of the conductive surface between an edge of the patterned layer of the low surface energy material and the overcoat layer. A conductive material is in the via to provide an electrical connection to the conductive surface.

Abstract: Methods of passivating an adhesive via printing an ink onto a release liner, and adhesive articles or products made by the same are provided. An ink pattern is printed onto a release liner to form a pattern of features. The features are at least partially embedded in an adhesive layer such that when the release liner is peeled from the adhesive layer, the passivation features remain with the layer of adhesive to form selected areas having adjusted adhesive functionality. Articles including the passivated adhesive on a release liner are also disclosed.

Abstract: The system facilitates the transmission of account numbers between transaction account issuers, merchants, and consumers. A transaction account issuer may transmit a portion of an account number to a merchant. A consumer may transmit the remainder of the account number to the merchant. The merchant may combine the portion of the account number received from the transaction account issuer and the remainder received from the consumer. The transaction account issuer may transmit the full account number to the merchant in a usable format. The merchant may transmit an authorization request for a transaction to the transaction account issuer including the full account number.

Abstract: Methods for using a hollow, rotating stencil roll to deposit flowable dry powder particles onto a moving substrate and to attach the particles to the substrate.

Abstract: Processes for automatic registration between a solid circuit die and electrically conductive interconnects, and articles or devices made by the same are provided. The solid circuit die is disposed on a substrate with contact pads aligned with channels on the substrate. Electrically conductive traces are formed by flowing a conductive liquid in the channels toward the contact pads to obtain the automatic registration.

Abstract: Various embodiments disclosed relate to shaped abrasive particles having sharp tips, methods of making the shaped abrasive particles, methods of abrading a substrate with the shaped abrasive particles, and coated abrasive articles including the shaped abrasive particles. The shaped abrasive particle includes a ceramic, has a polygonal cross-sectional shape along a longitudinal axis of the shaped abrasive particle, and at least one tip of the shaped abrasive particle has a radius of curvature of less than or equal to about 19.2 microns.

Abstract: A method for making an electronic assembly includes applying a protective layer including an organosulfur compound to at least a portion of a patterned conductive interconnect circuit, wherein the conductive interconnect circuit overlies at least a portion of a conductive layer on a substrate, and wherein the conductive layer includes nanowires; and engaging an electrical contact of an electronic component with the protective layer to electrically connect the electronic component and the patterned conductive layer.

Abstract: A method of patterning a conductive layer to form transparent electrical conductors that does not require etching is disclosed. The method includes peeling a strippable polymer layer from a substrate coated with the conductive layer to pattern the conductive layer. In some embodiments, a resist matrix material is patterned over the conductive layer to prevent removal of the conductive layer beneath the resist matrix material. In other embodiments, a liner having a pressure sensitive adhesive surface is brought into contact with the patterned strippable polymer material to remove both the patterned strippable polymer material and the conductive layer beneath it.

Abstract: A gas engine lubricating oil composition comprises an oil of lubricating viscosity including at least 90 mass % saturates and no more than 0.03 mass % to sulfur, a metal hydroxybenzoate detergent additive, a dispersant additive, and an aminic or phenolic antioxidant additive, and has a boron concentration, of zero or less than 90 ppm by mass, where boron, if present, is provided at least in part by a boron-containing dispersant additive. The composition exhibits improved lead corrosion properties and no adverse anti-wear properties.

Abstract: A sleeve block includes a frame that is connectable to an object, such as a truss, that is to be moved relative to a stationary support. An axle defining a longitudinal axis and a motor are to the frame. The sleeve block includes a line that has a first end connected to the motor. The line extends downward from the motor around at least a portion of the axle and then extends outwardly of the frame so that at least a portion of the line is operatively connected to the stationary support. The portion of the line between the axle and the stationary support creates a line axis, and the motor is spaced apart from the line axis. Activation of the rotatable output of said motor causes the frame and the object to move relative to the stationary support by retracting or extending the line from the motor.

Abstract: A method of patterning a conductive layer to form transparent electrical conductors that does not require etching is disclosed. The method includes peeling a strippable polymer layer from a substrate coated with the conductive layer to pattern the conductive layer. In some embodiments, a resist matrix material is patterned over the conductive layer to prevent removal of the conductive layer beneath the resist matrix material. In other embodiments, a liner having a pressure sensitive adhesive surface is brought into contact with the patterned strippable polymer material to remove both the patterned strippable polymer material and the conductive layer beneath it.

Abstract: Methods for using a hollow, rotating stencil roll to deposit flowable dry powder particles onto a moving substrate and to attach the particles to the substrate.

Abstract: Methods for using a hollow, rotating stencil roll to deposit flowable dry powder particles onto a moving substrate and to adhesively bond the particles to a pressure-sensitive adhesive surface of the substrate.

Abstract: Variable index light extraction layers that contain a first region with a first material and a second region including a second material are described, where the first region has a lower effective index of refraction than the second region. Optical films and stacks may use the variable index light extraction layers in front lit or back lit display devices and luminaires.

Abstract: A composite article having a conductive layer on at least a portion of a flexible substrate. Electrical connectivity between various portions of the substrate can be obtained through this conductive layer. The conductive layer comprises a conductive surface, and there is a patterned layer on at least a portion of a first region of the conductive surface. The patterned layer comprises a conductive material having a surface roughness, and is in electrical contact with the conductive surface. An overcoat layer is present on at least a portion of the first region, such that the overcoat layer has a thickness less than the surface roughness, such that the conductive layer within the first region is covered by the overcoat layer, and such that at least a portion of the patterned layer substantially protrudes above the overcoat layer.

Abstract: A composite article includes a conductive layer on at least a portion of a flexible substrate, wherein the conductive layer has a conductive surface. A patterned layer of a low surface energy material is on a first region of the conductive surface. An overcoat layer free of conductive particulates is on a first portion of a second region of the conductive surface unoccupied by the patterned layer. A via is in a second portion of the second region of the conductive surface between an edge of the patterned layer of the low surface energy material and the overcoat layer. A conductive material is in the via to provide an electrical connection to the conductive surface.

Abstract: A method for making an electronic assembly includes applying a conductive adhesive to a resist layer overlying a patterned conductive nanowire layer on a substrate and engaging an electrical contact of an electronic component with the conductive adhesive to provide an electrical connection between the electronic component and the conductive nanowire layer.

Abstract: A composite article includes a conductive layer with nanowires on at least a portion of a flexible substrate, wherein the conductive layer has a conductive surface. A patterned layer of a low surface energy material is on a first region of the conductive surface. An overcoat layer free of conductive particulates is on a first portion of a second region of the conductive surface unoccupied by the patterned layer. A via is in a second portion of the second region of the conductive surface between an edge of the patterned layer of the low surface energy material and the overcoat layer. A conductive material is in the via to provide an electrical connection to the conductive surface.