Patents by Inventor C. Garner

C. Garner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • THERMAL INTERFACE APPARATUS, SYSTEMS, AND METHODS
    Publication number: 20070119582
    Abstract: An apparatus and system, as well as fabrication methods therefor, may include a thermal interface material comprised of an array of carbon nanotubes and a buffer layer disposed between the thermal interface material and one of a die or a heat spreader. In some embodiments the carbon nanotubes may be formed above a buffer layer formed above a surface of the head spreader.
    Type: Application
    Filed: January 29, 2007
    Publication date: May 31, 2007
    Inventors: Yuegang Zhang, C. Garner, Andrew Berlin, Valluri Rao, Bryan White, Paul Koning
  • Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat
    Publication number: 20060270135
    Abstract: Processes are described whereby a wafer is manufactured, a die from the wafer, and an electronic assembly including the die. The die has a diamond layer which primarily serves to spread heat from hot spots of an integrated circuit in the die.
    Type: Application
    Filed: July 31, 2006
    Publication date: November 30, 2006
    Inventors: Gregory Chrysler, Abhay Watwe, Sairam Agraharam, Kramadhati Ravi, C. Garner
  • Nano-sized metals and alloys, and methods of assembling packages containing same
    Publication number: 20060068216
    Abstract: A nano-sized metal particle composition includes a first metal that has a particle size of about 20 nanometer or smaller. The nano-sized metal particle can include a second metal that forms a shell about the first metal. A microelectronic package is also disclosed that uses the nano-sized metal particle composition. A method of assembling a microelectronic package is also disclosed. A computing system is also disclosed that includes the nano-sized metal particle composition.
    Type: Application
    Filed: September 30, 2004
    Publication date: March 30, 2006
    Inventors: Fay Hua, C. Garner
  • Thermal intermediate apparatus, systems, and methods
    Publication number: 20050139991
    Abstract: Apparatus and system, as well as fabrication methods therefor, may include a thermal intermediate structure comprised of a plurality of carbon nanotubes some of which have organic moieties attached thereto to tether the nanotubes to at least one of a die and a heat sink. The organic moieties include thiol linkers and amide linkers.
    Type: Application
    Filed: December 30, 2003
    Publication date: June 30, 2005
    Inventors: Bryan White, Paul Koning, Yuegang Zhang, C. Garner
  • Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat
    Publication number: 20050130362
    Abstract: Processes are described whereby a wafer is manufactured, a die from the wafer, and an electronic assembly including the die. The die has a diamond layer which primarily serves to spread heat from hot spots of an integrated circuit in the die.
    Type: Application
    Filed: February 3, 2005
    Publication date: June 16, 2005
    Inventors: Gregory Chrysler, Abhay Watwe, Sairam Agraharam, Kramadhati Ravi, C. Garner